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    Method for assembly of wafer probe
    1.
    发明专利
    Method for assembly of wafer probe 审中-公开
    WAFER探针组装方法

    公开(公告)号：JP2008122403A

    公开(公告)日：2008-05-29

    申请号：JP2007330626

    申请日：2007-12-21

    Applicant: Cascade Microtech Inc ,  カスケード マイクロテック インコーポレイテッドCascade Microtech,Incorporated

    Inventor： HAYDEN LEONARD ,  MARTIN JOHN ,  ANDREWS MIKE

    IPC: G01R1/073 ,  G01R31/26 ,  G01R1/06 ,  H01L21/66

    CPC classification number: G01R1/06772 ,  G01R1/07342 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208

    Abstract: PROBLEM TO BE SOLVED: To provide a method for an assembly of many contact points type probe which is easy configuration in order to perform a high-frequency test of an integrated circuit or other microelectronics elements. SOLUTION: The probe assembly method includes (a) the process of forming a supporting member 14, (b) the process of preparing one-assembly consisting of a plurality of contact fingers 16 and the supporting members 14 in which the plurality of contact fingers 16 are maintained with a predetermined arrangement with the supporting tab 26 at the non-supporting state by the supporting part 14, (c) the process of attaching the plurality of the contact fingers 16 to the supporting part 14, and (d) the process of removing the supporting tab 26. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于组装许多接触点型探针的方法，其易于构造以执行集成电路或其它微电子元件的高频测试。 解决方案：探针组合方法包括（a）形成支撑构件14的过程，（b）制备由多个接触指16和支撑构件14组成的单组件的过程，其中多个 接触指状物16以预定的布置保持，支撑突片26由支撑部分14处于非支撑状态，（c）将多个接触指16附接到支撑部分14的过程，以及（d） 删除支撑片26的过程。版权所有（C）2008，JPO＆INPIT

    WAFER PROBE
    2.
    发明专利
    WAFER PROBE 审中-公开

    公开(公告)号：JP2002243761A

    公开(公告)日：2002-08-28

    申请号：JP2001369651

    申请日：2001-12-04

    Applicant: CASCADE MICROTECH INC

    Inventor： HAYDEN LEONARD ,  MARTIN JOHN ,  ANDREWS MIKE

    IPC: G01R31/26 ,  G01R1/06 ,  G01R1/073 ,  H01L21/66

    Abstract: PROBLEM TO BE SOLVED: To propose a multi-contact type probe easy to construct, used for high-frequency test of an integrated circuit or other microelectronic elements. SOLUTION: This probe is equipped with a substantially rigid support part and a multitude of contact fingers supported by and extending from the support part. The contact fingers are disposed as an integral assembly, thereby keeping the multitude of contact fingers in a prescribed arrangement when they are mounted on the support body.

    PROBE FOR TESTING A DEVICE UNDER TEST
    5.
    发明申请
    PROBE FOR TESTING A DEVICE UNDER TEST 审中-公开
    用于测试测试中的设备的探测

    公开(公告)号：WO2004107401A3

    公开(公告)日：2005-03-31

    申请号：PCT/US2004012806

    申请日：2004-04-26

    Applicant: CASCADE MICROTECH INC ,  GLEASON K REED ,  LESHER TIM ,  ANDREWS MIKE ,  MARTIN JOHN

    Inventor： GLEASON K REED ,  LESHER TIM ,  ANDREWS MIKE ,  MARTIN JOHN

    IPC: G01R1/067 ,  G01R1/073 ,  G01R31/00

    CPC classification number: G01R1/07342 ,  G01R1/06738 ,  G01R1/06772

    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits at high frequencies include a coaxial cable (40) for supporting and electrically connected to a microstrip probe having a dielectric substrate (88), an elongated conductor (92), a conductive member (90) electrically connected to a ground signal support by a second side of the substrate (88) and wherein the conductive member is under a majority of the length of an elongate conductor located on a first side of the substrate, a conductive path (94) between the first and second side of the substrate (88), and a contact electrically connected to the conductive path for making contact with a device under test.

    Abstract translation: 用于测量高频集成电路的电特性的探针测量系统包括用于支撑并电连接到具有电介质基片（88）的微带探针的同轴电缆（40），细长导体（92），导电部件 90），其由所述基板（88）的第二侧电连接到接地信号支撑件，并且其中所述导电构件位于位于所述基板的第一侧上的细长导体的长度的大部分，导电路径（94） 在基板（88）的第一和第二侧之间，以及电连接到导电路径以便与被测器件接触的触点。

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