公开(公告)号：DE3463949D1

公开(公告)日：1987-07-02

申请号：DE3463949

申请日：1984-09-21

Applicant: IBM

Inventor： BUPP JAMES R ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS J ,  TISDALE STEPHEN L ,  TREVITT DONNA J

IPC: H05K3/18 ,  C23C18/28 ,  H05K3/38 ,  C23C18/24 ,  C23C18/38

公开(公告)号：DE3770493D1

公开(公告)日：1991-07-11

申请号：DE3770493

申请日：1987-02-27

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  CZARNECKI KENNETH RAYMOND ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS JUAN ,  ZARR RICHARD STUART

IPC: G01N27/26 ,  C23C18/18 ,  G01N27/48 ,  H05K3/18

公开(公告)号：BR8900664A

公开(公告)日：1989-10-10

申请号：BR8900664

申请日：1989-02-15

Applicant: IBM

Inventor： JOHNSON ROBERT WILLIAM ,  LAWRENCE WILLIAM HOWELL ,  LEMON GARY KEVIN ,  MAGNUSON ROY HARVEY ,  MARKOVICH VOYA RISTA ,  PARSONS RALPH ELLIOTT ,  SAMBUCETTI CARLOS JUAN

IPC: C23C18/18 ,  C23C18/28 ,  C23C18/30 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/26

公开(公告)号：DE3480857D1

公开(公告)日：1990-02-01

申请号：DE3480857

申请日：1984-10-09

Applicant: IBM

Inventor： AMELIO WILLIAM JOSEPH ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  PANASIK THEODORE ,  SAMBUCETTI CARLOS JUAN ,  TREVITT DONNA JEAN

IPC: C23C18/16 ,  C23C18/40 ,  C23C18/52 ,  H05K3/18 ,  H05K3/38

Abstract: Multistep process for electroless plating copper onto a non-conductive surface including the steps of 1) laminating a rough copper sheet onto the non-conductive surface; 2) etching away all the copper; 31 conditioning the surface with multifunctional positively charged molecules derived from copolymers of polyacrylamide and functionally active tetraalkylammonium compounds in an diluted inorganic acid; 4) activating the conditioned surface preferably with stannous palladium chloride particles; 5) treating the activated surface with deionized water and diluted HCI; 6) applying a photoresist layer to the surface and selectively exposing and developing the photoresist to produce a mask corresponding to the negative of the desired circuit pattern; and 7) plating copper using successively two baths differing in their oxygen and CN - concentration, where the foregoing steps are interspersed with washing steps.The inventive method is particularly useful to produce copper circuit on substrates of glass, thermoplastics and thermosetting resins, like epoxy cards and boards. If the step 1) is omitted the method is also applicable in reworking substrates having already undergone copper plating and having been rejected due to failures.