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公开(公告)号：GB2581053B
公开(公告)日：2021-11-03
申请号：GB202005185
申请日：2017-12-19
Applicant: IBM
Inventor： SAMI ROSENBLATT , RASIT TOPALOGU , JARED BARNEY HERTZBERG , WERNER A RAUSCH
Abstract: A vertical q-capacitor includes a trench in a substrate through a layer of superconducting material. A superconductor is deposited in the trench forming a first film on a first surface, a second film on a second surface, and a third film of the superconductor on a third surface of the trench. The first and second surfaces are substantially parallel, and the third surface in the trench separates the first and second surfaces. A dielectric is exposed below the third film by etching. A first coupling is formed between the first film and a first contact, and a second coupling is formed between the second film and a second contact in a superconducting quantum logic circuit. The first and second couplings cause the first and second films to operate as the vertical q-capacitor that maintains integrity of data in the superconducting quantum logic circuit within a threshold level.
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公开(公告)号：GB2576664B
公开(公告)日：2021-10-06
申请号：GB201917134
申请日：2017-12-06
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
Abstract: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.
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公开(公告)号：GB2582527A
公开(公告)日：2020-09-23
申请号：GB202009577
申请日：2017-12-20
Applicant: IBM
Inventor： JAY GAMBETTA , ANTONIO CORCOLES-GONZALEZ , FIRAT SOLGUN , SAMI ROSENBLATT , MARKUS BRINK
Abstract: A technique relates to a structure. A first surface includes an inductive element of a resonator. A second surface includes a first portion of a capacitive element of the resonator and at least one qubit. A second portion of the capacitive element of the resonator is on the first surface.
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公开(公告)号：GB2581311B
公开(公告)日：2021-02-17
申请号：GB202009117
申请日：2018-11-09
Applicant: IBM
Inventor： SAMI ROSENBLATT , JASON SCOTT ORCUTT , MARTIN SANDBERG , MARKUS BRINK , VIVEKANANDA ADIGA , NICHOLAS TORLEIV BRONN
IPC: H01L25/065 , G06N10/00 , H01L27/18 , H01L39/02 , H01L39/24
Abstract: A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded. The optically transmissive path may provide optical access to the qubit on the first chip.
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公开(公告)号：GB2582527B
公开(公告)日：2021-01-20
申请号：GB202009577
申请日：2017-12-20
Applicant: IBM
Inventor： JAY GAMBETTA , ANTONIO CORCOLES-GONZALEZ , FIRAT SOLGUN , SAMI ROSENBLATT , MARKUS BRINK
Abstract: A technique relates to a structure. A first surface includes an inductive element of a resonator. A second surface includes a first portion of a capacitive element of the resonator and at least one qubit. A second portion of the capacitive element of the resonator is on the first surface.
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Patent Agency Ranking
公开(公告)号：BR112014012103A2
公开(公告)日：2017-05-30
申请号：BR112014012103
申请日：2012-09-13
Applicant: IBM
Inventor： ALBERTO CESTERO , DANIEL J FAINSTEIN , NORMAN W ROBSON , SAMI ROSENBLATT , SUBRAMANIAN S IYER , TOSHIAKI KIRIHATA
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公开(公告)号：GB2581053A
公开(公告)日：2020-08-05
申请号：GB202005185
申请日：2017-12-19
Applicant: IBM
Inventor： SAMI ROSENBLATT , RASIT TOPALOGU , JARED BARNEY HERTZBERG , WERNER A RAUSCH
Abstract: A vertical q-capacitor (202, 302, 700, 1100, 1400, 1800) includes a trench (304, 502, 902, 1202, 1204, 1602) in a substrate (400) through a layer (602, 1302, 1304) of superconducting material (402). A superconductor is deposited in the trench (304, 502, 902, 1202, 1204, 1602) forming a first film on a first surface, a second film on a second surface, and a third film of the superconductor on a third surface of the trench (304, 502, 902, 1202, 1204, 1602). The first and second surfaces are substantially parallel, and the third surface in the trench (304, 502, 902, 1202, 1204, 1602) separates the first and second surfaces. A dielectric is exposed below the third film by etching. A first coupling is formed between the first film and a first contact, and a second coupling is formed between the second film and a second contact in a superconducting quantum logic circuit. The first and second couplings cause the first and second films to operate as the vertical q-capacitor (202, 302, 700, 1100, 1400, 1800) that maintains integrity of data in the superconducting quantum logic circuit within a threshold level.
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公开(公告)号：GB2576664A
公开(公告)日：2020-02-26
申请号：GB201917134
申请日：2017-12-06
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
IPC: H01L39/22
Abstract: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.
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公开(公告)号：GB2522971B
公开(公告)日：2016-06-15
申请号：GB201421545
申请日：2014-12-04
Applicant: IBM
Inventor： SRIVATSAN CHELLAPPA , TOSHIAKI KIRIHATA , SAMI ROSENBLATT
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公开(公告)号：GB2576274B
公开(公告)日：2022-03-09
申请号：GB201915909
申请日：2017-11-28
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
Abstract: A technique relates to a superconducting chip. Resonant units each include a Josephson junction. The resonant units have resonant frequencies whose differences are based on a variation in the Josephson junction. A transmission medium is coupled to the resonant units, and the transmission medium is configured to output a sequence of the resonant frequencies as an identification of the chip.
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