MEMS MIRROR DEVICE WITH PIEZOELECTRIC ACTUATION AND MANUFACTURING PROCESS THEREOF

    公开(公告)号:EP4310573A1

    公开(公告)日:2024-01-24

    申请号:EP23183016.7

    申请日:2023-07-03

    Abstract: Micro-electro-mechanical mirror device (1) having a fixed structure (2) defining an external frame (2') which delimits a cavity (3); a tiltable structure (4) extending into the cavity; a reflecting surface (4') carried by the tiltable structure and having a main extension in a horizontal plane (XY); an actuation structure (10), coupled between the tiltable structure (4) and the fixed structure (2). The actuation structure (10) is formed by at least one first pair of actuation arms (12A, 12B) configured to cause the rotation of the tiltable structure (2) around a first rotation axis (SA) parallel to the horizontal plane (XY). The actuation arms of the first pair of actuation arms (12A, 12B) are elastically coupled to the tiltable structure (4) through respective coupling elastic elements (14A, 14B) and are each formed by a bearing structure (15) and by a piezoelectric structure (13). The bearing structure (15) of each actuation arm of the first pair of actuation arms (12A, 12B) is formed by a soft region (56) of a first material and the coupling elastic elements (14A, 14B) are formed by a bearing layer (103) of a second material, the second material having greater stiffness than the first material.

    A PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL DEVICE WITH A MOBILE STRUCTURE, IN PARTICULAR A MICROMIRROR

    公开(公告)号:EP3623341A1

    公开(公告)日:2020-03-18

    申请号:EP19196770.2

    申请日:2019-09-11

    Abstract: A manufacturing process comprising the steps of: forming a bottom semiconductor region (130) including a main sub-region (131), which extends through a bottom dielectric region (112_bot, 114_bot) that coats a semiconductor wafer (100), and a secondary sub-region (134), which coats the bottom dielectric region and surrounds the main sub-region; forming a first top cavity (140) and a second top cavity (142) through the wafer, delimiting a fixed body (145, 146, 148, 154, 155) and a patterned structure (151, 152, 153) that includes a central portion (151), which contacts the main sub-region, and deformable portions (152, 153), in contact with the bottom dielectric region; forming a bottom cavity (180) through the bottom semiconductor region, as far as the bottom dielectric region, the bottom cavity laterally delimiting a stiffening region (191) that includes the main sub-region and leaving exposed parts of the bottom dielectric region that contact the deformable portions and parts of the bottom dielectric region that delimit the first and second top cavities; and selectively removing the parts left exposed by the bottom cavity.

    A MEMS DEVICE WITH PIEZOELECTRIC ACTUATION, A PROJECTIVE MEMS SYSTEM INCLUDING THE MEMS DEVICE AND RELATED CONTROL METHOD

    公开(公告)号:EP3343265A1

    公开(公告)日:2018-07-04

    申请号:EP17172096.4

    申请日:2017-05-19

    Abstract: A MEMS device comprising a fixed structure (22) and a suspended structure (26) including an internal structure (29; 109) and a first arm (B1) and a second arm (B2), each of which has a respective first end and a respective second end, the first ends being fixed to the fixed structure and being angularly arranged at a distance apart, the second ends being fixed to the internal structure, being angularly arranged at a distance apart and being arranged angularly in a same direction of rotation with respect to the corresponding first ends. The MEMS device further includes a number of piezoelectric actuators (50, 52, 54, 56), each of which can be driven so as to cause deformation of a corresponding arm, thus causing a rotation of the internal structure. In resting conditions, each of the first and second arms has a respective elongated portion (30, 32) with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.

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