公开(公告)号：US07148554B2

公开(公告)日：2006-12-12

申请号：US11014443

申请日：2004-12-16

Applicant: Chih Kai Nah ,  Morris D Stillabower ,  Binghua Pan ,  Sim Ying Yong ,  Przemyslaw Gromala

Inventor： Chih Kai Nah ,  Morris D Stillabower ,  Binghua Pan ,  Sim Ying Yong ,  Przemyslaw Gromala

IPC: H05K7/10 ,  H05K1/18 ,  H05K5/02 ,  H01L23/48

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.

Abstract translation: 电子部件装置包括具有第一和第二端子和中心暴露焊盘的分立电子部件。 基板具有电连接到第一端子的第一电导体，与第二端子电连接的第二电导体和第三电导体。 导热元件与电子部件的中心曝光焊盘和基板的第三导电体直接热连通。

公开(公告)号：US06986454B2

公开(公告)日：2006-01-17

申请号：US10616617

申请日：2003-07-10

Applicant: Morris D Stillabower

Inventor： Morris D Stillabower

IPC: B23K31/00 ,  B23K31/02 ,  B23K35/12

CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

Abstract translation: 提供一种电子封装（10），其包括具有衬底（14）和电路（16）的电路板（12）和具有接触端子（24）的表面安装器件（22）。 在电路板（12）上形成安装垫（28）。 电子封装（10）还包括将表面安装器件（22）的接触端子（24）连接到电路板（12）上的安装焊盘（28）的焊接接头（30）。 焊接接头（30）包括可回流焊料和多个分离构件（32或42）。 分离构件（32或42）在电路板（12）和表面安装装置（22）之间提供在约0.01mm至0.10mm的范围内的间隔距离（H）。

公开(公告)号：US06790102B2

公开(公告)日：2004-09-14

申请号：US10268327

申请日：2002-10-10

Applicant: Morris D Stillabower ,  Roy A. Visser

Inventor： Morris D Stillabower ,  Roy A. Visser

IPC: H01R1122

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/10386 ,  H05K2201/10825 ,  H05K2201/10871

Abstract: A flat twisted electrical terminal is provided for connecting a first circuit element to a second circuit element on respective first and second circuit boards. The terminal includes a flat conductive member having a first end for connecting to a first circuit element and a second end for connecting to a second circuit element. The conductive member is axially twisted about its longitudinal axis.