A SEMICONDUCTOR THIN FILM MUTLICHIP MODULE

    公开(公告)号:AU630225B2

    公开(公告)日:1992-10-22

    申请号:AU6131590

    申请日:1990-08-24

    Applicant: IBM

    Abstract: A system design for VLSI chips (1,2) arranged on a carrier (3) and the module thus designed is described. In a top-down design system synoptically and simultaneously an electrical circuitry is optimized by designing synoptically the chips and the chip carrier. The overall logic is divided in partitions which fit on chips. A chip placement on the carrier is performed considering minimum overall connection length and providing preferably parallel connection. Input/Output contacts (121 to 221, 131 to 231, 141 to 241) are assigned on chips vis-a-vis each other when they correspond. They are connected by parallel lines. The design of the several chips is done from outside to inside, starting with the assigned I/O contacts. Overall, in combining optimum overall design and optimum chip design, a semiconductor thin film silicon multichip module of high yield and performance is provided. As carrier (3) that is included in the design from the beginning, preferably a thin film passive silicon carrier is used.

    2.
    发明专利
    未知

    公开(公告)号:BR8705233A

    公开(公告)日:1988-05-24

    申请号:BR8705233

    申请日:1987-10-02

    Applicant: IBM

    Abstract: A method for the digital slope control of the output signals of power amplifiers, as well as a power amplifier suitable for carrying out the method as described. One way of representing the actual slope value is via the number of clock pulses applied to a counter during a measuring interval which depends in its duration on the slope. Such a measuring interval is produced by applying the pulses of a ring oscillator containing one of the power amplifiers to another counter until the overflow of the latter. Another mode of representing the actual slope value consists in counting the number of pulses of the ring oscillator during a measuring interval of predetermined duration. Actual and nominal values of the slope are compared. The results of this comparison change the contents of a left/right-shift register. Its parallel outputs influence, via control lines, control inputs of the power amplifiers in order to alter their slope by switching on or off output transistors arranged in parallel with respect to their switching paths.

    DESIGN SYSTEM FOR VLSI CHIPS ARRANGED ON A CARRIER AND MODULE THUS DESIGNED.

    公开(公告)号:MY130151A

    公开(公告)日:2007-06-29

    申请号:MYPI9001368

    申请日:1990-08-15

    Applicant: IBM

    Abstract: A SYSTEM DESIGN FOR VLSI CHIPS ARRANGED ON A CARRIER AND THE MODULE THUS DESIGNED IS DESCRIBED. IN A TOP-DOWN DESIGN SYSTEM SYNOPTICALLY AND SIMULTANEOUSLY AN ELECTRICAL CIRCUITRY IS OPTIMIZED BY DESIGNING SYNOPTICALLY THE CHIPS AND THE CHIP CARRIER. THE OVERALL LOGIC IS DIVIDED IN PARTITIONS WHICH FIT ON CHIPS. A CHIP PLACEMENT ON THE CARRIER IS PERFORMED CONSIDERING MINIMUM OVERALL CONNECTION LENGTH AND PROVIDING PREFERABLY PARALLEL CONNECTION. INPUT/OUTPUT CONTACTS ARE ASSIGNED ON CHIPS VIS-A-VIS EACH OTHER WHEN THEY CORRESPOND. THEY ARE CONNECTED BY PARALLEL LINES. THE DESIGN OF THE SEVERAL CHIPS IS DONE FROM OUTSIDE TO INSIDE, STARTING WITH THE ASSIGNED I/O CONTACTS. OVERALL, IN COMBINING OPTIMUM OVERALL DESIGN AND OPTIMUM CHIP DESIGN, A SEMICONDUCTOR THIN FILM SILICON MULTICHIP MODULE OF HIGH YIELD AND PERFORMANCE IS PROVIDED. AS CARRIER THAT IS INCLUDED IN THE DESIGN FROM THE BEGINNING, PREFERABLY A THIN FILM PASSIVE SILICON CARRIER IS USED.(FIG 6)

    DESIGN SYSTEM FOR VLSI CHIPS ARRANGED ON A CARRIER AND MODULE THUS DESIGNED

    公开(公告)号:AU6131590A

    公开(公告)日:1991-03-21

    申请号:AU6131590

    申请日:1990-08-24

    Applicant: IBM

    Abstract: A system design for VLSI chips (1,2) arranged on a carrier (3) and the module thus designed is described. In a top-down design system synoptically and simultaneously an electrical circuitry is optimized by designing synoptically the chips and the chip carrier. The overall logic is divided in partitions which fit on chips. A chip placement on the carrier is performed considering minimum overall connection length and providing preferably parallel connection. Input/Output contacts (121 to 221, 131 to 231, 141 to 241) are assigned on chips vis-a-vis each other when they correspond. They are connected by parallel lines. The design of the several chips is done from outside to inside, starting with the assigned I/O contacts. Overall, in combining optimum overall design and optimum chip design, a semiconductor thin film silicon multichip module of high yield and performance is provided. As carrier (3) that is included in the design from the beginning, preferably a thin film passive silicon carrier is used.

    METHOD FOR THE DIGITAL SLOPE CONTROL OF THE OUTPUT SIGNALS OF POWER AMPLIFIERS OF SEMICONDUCTOR CHIPS WITH VLSI CIRCUITS FOR A COMPUTER

    公开(公告)号:CA1261011A

    公开(公告)日:1989-09-26

    申请号:CA548403

    申请日:1987-10-01

    Applicant: IBM

    Abstract: METHOD FOR THE DIGITAL SLOPE CONTROL OF THE OUTPUT SIGNALS OF POWER AMPLIFIERS OF SEMICONDUCTOR CHIPS WITH VLSI CIRCUITS FOR A COMPUTER A method for the digital slope control of the output signals of power amplifiers, as well as a power amplifier suitable for carrying out the method are described. One way of representing the actual slope value is via the number of clock pulses applied to a counter (10) during a measuring interval which depends in its duration on the slope. Such a measuring interval is produced by applying the pulses of a ring oscillator (1) containing one of the power amplifiers (2) to another counter (9) until the overflow of the latter. Another mode of representing the actual slope value consists in counting the number of pulses of the ring oscillator (1) during a measuring interval of predetermined duration. Actual and nominal values of the slope are compared. The results of this comparison change the contents of a left/right-shift register (19). Its parallel outputs (21) influence via control line (22) control inputs (23) of the power amplifiers in order to alter their slope by switching on or off output transistors arranged in parallel with respect to their switching paths.

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