公开(公告)号：US20240118629A1

公开(公告)日：2024-04-11

申请号：US17766585

申请日：2020-10-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Aliasghar KEYVANI JANBAHAN ,  Frans Reinier SPIERING ,  Jochem Sebastiaan WILDENBERG ,  Everhardus Cornelis MOS

IPC: G03F7/00

CPC classification number: G03F7/706839 ,  G03F7/706837 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641

Abstract: A method of processing measurement data relating to a substrate processed by a manufacturing process. The method includes obtaining measurement data relating to a performance parameter for at least a portion of the substrate; and fitting the measurement data to a model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.

公开(公告)号：US20220004108A1

公开(公告)日：2022-01-06

申请号：US17479078

申请日：2021-09-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.

公开(公告)号：US20240152059A1

公开(公告)日：2024-05-09

申请号：US18281519

申请日：2022-03-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Dogacan KARA ,  Erik JENSEN ,  Jochem Sebastiaan WILDENBERG ,  David Frans Simon DECKERS ,  Sila GULER ,  Reinaldo Antonio ASTUDILLO RENGIFO ,  Yasri YUDHISTIRA ,  Gijs HILHORST ,  David Ricardo CAICEDO FERNANDEZ ,  Frans Reinier SPIERING ,  Sinatra Canggih KHO ,  Herman Martin BLOM ,  Sang Uk KIM ,  Hyun-Su KIM

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/70633

Abstract: A method for determining a substrate model for describing a first measurement dataset and a second measurement dataset relating to a performance parameter. The method include obtaining candidate basis functions for a plurality of substrate models. Steps 1 to 4 are performed iteratively for the first measurement dataset and the second measurement dataset until at least one stopping criterion is met so as to determine the substrate model, the steps including: 1. selecting a candidate basis function from the candidate basis functions; 2. updating a substrate model by adding the candidate basis function into this substrate model to obtain an updated substrate model; 3. evaluating the updated substrate model based on the first measurement dataset and/or second measurement dataset; and 4. determining whether to include the basis function within the substrate model based on the evaluation.

公开(公告)号：US20220291593A1

公开(公告)日：2022-09-15

申请号：US17639364

申请日：2020-08-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy WERKMAN ,  Pui Leng LAM ,  Blandine Marie Andree Richit MINGHETTI ,  Vahid BASTANI ,  Mohamadrezh HAJIAHMADI ,  Lydia Marianna VERGAIJ-HUIZER ,  Frans Reinier SPIERING

IPC: G03F7/20 ,  G03F1/42

Abstract: A method for characterizing a patterning process, the method including obtaining a plurality of values of stitching errors made along one or more boundaries between at least two patterned adjacent fields or sub-fields on a substrate; and fitting, using a hardware computer system, a distortion model to the plurality of values to obtain a fingerprint representing deformation of a field or sub-field out of the at least two patterned adjacent fields or sub-fields.

公开(公告)号：US20200233315A1

公开(公告)日：2020-07-23

申请号：US16486859

申请日：2018-02-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.