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公开(公告)号:AT464654T
公开(公告)日:2010-04-15
申请号:AT01972244
申请日:2001-09-27
Applicant: IBM
Inventor: CANAPERI DONALD , CHU JACK , D EMIC CHRISTOPHER , HUANG LIJUAN , OTT JOHN , WONG HON-SUM
IPC: H01L21/762 , H01L21/02 , H01L21/20 , H01L21/336 , H01L21/338 , H01L21/76 , H01L27/12 , H01L29/778 , H01L29/786 , H01L29/812
Abstract: A method for forming strained Si or SiGe on relaxed SiGe on insulator (SGOI) is described incorporating growing epitaxial Si1-yGey layers on a semiconductor substrate, implanting hydrogen into a selected Si1-yGey layer to form a hydrogen-rich defective layer, smoothing surfaces by Chemo-Mechanical Polishing, bonding two substrates together via thermal treatments and separating two substrates at the hydrogen-rich defective layer. The separated substrates may have its upper surface smoothed by CMP for epitaxial deposition of relaxed Si1-yGey, and strained Si1-yGey depending upon composition, strained Si, strained SiC, strained Ge, strained GeC, and strained Si1-yGeyC.
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公开(公告)号:DE60141843D1
公开(公告)日:2010-05-27
申请号:DE60141843
申请日:2001-09-27
Applicant: IBM
Inventor: CANAPERI DONALD , CHU JACK OON , D EMIC CHRISTOPHER , HUANG LIJUAN , OTT JOHN ALBERT , WONG HON-SUM PHILIP
IPC: H01L21/762 , H01L21/02 , H01L21/20 , H01L21/336 , H01L21/338 , H01L21/76 , H01L27/12 , H01L29/778 , H01L29/786 , H01L29/812
Abstract: A method for forming strained Si or SiGe on relaxed SiGe on insulator (SGOI) is described incorporating growing epitaxial Si1-yGey layers on a semiconductor substrate, implanting hydrogen into a selected Si1-yGey layer to form a hydrogen-rich defective layer, smoothing surfaces by Chemo-Mechanical Polishing, bonding two substrates together via thermal treatments and separating two substrates at the hydrogen-rich defective layer. The separated substrates may have its upper surface smoothed by CMP for epitaxial deposition of relaxed Si1-yGey, and strained Si1-yGey depending upon composition, strained Si, strained SiC, strained Ge, strained GeC, and strained Si1-yGeyC.
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