Abstract:
An improved performance charged beam apparatus and method of improving the performance of charged beam apparatus are provided. The apparatus includes: a chamber having an interior surface; a pump port for evacuating the chamber (170) ; a substrate holder within the chamber (245) ; a charged particle beam within the chamber (250) , the charged beam generated by a source (130) and the charged particle beam striking the substrate; and one or more liners in contact with one or more different regions (A, B, C) of the interior surface of the chamber, the liners preventing material generated by interaction of the charged beam and the substrate from coating the one or more different regions of the interior surface of the chamber.
Abstract:
An improved performance charged beam apparatus and method of improving the performance of charged beam apparatus are provided. The apparatus includes: a chamber having an interior surface; a pump port for evacuating the chamber; a substrate holder within the chamber; a charged particle beam within the chamber, the charged beam generated by a source and the charged particle beam striking the substrate; and one or more liners in contact with one or more different regions of the interior surface of the chamber, the liners preventing material generated by interaction of the charged beam and the substrate from coating the one or more different regions of the interior surface of the chamber.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for fabricating a horn antenna device within an integrated circuit chip. SOLUTION: The horn antenna device 100 includes a metallic horn structure 10 with a wide aperture, that is, a horizontal waveguide. The horizontal waveguide has a tapered via that electromagnetically communicates with a vertical waveguide structure 60 to transmit energy to and from an electronic sub-component 40 configuring part of IC chips 5. Dual damascene processing is used to fabricate the horn antenna device within the IC chip.
Abstract:
A method of forming a nitrided silicon oxide layer. The method includes: forming a silicon dioxide layer on a surface (32) of a silicon substrate (30); performing a rapid thermal nitridation of the silicon dioxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form an initial nitrided silicon oxide layer; and performing a rapid thermal oxidation or anneal of the initial nitrided silicon oxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form a nitrided silicon oxide layer (34). Also a method of forming a MOSFET with a nitrided silicon oxide dielectric layer (34).
Abstract:
An integrated circuit comprises a non-volatile random access memory (NVRAM) array with gates formed in three polysilicon conductive layers 134, 144, 158. The first conductive layer 134 forms the floating gate of an EEPROM cell 122, and the second layer 144 forms wordlines 180, 182 and gates of high voltage (access) FETs 118, 120. Gates of logic FETs 114, 116 are formed from the third conductive layer 158. The third conductive layer may be used as a mask for the wordlines and high voltage gates.
Abstract:
A logic chip including a non-volatile random access memory (NVRAM) array and method of fabrication thereof. The chip includes devices with gates on one or more of three polysilicon layers. Chip logic uses normal FETs and array support includes high voltage FETs. Both logic and support are CMOS. The gates of normal FETs in the chip logic are from the third, uppermost polysilicon layer. The third poly silicon layer also is used as a mask for high voltage FETs and array word lines, both of which use the second polysilicon layer for gates. The first polysilicon layer is used solely for cell floating gates.