2.
    发明专利
    未知

    公开(公告)号:DE69528446D1

    公开(公告)日:2002-11-07

    申请号:DE69528446

    申请日:1995-12-04

    Applicant: IBM

    Abstract: The projection display comprises two reflective liquid crystal light valves positioned and aligned relative to each other on two adjacent surfaces of a polarizing beam splitter cube. Illumination is introduced through a third face of the cube, and a projection lens images the two light valves through a fourth surface of the polarizing beam splitter cube. Colour-sequential and alternating polarization states are provided by a colour filter wheel or cage containing individual facets of dichroic or colour glass filters, such that as the wheel or cage rotates, the filters change and produce sequential red, green and blue outputs. In addition, the polarization of adjacent colours is alternated by adding a polarizing film onto each colour filter.

    3.
    发明专利
    未知

    公开(公告)号:DE69528446T2

    公开(公告)日:2003-05-15

    申请号:DE69528446

    申请日:1995-12-04

    Applicant: IBM

    Abstract: The projection display comprises two reflective liquid crystal light valves positioned and aligned relative to each other on two adjacent surfaces of a polarizing beam splitter cube. Illumination is introduced through a third face of the cube, and a projection lens images the two light valves through a fourth surface of the polarizing beam splitter cube. Colour-sequential and alternating polarization states are provided by a colour filter wheel or cage containing individual facets of dichroic or colour glass filters, such that as the wheel or cage rotates, the filters change and produce sequential red, green and blue outputs. In addition, the polarization of adjacent colours is alternated by adding a polarizing film onto each colour filter.

    4.
    发明专利
    未知

    公开(公告)号:DE3785322D1

    公开(公告)日:1993-05-13

    申请号:DE3785322

    申请日:1987-12-23

    Applicant: IBM

    Abstract: A multi-layer structure that includes a transparent dielectric substrate, a layer of a nickel-containing steel alloy, and a layer of copper and/or chromium. The structure is used as multi-density photomasks for example. The process for fabricating multi-layer structure, like a multi-density photomask comprises: a) providing a transparent dielectric substrate having a steel layer and a layer of a metal, like of copper, thereon with the layer of said steel is deposited on top of said layer of a metal or vice versa; b) providing a layer of photoresist material on top of the structure provided in step (a); c) exposing and developing said layer of photoresist material; d) selectively etching exposed portion of said metal or said steel; e) selectively etching exposed portion of said metal or said steel not etched in step (d); f) exposing and developing photoresist on the said layer of said metal or said steel etched in step (d); g) selectively etching exposed portion of said metal or said steel of step (f); and h) removing the photoresist. t

    8.
    发明专利
    未知

    公开(公告)号:DE3785322T2

    公开(公告)日:1993-10-28

    申请号:DE3785322

    申请日:1987-12-23

    Applicant: IBM

    Abstract: A multi-layer structure that includes a transparent dielectric substrate, a layer of a nickel-containing steel alloy, and a layer of copper and/or chromium. The structure is used as multi-density photomasks for example. The process for fabricating multi-layer structure, like a multi-density photomask comprises: a) providing a transparent dielectric substrate having a steel layer and a layer of a metal, like of copper, thereon with the layer of said steel is deposited on top of said layer of a metal or vice versa; b) providing a layer of photoresist material on top of the structure provided in step (a); c) exposing and developing said layer of photoresist material; d) selectively etching exposed portion of said metal or said steel; e) selectively etching exposed portion of said metal or said steel not etched in step (d); f) exposing and developing photoresist on the said layer of said metal or said steel etched in step (d); g) selectively etching exposed portion of said metal or said steel of step (f); and h) removing the photoresist. t

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