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    Electron beam circuit pattern generator for tracing microcircuit wire patterns on photoresist overlaid substrates
    1.
    发明授权
    Electron beam circuit pattern generator for tracing microcircuit wire patterns on photoresist overlaid substrates 失效
    电子束电路图形发生器，用于跟踪光电子基片上的微型电路图

    公开(公告)号：US3575588A

    公开(公告)日：1971-04-20

    申请号：US3575588D

    申请日：1968-09-09

    Applicant: IBM

    Inventor： HERMANN KARL ,  WRENNER WARREN R ,  RILEY JOSEPH V

    IPC: G03F7/20 ,  G03B27/42 ,  H05K3/00

    CPC classification number: H05K3/00 ,  H05K3/0082

    Abstract: The tracing of microcircuit wire patterns on photoresist overlaid substrates (circuit boards) by means of an electron beam. Pattern tracing is achieved by controlling the deflection of the beam in conjunction with the oscillatory motion of the substrate mounted on an oscillating stage. A feedback system from a grating on the stage provides synchronized pulses to a clock which in conjunction with the control data derived from a computer, provides control information for a desired circuit pattern.

    Abstract translation: 1,247,453。 电子束照射装置。 国际商业机械有限公司1969年8月26日[1968年9月9日]，第42414/69号。 标题H1D。 在用于在光致抗蚀剂涂覆的电路板上形成布线图案的电子束照射装置中，提供控制装置用于协调光束的电子偏转和电路板的机械运动，使得光束在板上追踪所需的图案。 在图 如图1所示，板2被夹紧到适于通过线性电动机装置（未示出）沿箭头5所示的轴线移动的台架1，并且光栅20与光21和光电池一起产生指示这种运动的脉冲 ，哪些脉冲被馈送到控制该操作的计算机17。 阶段1可以通过由计算机控制的棘爪机构13和14沿着箭头6的方向逐渐移动。 计算机还控制由来自单元20-22的脉冲同步的两个阶梯波发生器40和50的操作以及产生选定的DC电平的街道选择网络60; 来自这些单元的信号在混合器80中组合，并通过放大器90馈送到电子束偏转系统。

    7.
    发明专利
    未知

    公开(公告)号：DE1538609A1

    公开(公告)日：1969-08-14

    申请号：DE1538609

    申请日：1966-12-27

    Applicant: IBM

    Inventor： HERMANN KARL ,  ROBERT WRENNER WARREN

    IPC: G01R31/04 ,  G01R31/28 ,  H02P7/28

    Abstract: 1,151,780. Testing printed circuit boards. INTERNATIONAL BUSINESS MACHINES CORP. Dec.21, 1966 [Dec.29, 1965], No.57201/66. Heading G1U. [Also in Divisions G2 and H2] In automatic test equipment for printed circuit boards the end terminals of each path on the board are sequentially connected, under computer control, to a constant current circuit (see Division G3) to check for continuity and defects; a current pulse of constant amplitude, e.g. 30A, is applied to each path for a precise period of time, e.g. 5 milliseconds, causing the "burnout" of a notch, void or other defect in the path, the continuity and defects being registered by detectors associated with the equipment.

    MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS
    10.
    发明专利
    MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：DE3373775D1

    公开(公告)日：1987-10-22

    申请号：DE3373775

    申请日：1983-09-20

    Applicant: IBM

    Inventor： HERMANN KARL

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H05K9/00

    Abstract: Multilayer printed circuit boards are designed and produced using a selective wiring technique which segregates short, medium length and long lines. By placing short, medium length and long lines on different layers (X1, Y1; X2, Y2; X3, Y3), line specifications can be relaxed for the layers with shorter lines. This relaxation of specifications allows for the effective use of subtractive, additive and encapsulated wire manufacturing techniques in the production of complex multilayer printed circuit boards. Each layer of segregated line lengths is fabricated in accordance with the appropriate technique for a given line length to obtain a multilayer printed circuit board optimized for cost and/or performance and reliability.

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