3.
    发明专利
    未知

    公开(公告)号:DE68920405D1

    公开(公告)日:1995-02-16

    申请号:DE68920405

    申请日:1989-08-01

    Applicant: IBM

    Abstract: Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

    4.
    发明专利
    未知

    公开(公告)号:DE69714644T2

    公开(公告)日:2003-05-28

    申请号:DE69714644

    申请日:1997-04-22

    Applicant: IBM

    Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.

    5.
    发明专利
    未知

    公开(公告)号:DE69714644D1

    公开(公告)日:2002-09-19

    申请号:DE69714644

    申请日:1997-04-22

    Applicant: IBM

    Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.

    6.
    发明专利
    未知

    公开(公告)号:DE69300229D1

    公开(公告)日:1995-08-10

    申请号:DE69300229

    申请日:1993-02-08

    Applicant: IBM

    Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

    7.
    发明专利
    未知

    公开(公告)号:DE69102022T2

    公开(公告)日:1994-11-17

    申请号:DE69102022

    申请日:1991-05-24

    Applicant: IBM

    Abstract: A hitch feeder for a TAB tape is described which comprises: a stationary jaw assembly (12) having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly (10) which includes a lower movable gripper positioned below the tape (22) and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly. A feed control is operative when the movable gripping assembly moves towards the stationary jaw assembly, to move the gripper jaws to grip the tape and to open the opposing jaws, and is further operative when the movable gripper assembly moves away from the stationary jaw assembly, to move the gripper jaws away from the tape and to close the opposing jaws.

    9.
    发明专利
    未知

    公开(公告)号:DE68920405T2

    公开(公告)日:1995-07-13

    申请号:DE68920405

    申请日:1989-08-01

    Applicant: IBM

    Abstract: Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

    10.
    发明专利
    未知

    公开(公告)号:DE69013643T2

    公开(公告)日:1995-05-04

    申请号:DE69013643

    申请日:1990-08-03

    Applicant: IBM

    Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.

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