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    3.
    发明专利
    未知

    公开(公告)号：DE60016928D1

    公开(公告)日：2005-01-27

    申请号：DE60016928

    申请日：2000-07-13

    Applicant: INPUT OUTPUT INC

    Inventor： YU LIANZHONG ,  RIED P ,  GOLDBERG D ,  YU DULI

    IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P15/135 ,  G02B26/00 ,  C23F1/00 ,  G03F7/26 ,  G03F7/00

    Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

    4.
    发明专利
    未知

    公开(公告)号：AT285583T

    公开(公告)日：2005-01-15

    申请号：AT00945370

    申请日：2000-07-13

    Applicant: INPUT OUTPUT INC

    Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

    IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P15/135 ,  G02B26/00 ,  C23F1/00 ,  G03F7/26 ,  G03F7/00

    Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

    6.
    发明专利
    未知

    公开(公告)号：NO20020139D0

    公开(公告)日：2002-01-11

    申请号：NO20020139

    申请日：2002-01-11

    Applicant: INPUT OUTPUT INC

    Inventor： YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D ,  RIED ROBERT P

    IPC: B81B3/00 ,  G02B26/10 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P

    Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

    Accelerometer with folded beams
    7.
    发明专利
    Accelerometer with folded beams 未知

    公开(公告)号：AU7002601A

    公开(公告)日：2002-01-02

    申请号：AU7002601

    申请日：2001-06-21

    Applicant: INPUT OUTPUT INC

    Inventor： SELVAKUMAR ARJUN ,  YU DULI ,  YU LIANZHONG ,  JONES BEN W

    IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01V1/18 ,  G01P15/00

    Abstract: An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilient folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405). The folded beams include circular cutouts so as to provide stress relief at connections between foot and leg positions of each folded beam.

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