公开(公告)号：AU9202401A

公开(公告)日：2002-04-08

申请号：AU9202401

申请日：2001-09-27

Applicant: IBM

Inventor： CHU JACK OON ,  EMIC CHRISTOPHER D ,  HUANG LIJUAN ,  OTT JOHN ALBERT ,  WONG HON-SUM PHILIP

IPC: H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L21/338 ,  H01L21/76 ,  H01L21/762 ,  H01L27/12 ,  H01L29/778 ,  H01L29/786 ,  H01L29/812

Abstract: A method for forming strained Si or SiGe on relaxed SiGe on insulator (SGOI) is described incorporating growing epitaxial Si1-yGey layers on a semiconductor substrate, implanting hydrogen into a selected Si1-yGey layer to form a hydrogen-rich defective layer, smoothing surfaces by Chemo-Mechanical Polishing, bonding two substrates together via thermal treatments and separating two substrates at the hydrogen-rich defective layer. The separated substrates may have its upper surface smoothed by CMP for epitaxial deposition of relaxed Si1-yGey, and strained Si1-yGey depending upon composition, strained Si, strained SiC, strained Ge, strained GeC, and strained Si1-yGeyC.

公开(公告)号：DE60141843D1

公开(公告)日：2010-05-27

申请号：DE60141843

申请日：2001-09-27

Applicant: IBM

Inventor： CANAPERI DONALD ,  CHU JACK OON ,  D EMIC CHRISTOPHER ,  HUANG LIJUAN ,  OTT JOHN ALBERT ,  WONG HON-SUM PHILIP

IPC: H01L21/762 ,  H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L21/338 ,  H01L21/76 ,  H01L27/12 ,  H01L29/778 ,  H01L29/786 ,  H01L29/812

Abstract: A method for forming strained Si or SiGe on relaxed SiGe on insulator (SGOI) is described incorporating growing epitaxial Si1-yGey layers on a semiconductor substrate, implanting hydrogen into a selected Si1-yGey layer to form a hydrogen-rich defective layer, smoothing surfaces by Chemo-Mechanical Polishing, bonding two substrates together via thermal treatments and separating two substrates at the hydrogen-rich defective layer. The separated substrates may have its upper surface smoothed by CMP for epitaxial deposition of relaxed Si1-yGey, and strained Si1-yGey depending upon composition, strained Si, strained SiC, strained Ge, strained GeC, and strained Si1-yGeyC.

公开(公告)号：MY126089A

公开(公告)日：2006-09-29

申请号：MYPI20014195

申请日：2001-09-06

Applicant: IBM

Inventor： CANAPERI DONALD F ,  CHU JACK OON ,  EMIC CHRISTOPHER P D ,  HUANG LIJUAN ,  OTT JOHN ALBERT ,  WONG HON-SUM PHILIP

IPC: H01L21/36 ,  H01L21/02 ,  H01L21/20 ,  H01L21/336 ,  H01L21/338 ,  H01L21/76 ,  H01L21/762 ,  H01L27/12 ,  H01L29/778 ,  H01L29/786 ,  H01L29/812

Abstract: A METHOD FOR FORMING STRAINED SI OR SIGE ON RELAXED SIGE ON INSULATOR (SGOJ) IS DESCRIBED INCORPORATING GROWING EPITAXIAL SI1GE LAYERS ON A SEMICONDUCTOR SUBSTRATE, IMPLANTING HYDROGEN INTO A SELECTED SI1..GE LAYER TO FORM A HYDROGENERICH DEFECTIVE LAYER, SMOOTHING SURFACES BY CHEMO-MECHANICAL POLISHING, BONDING TWO SUBSTRATES TOGETHER VIA THEXMAL TREATMENTS AND SEPARATING TWO SUBSTRATES AT THE HYDROGEN-RICH DEFECTIVE LAYER. THE SEPARATED SUBSTRATES MAY HAVE ITS UPPER SURFACE SMOOTHED BY CMI’ FOR EPITAXIAL DEPOSITION OF RELAXED SI,GE,,, AND STRAINED SI1GE DEPENDING UPON COMPOSITION, STRAINED SI, STRAINED SIC, STRAINED GE, STRAINED GEC, AND STRAINED SI3GEC.