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    ELECTRONIC PACKAGE WITH IMPROVED CAP DESIGN FOR REDUCED INTERFACIAL STRESSES
    2.
    发明申请
    ELECTRONIC PACKAGE WITH IMPROVED CAP DESIGN FOR REDUCED INTERFACIAL STRESSES 审中-公开
    具有改进的盖子设计用于减少接口应力的电子包装

    公开(公告)号：WO02071480A3

    公开(公告)日：2003-02-06

    申请号：PCT/GB0200513

    申请日：2002-02-06

    Applicant: IBM ,  IBM UK

    Inventor： GAYNES MICHAEL ANTHONY ,  JOHNSON ERIC ARTHUR

    IPC: H01L21/56 ,  H01L23/31 ,  H01L23/433

    CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: An electronic package has a substrate (12) having an upper surface; a semiconductor chip (14) mounted on said upper surface of said substrate and electrically and mechanically coupled to said substrate, said semiconductor chip having a substantially planar upper surface (20); a thermally conductive member (22) constituted of a mesh-like material and having upper and lower surfaces, at least said lower surface being thermally coupled to said upper surface of said semiconductor chip; and dielectric material (24) being imparted to at least a portion of said substrate, and to a portion of said upper surface of said thermally conductive member.

    Abstract translation: 电子封装具有具有上表面的基板（12） 安装在所述衬底的所述上表面上并电和机械耦合到所述衬底的半导体芯片（14），所述半导体芯片具有基本平坦的上表面（20）; 由网状材料构成并具有上表面和下表面的导热构件（22），至少所述下表面热耦合到所述半导体芯片的所述上表面; 以及介电材料（24）被赋予所述基片的至少一部分，以及所述导热部件的所述上表面的一部分。

    INTEGRAL DESIGN FEATURES FOR HEATSINK ATTACH FOR ELECTRONIC PACKAGES
    3.
    发明专利
    INTEGRAL DESIGN FEATURES FOR HEATSINK ATTACH FOR ELECTRONIC PACKAGES 未知

    公开(公告)号：MY117421A

    公开(公告)日：2004-06-30

    申请号：MYPI9804474

    申请日：1998-09-30

    Applicant: IBM

    Inventor： JOHNSON ERIC ARTHUR ,  KOSTEVA STEPHEN JOHN ,  MACQUARRIE STEPHEN WESLEY

    IPC: H05K7/20 ,  H01L23/40

    Abstract: AN APPARATUS AND METHOD ATTACHING A HEATSINK (214) TO A SURFACE OF AN ELECTRONIC PACKAGE (200, 300, 300, 500, 600) COMPRISING A SUBSTRATE (202), AN INTEGRATED CIRCUIT CHIP (204) ATTACHED TO THE SURFACE OF THE SUBSTRATE, AN ENCAPSULANT (206, 226, 306, 326, 406, 506, 606) ENCAPSULATING THE INTEGRATED CIRCUIT CHIP AND CONTACTING AT LEAST A PORTION OF THE SURFACE OF THE SUBSTRATE, AND AN ORIFICE (208, 308) FORMED IN THE TOP PORTION OF THE ENCAPSULANT TO ATTACH THE HEATSINK TO THE SURFACE OF THE ELECTRONIC PACKAGE. THE HEATSINK MAY BE ATTACHED AND REMOVED AS DESIRED TO ALLOW FOR PACKAGE IDENTIFICATION OR REWORK.

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