-
公开(公告)号:EP0806727A3
公开(公告)日:1998-05-20
申请号:EP97302760
申请日:1997-04-22
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
CPC classification number: G02F1/1309 , G02F2001/136272 , G09G3/3611 , G09G3/3685 , G09G2300/0426 , G09G2310/0297 , G09G2330/08 , G11C29/76 , Y10S345/904
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
-
公开(公告)号:JPH1039790A
公开(公告)日:1998-02-13
申请号:JP9898197
申请日:1997-04-16
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
Abstract: PROBLEM TO BE SOLVED: To make possible easily and inexpensively repairing an omission in a data line by selectively activating a selected non-committed data driver and providing a data signal on a conductive line. SOLUTION: In an array 32, the number of output lines of respective data drivers 36 are increased for adding an auxiliary driver to a glass panel 34. An electric connector used for connecting an LCD panel to a data source of a host computer, etc., requires a PROM chip selecting excess line only by a piece, and other PROM signals are multiplexed by existing lines. After reset, a controller 42 decides when the input data are lapped in a temporary memory from an address in a defective map for using on an auxiliary line 38. The data supplied to a display are corrected related to defective line information stored in the memory, and the selected non-committed data driver 36 is a ctivated selectively, and the data signal is provided on the conductive line.
-
公开(公告)号:DE68920405D1
公开(公告)日:1995-02-16
申请号:DE68920405
申请日:1989-08-01
Applicant: IBM
Inventor: CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , MURPHY PHILIP , PALMER MICHAEL JON
Abstract: Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.
-
公开(公告)号:DE69714644T2
公开(公告)日:2003-05-28
申请号:DE69714644
申请日:1997-04-22
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
-
公开(公告)号:DE69714644D1
公开(公告)日:2002-09-19
申请号:DE69714644
申请日:1997-04-22
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
-
公开(公告)号:DE69300229D1
公开(公告)日:1995-08-10
申请号:DE69300229
申请日:1993-02-08
Applicant: IBM
Inventor: HERNANDEZ BERNARDO , HORTON RAYMOND ROBERT , NOYAN ISMAIL CEVDET , PALMER MICHAEL JON , RITTER MARK B
Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.
-
公开(公告)号:DE69102022T2
公开(公告)日:1994-11-17
申请号:DE69102022
申请日:1991-05-24
Applicant: IBM
Inventor: CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , LANZETTA ALPHONSO PHILLIP , PALMER MICHAEL JON , RITTER MARK B
Abstract: A hitch feeder for a TAB tape is described which comprises: a stationary jaw assembly (12) having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly (10) which includes a lower movable gripper positioned below the tape (22) and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly. A feed control is operative when the movable gripping assembly moves towards the stationary jaw assembly, to move the gripper jaws to grip the tape and to open the opposing jaws, and is further operative when the movable gripper assembly moves away from the stationary jaw assembly, to move the gripper jaws away from the tape and to close the opposing jaws.
-
公开(公告)号:HK1010264A1
公开(公告)日:1999-06-17
申请号:HK98111057
申请日:1998-09-29
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00 , G09F
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
-
公开(公告)号:DE68920405T2
公开(公告)日:1995-07-13
申请号:DE68920405
申请日:1989-08-01
Applicant: IBM
Inventor: CIPOLLA THOMAS MARIO , HORTON RAYMOND ROBERT , MURPHY PHILIP , PALMER MICHAEL JON
Abstract: Apparatus for automatically adjusting the orientation of a first surface (104) of a first body (108) to be against a second surface (106) of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.
-
公开(公告)号:DE69013643T2
公开(公告)日:1995-05-04
申请号:DE69013643
申请日:1990-08-03
Applicant: IBM
IPC: H05K7/20 , H01L23/538 , H01L25/00 , H01L25/065
Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.
-
-
-
-
-
-
-
-
-