Abstract:
A method, structure and alignment procedure, for forming a finFET. The method including, defining a first fin of the finFET with a first mask and defining a second fin of the finFET with a second mask. The structure including integral first and second fins of single-crystal semiconductor material and longitudinal axes of the first and second fins aligned in the same crystal direction but offset from each other. The alignment procedure including simultaneously aligning alignment marks on a gate mask to alignment targets formed separately by a first masked used to define the first fin and a second mask used to define the second fin.
Abstract:
The present invention provides a FinFET device that has a first fin and a second fin. Each fin has a channel region and source and drain regions that extend from the channel region. The fins have different heights. The invention has a gate conductor positioned adjacent the fins. The gate conductor runs perpendicular to the fins and crosses the channel region of each of the first fin and second fin. The fins are parallel to one another. The ratio of the height of the first fin to the height of the second fin comprises a ratio of one to 2/3. The ratio is used to tune the performance of the transistor and determines the total channel width of the transistor.
Abstract:
Therefore, disclosed above are embodiments of a multi-fin field effect transistor structure (300 or 400) (e.g., a multi-fin dual-gate FET or tri-gate FET) that provides low resistance strapping of the source/drain regions (41, 42) of the fins (60a-c), while also maintaining low capacitance to the gate (80) by raising the level of the straps (71, 72) above the level of the gate (80). Embodiments of the structure of the invention incorporate either conductive vias (31, 32) (see structure 300) or taller source/drain regions (see structure 400) in order to electrically connect the source/drain straps (71, 72) to the source/drain regions (41, 42) of each fin (60a-c). Also, disclosed are embodiments of associated methods of forming these structures.
Abstract:
A method, structure and alignment procedure, for forming a finFET. The method including, defining a first fin of the finFET with a first mask and defining a second fin of the finFET with a second mask. The structure including integral first and second fins of single-crystal semiconductor material and longitudinal axes of the first and second fins aligned in the same crystal direction but offset from each other. The alignment procedure including simultaneously aligning alignment marks on a gate mask to alignment targets formed separately by a first masked used to define the first fin and a second mask used to define the second fin.
Abstract:
The present invention provides a FinFET device that has a first fin and a second fin. Each fin has a channel region and source and drain regions that extend from the channel region. The fins have different heights. The invention has a gate conductor positioned adjacent the fins. The gate conductor runs perpendicular to the fins and crosses the channel region of each of the first fin and second fin. The fins are parallel to one another. The ratio of the height of the first fin to the height of the second fin comprises a ratio of one to 2/3. The ratio is used to tune the performance of the transistor and determines the total channel width of the transistor.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a semiconductor structure including a plurality of fin FET devices. SOLUTION: This invention concretely provides the method for forming the semiconductor structure including a plurality of fin FET devices, and provides a method for using a mask getting across it together with a chemical oxide removing (COR) process when a rectangular pattern is formed to demarcate a relatively fine fin. This method further includes a step for uniting the adjacent fins together by selectively using a material comprising a silicon. This invention is further related to the semiconductor structure formed by using this method. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a reliable method and a device which enable design-keeping transition from an existing non-fin design structure to a functionally identical structure based on a technology of a double-gate fin-base field-effect transistor FinFET in a metal-oxide semiconductor MOS, a device of a complementary metal-oxide semiconductor CMOS, and designing chips of the semiconductors. SOLUTION: The corresponding cell structure "C" 512 contains an arrangement of a cell structure "A" and a cell structure "B" that include no previously generated fins. Consideration is made on arrangement combinations of a cell structure "A" and a cell structure "B" generated in this design hierarchy to other cell structures. A fin generation tool decides not to arrange the fins in the cell structure "A" and cell structure "B" in this hierarchy. The fin generation is delegated to the hierarchy, thus revealing a combined fin shape 560 without steps as indicated by a circle. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
The two operands (A,B) are fed to a carry network (30) and a partial sum arithmetic unit (32) that contains a bit function generator (42) and a sum generator. The outputs are fed to a result selector (70) that consists of AND logic (72- 92) and three multiplexers (M1-M3).
Abstract:
The combined binary decimal adder has summing logic coupled to decimal point carry logic. The unit contains correction logic (24,26) that acts upon different operands and introduces a +6 and -6 correction values. An initial sum logic unit (36,38) generates for each decimal position corrected operands. Outputs are fed to multiplexers (M5-M8).