公开(公告)号：DE69406854D1

公开(公告)日：1998-01-02

申请号：DE69406854

申请日：1994-06-01

Applicant: IBM

Inventor： CUTTING LAWRENCE RICHARD ,  GAYNES MICHAEL ANTHONY ,  JOHNSON ERIC ARTHUR ,  MILKOVICH CYNTHIA SUSAN ,  PERKINS JEFFREY SCOTT ,  PIERSON MARK VINCENT ,  POETZINGER STEVEN EUGENE ,  ZALESINSKI JERZY

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

公开(公告)号：SG53104A1

公开(公告)日：1998-09-28

申请号：SG1997003744

申请日：1997-10-14

Applicant: IBM

Inventor： DALAL HORMAZDYAR MINOCHER ,  FALLON KENNETH MICHAEL ,  GAUDENZI GENE JOSEPH ,  MILKOVICH CYNTHIA SUSAN

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

Abstract: A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability. IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are employed for joining. These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy. Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.