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公开(公告)号：DE3570701D1
公开(公告)日：1989-07-06
申请号：DE3570701
申请日：1985-03-07
Applicant: IBM
Inventor： ALPAUGH WARREN ALAN , AMELIO WILLIAM JOSEPH , MARKOVICH VOYA , SAMBUCETTI CARLOS JUAN
Abstract: @ copper is plated onto a dielectric substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content and oxygen content. The process reduces plating void defects and reduces nodule formation.
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公开(公告)号：DE3663151D1
公开(公告)日：1989-06-08
申请号：DE3663151
申请日：1986-02-07
Applicant: IBM
Inventor： AMELIO WILLIAM JOSEPH , JUNG DAE YOUNG , MARKOVICH VOYA , SAMBUCETTI CARLOS JUAN
Abstract: A concentrate of a palladium-tin colloidal catalyst is obtained by dissolving stannous chloride in HCI, diluting the solution with HCI and then further diluting the solution with deionized water to thereby obtain a diluted stannous chloride solution. This solution is cooled to room temperature or below. A palladium chloride solution is obtained by dissolving palladium chloride in HCI which in tum is also cooled to room temperature or below. The palladium chloride solution is gradually added to the stannous chloride solution and mixed at about room temperature in order to obtain a homogeneous solution. The temperature of the solution is then gradually increased to about 105°C to about 110°C and maintained at that temperature for sufficient time to obtain a homogeneous solution of substantially uniform colloidal particles. The solution of colloidal particles is slowly cooled to about room temperature. The palladium-tin colloidal system is produced reproducibly and is applicable in the manufacturing of highly complex circuitry.
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Patent Agency Ranking
公开(公告)号：DE3480857D1
公开(公告)日：1990-02-01
申请号：DE3480857
申请日：1984-10-09
Applicant: IBM
Inventor： AMELIO WILLIAM JOSEPH , LEMON GARY KEVIN , MARKOVICH VOYA , PANASIK THEODORE , SAMBUCETTI CARLOS JUAN , TREVITT DONNA JEAN
Abstract: Multistep process for electroless plating copper onto a non-conductive surface including the steps of 1) laminating a rough copper sheet onto the non-conductive surface; 2) etching away all the copper; 31 conditioning the surface with multifunctional positively charged molecules derived from copolymers of polyacrylamide and functionally active tetraalkylammonium compounds in an diluted inorganic acid; 4) activating the conditioned surface preferably with stannous palladium chloride particles; 5) treating the activated surface with deionized water and diluted HCI; 6) applying a photoresist layer to the surface and selectively exposing and developing the photoresist to produce a mask corresponding to the negative of the desired circuit pattern; and 7) plating copper using successively two baths differing in their oxygen and CN - concentration, where the foregoing steps are interspersed with washing steps.The inventive method is particularly useful to produce copper circuit on substrates of glass, thermoplastics and thermosetting resins, like epoxy cards and boards. If the step 1) is omitted the method is also applicable in reworking substrates having already undergone copper plating and having been rejected due to failures.
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公开(公告)号：DE3775461D1
公开(公告)日：1992-02-06
申请号：DE3775461
申请日：1987-04-03
Applicant: IBM
Inventor： AMELIO WILLIAM JOSEPH , MARKOVICH VOYA , MCCARTHY WILLIAM JOHN , MORING ALLEN FREDERICK , MOSCHAK PETER ANDREW , STROPE DOUGLAS HOWARD
IPC: C08J5/24 , B29B13/02 , B29B13/06 , B29B15/08 , B29C70/06 , B29C71/00 , B29K63/00 , B29K105/06 , B29L9/00 , H05K1/03 , H05K3/00 , H05K3/18 , H05K3/46 , G03F7/26
Abstract: Reinforced synthetic polymer composite is treated by heating at a temperature and for a time sufficient to obtain a moisture content below that for the relative humidity level at which the composite is to be drilled and/or photoresist exposed; and then subjecting it to conditions to increase the moisture content to that for the relative humidity level of the drilling.
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公开(公告)号：DE3681064D1
公开(公告)日：1991-10-02
申请号：DE3681064
申请日：1986-04-30
Applicant: IBM
Abstract: A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.The process is reliable and simple and does not affect the substrate.
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公开(公告)号：DE3770493D1
公开(公告)日：1991-07-11
申请号：DE3770493
申请日：1987-02-27
Applicant: IBM
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