Invention Grant
- Patent Title: Semiconductor light emitting structure and semiconductor package structure
- Patent Title (中): 半导体发光结构和半导体封装结构
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Application No.: US14576207Application Date: 2014-12-19
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Publication No.: US09431579B2Publication Date: 2016-08-30
- Inventor: Chih-Ling Wu , Yi-Ru Huang , Yu-Yun Lo , Jing-En Huang , Shao-Ying Ting
- Applicant: Genesis Photonics Inc.
- Applicant Address: TW Tainan
- Assignee: Genesis Photonics Inc.
- Current Assignee: Genesis Photonics Inc.
- Current Assignee Address: TW Tainan
- Agent Winston Hsu; Scott Margo
- Priority: TW102147564A 20131220
- Main IPC: H01L33/02
- IPC: H01L33/02 ; H01L33/38 ; H01L33/48 ; H01L33/50

Abstract:
A semiconductor light emitting structure includes an epitaxial structure, an N-type electrode pad, a P-type electrode pad and an insulation layer. The N-type electrode pad and the P-type electrode pad are disposed on the epitaxial structure apart, wherein the P-type electrode pad has a first upper surface. The insulation layer is disposed on the epitaxial structure and located between the N-type electrode pad and the P-type electrode pad, wherein the insulation layer has a second upper surface. The first upper surface of the P-type electrode pad and the second upper surface of the insulation layer are coplanar.
Public/Granted literature
- US20150179888A1 SEMICONDUCTOR LIGHT EMITTING STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2015-06-25
Information query
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