Abstract:
The cartridge-like chemical sensor (140) is formed by a housing (150) having a base (151) and a cover (152) fixed to the base and provided with an input opening (159), an output hole (169) and a channel (165) for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board (153) carrying an integrated circuit (20) having a sensitive region (16) open toward the channel (165) and of a material capable to bind with target chemicals in the gas to be analyzed. A fan (170) is arranged in the housing, downstream of the integrated device (20), for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.
Abstract:
The integrated semiconductor device (1) includes a first chip (4) of semiconductor material having first, high-voltage, regions (12-17) at a first high-value voltage; a second chip (6) of semiconductor material having second high-voltage regions (31, 33) connected to the first voltage; and a third chip (5) of semiconductor material arranged between the first chip and the second chip and having at least one low-voltage region (21) at a second, low-value, voltage. A through connection region (22) is formed in the third chip and is connected to the first and second high-voltage regions; through insulating regions (23-25) surround the through connection region and insulate it from the low-voltage region.
Abstract:
A microelectromechanical structure, usable in an optical switch for directing a light beam towards one of two light guide elements, including: a mirror element (53), rotatably movable; an actuator (65), which can translate; and a motion conversion assembly (77), arranged between the mirror element (53) and the actuator (65). The motion conversion assembly (77) includes a projection (54) integral with the mirror element (53) and elastic engagement elements (73) integral with the actuator (65) and elastically loaded towards the projection. The elastic engagement elements (73) are formed by metal plates fixed to the actuator (65) at one of their ends and engaging the projection (54) with an abutting edge (73b) countershaped with respect to the projection (54).
Abstract:
The microreactor is completely integrated and is formed by a semiconductor body (2) having a surface (4) and housing at least one buried channel (3) accessible from the surface of the semiconductor body (2) through two trenches (21a, 21b). A heating element (10) extends above the surface (4) over the channel (3) and a resist region (18) extends above the heating element and defines an inlet reservoir and an outlet reservoir (19, 20). The reservoirs (19, 20) are connected to the trenches (21a, 21b) and have, in cross-section, a larger area than the trenches. The outlet reservoir (20) has a larger area than the inlet reservoir (19). A sensing electrode (12) extends above the surface (4) and inside the outlet reservoir (20).
Abstract:
A method of producing suspended elements for electrical connection between two portions of a micro-mechanism which can move relative to one another provides for the formation of a layer of sacrificial material (32), the formation of the electrical connection elements (43) on the layer of sacrificial material, and the removal of the layer of sacrificial material beneath the electrical connecting elements, the layer of sacrificial material being a thin film (32) with at least one adhesive side (21) which can be applied dry to the surface of the micro-mechanism.
Abstract:
The microactuator (9) is attached to a first face (43) of a coupling (8) formed on a suspension (5), so that the R/W transducer (6) projects from the opposite face (44). A hole (41; 56) in the coupling (8) permits passage of an adhesive mass (42) interposed between the rotor (11) of the microactuator (9) and the R/W transducer (6). A strip (40) of adhesive material extends between the die (25) accommodating the microactuator (9) and the coupling (8), and externally surrounds the microactuator (9). The coupling (8) acts as a protective shield for the microactuator (9), both mechanically and electrically; it covers the microactuator (9) at the front, and prevents foreign particles from blocking the microactuator (9); in addition it electrically insulates the R/W transducer (6), sensitive to magnetic fields, from regions of the microactuator biased to a high voltage. With the gimbal (8), the strip (40) forms a sealing structure, which in practice surrounds the microactuator (9) on all sides.
Abstract:
The method comprises the steps of: forming an integrated device (54) including a microactuator (10) in a semiconductor material wafer (29); forming an immobilisation structure (45,47) of organic material on the wafer; simultaneously forming a securing flange (51) integral with the microactuator (10) and electrical connections for connecting the integrated device to a read/write head; bonding a transducer (6,55) supporting the read/write head to the securing flange (51); connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the actuator unit to a suspension; and removing the immobilisation structure (45,47).