公开(公告)号：HK1006241A1

公开(公告)日：1999-02-19

申请号：HK98105469

申请日：1998-06-17

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

公开(公告)号：DE69212552T2

公开(公告)日：1997-02-06

申请号：DE69212552

申请日：1992-09-19

Applicant: IBM

Inventor： CARDEN GARY RICHARD ,  DANOVITCH DAVID HIRSCH ,  FOSTER ERIC MICHAEL ,  VETTER WILLIAM WALTER

IPC: G02B6/42

Abstract: An optoelectronic assembly which provides for enhanced alignment between the internal components thereof. The assembly includes a housing (17) having a base portion (19) and a cover portion (21), the housing including therein a circuitized substrate (27). A pair of optoelectronic devices (31, 33) (transmitter and receiver components) are initially movably (loosely) positioned within the housing. The invention utilizes an alignment member (110) which is secured to the housing while positively engaging the movably positioned devices and precisely align these devices with respect thereto such that these devices are in turn precisely aligned with optic means (e.g., a duplex optical connector) when the optic means is positioned within the alignment member. In one embodiment, the housing is of metallic material while the alignment member is a molded plastic structure. The alignment member may also include shutter means therein for safety purposes.

公开(公告)号：MY125463A

公开(公告)日：2006-08-30

申请号：MYPI9703540

申请日：1997-08-04

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34

Abstract: AN INTERCONNECT SYSTEM THAT HAS LOW ALPHA PARTICLE EMISSION CHARACTERISTICS FOR USE IN AN ELECTRONIC DEVICE INCLUDES A SEMICONDUCTOR CHIP (12) THAT HAS AN UPPER SURFACE AND SPACED APART ELECTRICALLY RESISTIVE BUMPS (26,36) POSITIONED ON CONDUCTIVE REGIONS OF THE UPPER SURFACE, THE ELECTRICALLY RESISTIVE BUMPS ARE MADE OF A COMPOSITE MATERIAL OF A POLYMER AND METAL PARTICLES, AND A SUBSTRATE (10) THAT HAS CONDUCTIVE REGIONS BONDED TO THE ELECTRICALLY RESISTIVE BUMPS IN A BONDING PROCESS WHEREIN THE ELECTRICALLY RESISTIVE BUMPS CONVERT TO ELECTRICALLY CONDUCTIVE BUMPS AFTER THE BONDING PROCESS.(FIG.3)

公开(公告)号：CA2210063A1

公开(公告)日：1999-01-08

申请号：CA2210063

申请日：1997-07-08

Applicant: IBM CANADA

Inventor： ROBERT MICHEL ,  ACHARD LOUIS-MARIE ,  BLAIS CLAUDE ,  GARNEAU JEAN-FRANCOIS ,  DANOVITCH DAVID HIRSCH

IPC: B22F5/00 ,  B22F5/12 ,  B22F9/08 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34 ,  H05K3/10 ,  H05K3/40

Abstract: The disclosed invention provides for a method of manufacturing solder columns fo r particular use in attaching substrates to a printed circuit board. The method re sults in columns of homogeneous composition and thus overcomes problems associated with t he phenomena of segregation. The method includes the steps of forming particles of the metal composition to be used for the columns from a molten source of the composition. The solid particles are then formed into segments of homogeneous composition by drawing in gots of the composition into wire and severing the wire into segments.

公开(公告)号：DE69212552D1

公开(公告)日：1996-09-05

申请号：DE69212552

申请日：1992-09-19

Applicant: IBM

Inventor： CARDEN GARY RICHARD ,  DANOVITCH DAVID HIRSCH ,  FOSTER ERIC MICHAEL ,  VETTER WILLIAM WALTER

IPC: G02B6/42

Abstract: An optoelectronic assembly which provides for enhanced alignment between the internal components thereof. The assembly includes a housing (17) having a base portion (19) and a cover portion (21), the housing including therein a circuitized substrate (27). A pair of optoelectronic devices (31, 33) (transmitter and receiver components) are initially movably (loosely) positioned within the housing. The invention utilizes an alignment member (110) which is secured to the housing while positively engaging the movably positioned devices and precisely align these devices with respect thereto such that these devices are in turn precisely aligned with optic means (e.g., a duplex optical connector) when the optic means is positioned within the alignment member. In one embodiment, the housing is of metallic material while the alignment member is a molded plastic structure. The alignment member may also include shutter means therein for safety purposes.

公开(公告)号：SG72751A1

公开(公告)日：2000-05-23

申请号：SG1997002768

申请日：1997-08-02

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L21/44 ,  H01L21/98

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.