公开(公告)号：EP1139421A3

公开(公告)日：2003-03-12

申请号：EP00123110.9

申请日：2000-10-25

Applicant: STMicroelectronics S.r.l.

Inventor： Casati, Paolo ,  Cognetti, Carlo

IPC: H01L23/433 ,  H01L21/56

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

Abstract: The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

Abstract translation: 本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。 在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。 芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。 使集成电路封装从将两个芯片直接连接到散热芯片开始。 散热块可以在芯片之间运行预切割槽。 一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。 然后，将塞子从下侧物理分离成两片，分离沿着预切割槽延伸。 通常，锯屑将被锯切割而分离。

公开(公告)号：EP0907307A1

公开(公告)日：1999-04-07

申请号：EP97830492.1

申请日：1997-10-03

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Casati, Paolo ,  Cognetti, Carlo ,  Villa, Claudio Maria

IPC: H05K1/02 ,  H05K7/20 ,  H01L23/367

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The present invention relates to a heat sink for surface mount power packages, of the type comprising a conductive element having at least a surface (9) which is in contact with an exposed surface (6) of slug (5) incorporated into an IC power package (1) to be mounted on a printed circuit board (4). The conductive element (8) of the heat sink is formed by a first portion (8a) passing through a hole (7) provided in said printed circuit board (4) and by a second larger portion (8b) abutting against the printed circuit board (4).
A process is also provide for mounting the heat sink (8) on an IC power package (1) and in contact with an exposed slug (5) surface of the package (1) to be mounted on the printed circuit board (4).

Abstract translation: 本发明涉及一种用于表面贴装功率封装的散热器，其类型包括导电元件，该导电元件具有至少一个表面（9），该表面（9）与嵌入IC功率的块状物（5）的暴露表面（6）接触 封装（1）安装在印刷电路板（4）上。 散热器的导电元件（8）由穿过设置在所述印刷电路板（4）中的孔（7）的第一部分（8a）和与所述印刷电路板（4）抵接的第二较大部分（8b）形成 （4）。 还提供一种方法，用于将散热器（8）安装在IC电源封装（1）上并与要安装在印刷电路板（4）上的封装（1）的暴露的块塞（5）表面接触。

公开(公告)号：EP1369929A1

公开(公告)日：2003-12-10

申请号：EP02425334.6

申请日：2002-05-27

Applicant: STMicroelectronics S.r.l.

Inventor： Cognetti, Carlo ,  Mastromatteo, Ubaldo

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0232

CPC classification number: H01L31/18 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2224/05099

Abstract: A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors (24) in a wafer (10) of semiconductor material; bonding a plate (30) of transparent material to the wafer (10) so as to seal the optical sensors (24); and dividing the wafer (10) into a plurality of dice (40), each comprising an optical sensor (24) and a respective portion (41) of the plate (30).

Abstract translation: 一种用于制造封装的光学传感器的方法，包括以下步骤：在半导体材料的晶片（10）中形成多个相互间隔开的光学传感器（24）; 将透明材料的板（30）结合到晶片（10）上以便密封光学传感器（24）; 以及将所述晶片（10）分成多个骰子（40），每个骰子（40）包括光学传感器（24）和所述板（30）的相应部分（41）。

公开(公告)号：EP1139421A2

公开(公告)日：2001-10-04

申请号：EP00123110.9

申请日：2000-10-25

Applicant: STMicroelectronics S.r.l.

Inventor： Casati, Paolo ,  Cognetti, Carlo

IPC: H01L23/433

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

Abstract: The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

Abstract translation: 本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。 在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。 芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。 使集成电路封装从将两个芯片直接连接到散热芯片开始。 散热块可以在芯片之间运行预切割槽。 一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。 然后，将塞子从下侧物理分离成两片，分离沿着预切割槽延伸。 通常，锯屑将被锯切割而分离。