Abstract:
액정 표시 장치 및 데이터 매핑 방법이 개시된다. 본 발명에 따른 액정 표시 장치는, 복수 개의 서브 픽셀들을 포함하는 액정 패널, 상기 액정 패널의 소스 라인들을 구동하기 위한 소스 드라이버들, 상기 액정 패널의 게이트 라인들을 구동하기 위한 게이트 드라이버들, 및 현재 화소 데이터와 상기 현재 화소 데이터를 소정 시간 지연시켜 생성한 이전 화소 데이터를 이용하여 콤비네이션 화소 데이터를 생성하고, 상기 생성된 콤비네이션 화소 데이터를 상기 소스 드라이버들로 공급하는 타이밍 컨트롤러를 포함하는 것을 특징으로 한다. 얼터네이트 인버젼, 소스 드라이버, 디-멀티플렉서, 타이밍 컨트롤러
Abstract:
본 발명의 기준 전압 발생기는 출력전압이 온도에 반비례하는 다양한 온도계수를 구현할 수 있으며, 온도계수가 다르더라도 상온에서 동일한 출력전압을 생성할 수 있어 안정적인 전압을 공급할 수 있는 것을 특징으로 한다. 본 발명에 의하면 온도에 따라 반비례하는 출력전압을 생성하는 기준 전압 발생기를 제공하여, TFT-LCD의 게이트 드라이버에 고온에서도 안정적인 전압을 공급할 수 있게 되어 TFT-LCD의 고온에서의 신뢰성을 향상시킬 수 있다.
Abstract:
개시된 습식 전자사진방식 프린터는, 감광벨트를 대전시키는 토핑코로나 주변으로부터 프린터 외부측으로 공기가 이동할 수 있도록 공기의 이동 경로를 이루는 배기가이드와, 배기가이드를 통과하는 공기 중의 불순물을 여과하기 위한 필터와, 배기가이드를 통해 필터 측으로의 공기 흐름을 형성시키는 흡입펌프를 포함하여 구성된다. 이러한 구성에 의하면, 토핑코로나 주변에 생성되는 오존을 제거해냄으로써, 그 오존에 의해 프린터 주변의 환경이 오염되는 것을 방지할 수 있다.
Abstract:
The present invention provides a method of forming a split gate type flash memory. After exposure of a floating gate layer between silicon nitride layers, a conductive layer spacer is formed on a sidewall of the silicon nitride layer pattern. The conductive layer spacer is formed in a floating gate of a later-completed flash memory to form a tip on which tunneling is centralized in an erase operation. That is, the spacer is formed on a sidewall of the silicon nitride layer pattern over the floating gate layer to form the tunneling tip.
Abstract:
PURPOSE: Nonvolatile memory cells having a split gate structure and a fabrication method thereof are provided, which have a spacer type floating gate formed in a trench region and a common source line overlapped with a side wall of the floating gate, and maximize a coupling ratio without regard to a coupling depth of a source region and a thickness of the floating gate. CONSTITUTION: An isolation film confines an active region(57a) by being formed on a region of a semiconductor substrate. A cell trench region(61) is formed on a part of the active region, and has a pair of first side walls parallel with a direction crossing the active region, and a pair of second side walls parallel with the active region and a bottom plane. A pair of insulated floating gates(65a) are formed on the first side walls and are separated each other. A source region is formed on the bottom plane of the cell trench region. A common source line(73) is intervened between the pair of floating gates, and is prolonged along the direction crossing the active region, and is connected to the source region electrically and passes through the inside of the isolation film. A pair of insulated word lines(77) cover the active regions adjacent to each floating gate, and are prolonged to be parallel with the common source line. And drain regions are formed on the active regions adjacent to the word lines and are located on an opposite side to the common source line. And the drain regions are spaced apart from the first side walls.
Abstract:
PURPOSE: A method for fabricating a semiconductor device is provided to minimize a defect caused by a step in a polishing process by forming a conductive layer as a gate electrode and by partially etching the conductive layer in a high-stepped cell region so that the height of the conductive layer is reduced. CONSTITUTION: A gate oxide layer is formed on a semiconductor substrate having a cell region and a peripheral region. Structures whose side surface has a vertical profile are formed on the cell region. A conductive layer is continuously formed on the sidewall and upper surface of the structures, the surface of the cell region and the peripheral region. The first nitride layer pattern(120) is selectively formed only in the peripheral region. The conductive layer formed in the cell region is partially and anisotropically etched to lower the height of the conductive layer in the cell region by using the first nitride layer pattern as a mask. The second nitride layer is continuously formed on the conductive layer in the cell region and on the first nitride layer pattern in the peripheral region. The resultant structure is polished to eliminate the conductive layer formed on the structures in the cell region. The nitride layer left in the cell region and the peripheral region is removed. The conductive layer in the cell region and the peripheral region is patterned to form a gate electrode on both sidewalls of the structures while a gate line is formed in the peripheral region.
Abstract:
PURPOSE: A stack-type flash memory device is provided to decrease the size of a unit cell without any difficulty of a process, by forming a control gate while using a self-align method using an insulated spacer instead of a photolithography process. CONSTITUTION: A source junction(118) is formed in a semiconductor substrate(100). A stack electrode of a stack-type structure composed of a floating gate(104a), an interlayer dielectric(106) and a control gate(108a) is symmetrically disposed on the right and left sides of the source junction, formed on the substrate by interposing the first insulation layer(102). An insulated spacer(114a) is formed on the stack electrode. A source line(120) is formed to be connected to the source junction by interposing the second insulation layer(116) between the stack electrodes. A drain junction(124) is formed in the position of the substrate corresponding to the source junction to partially overlap the stack electrode. The third insulation layer(122) is formed in an exposed surface of the stack electrode including the spacer. An insulation layer is formed on the resultant structure. A contact(128) is formed to be connected to the drain junction, penetrating the insulation layer. A bit line(130) is formed on the insulation layer to be connected to the contact.
Abstract:
개시된 습식 전자사진방식 프린터의 배기장치는, 엔진셀 배기관의 개방부와 같은 방향에 프린터 본체의 외부와 연결되는 연결관의 개방부가 인접 설치되고, 그 필터에는 배기관의 개방부와 연결되는 유입부 및 연결관의 개방부와 연결되는 배출부가 같은 방향에 마련되어서, 필터의 유입부 및 배출부를 배기관과 연결관의 개방부에 동시에 맞춰서 연결할 수 있도록 구성되어 있다. 이와 같은 구성에 의하면, 필터의 교환시 공기 유입부와 배출부의 연결을 각각 풀거나 잠궈야 하는 번거러움을 해소할 수 있어서 매우 간편하게 착탈작업을 수행할 수 있다.
Abstract:
PURPOSE: A split gate type flash memory device is provided to reduce a resistance of a word line and prevent a short-circuit phenomenon between a drain and the word line. CONSTITUTION: The first gate insulating layer and a floating gate are formed on a semiconductor substrate. The first spacer is formed on the semiconductor substrate. The first junction region is overlapped with the first spacer. The second gate insulating layer and a word line are formed on a sidewall of the first spacer. The second spacer is formed on a sidewall of the word line. The first conductive line is contacted with the first spacer. The second junction region is overlapped with the word line and the second spacer. An interlayer dielectric(227) is deposited on the whole surface of the substrate. A contact hole(228) is formed by etching the interlayer dielectric(227). A metallic line(229) is formed by depositing and patterning a metallic layer thereon.