公开(公告)号：EP0907307A1

公开(公告)日：1999-04-07

申请号：EP97830492.1

申请日：1997-10-03

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Casati, Paolo ,  Cognetti, Carlo ,  Villa, Claudio Maria

IPC: H05K1/02 ,  H05K7/20 ,  H01L23/367

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The present invention relates to a heat sink for surface mount power packages, of the type comprising a conductive element having at least a surface (9) which is in contact with an exposed surface (6) of slug (5) incorporated into an IC power package (1) to be mounted on a printed circuit board (4). The conductive element (8) of the heat sink is formed by a first portion (8a) passing through a hole (7) provided in said printed circuit board (4) and by a second larger portion (8b) abutting against the printed circuit board (4).
A process is also provide for mounting the heat sink (8) on an IC power package (1) and in contact with an exposed slug (5) surface of the package (1) to be mounted on the printed circuit board (4).

Abstract translation: 本发明涉及一种用于表面贴装功率封装的散热器，其类型包括导电元件，该导电元件具有至少一个表面（9），该表面（9）与嵌入IC功率的块状物（5）的暴露表面（6）接触 封装（1）安装在印刷电路板（4）上。 散热器的导电元件（8）由穿过设置在所述印刷电路板（4）中的孔（7）的第一部分（8a）和与所述印刷电路板（4）抵接的第二较大部分（8b）形成 （4）。 还提供一种方法，用于将散热器（8）安装在IC电源封装（1）上并与要安装在印刷电路板（4）上的封装（1）的暴露的块塞（5）表面接触。

公开(公告)号：EP0926733B1

公开(公告)日：2004-03-17

申请号：EP97830677.7

申请日：1997-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Rossi, Roberto ,  Villa, Claudio Maria

IPC: H01L23/40 ,  H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP0926733A1

公开(公告)日：1999-06-30

申请号：EP97830677.7

申请日：1997-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Tiziani, Roberto ,  Rossi, Roberto ,  Villa, Claudio Maria

IPC: H01L23/40 ,  H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: An external heat sink (2) may be soldered to a metal slug (3) incorporated at the bottom of a molded body (4) of encapsulating resin of the package of an integrated power device for surface mounting on printed circuit board (7). The metal slug (3) has at least a portion protruding from an outer surface of at least one face of the body (4); an external metal heat sink (2), geometrically coupling with the packaged device over the printed circuit board (7), has at least a surface abutting with a surface of the resin body (4) thus defining a separation gap (10) between at least a surface of said protruding portion of the metal slug (3) and a surface (5, 9a, 9b) opposed to it of the external metal heat sink (2) that gets filled with molten solder alloy (8) during the normal soldering treatment to which the board is subjected.

Abstract translation: （4）封装的封装表面的集成功率器件的树脂安装在印刷电路板（7）（3）引入外部散热器（2）可以被焊接到金属块在模制体的底部。 金属块（3）具有至少从在所述主体（4）中的至少一个面的外表面突出的部分; 到外部金属散热片（2），几何上与所述封装装置耦合在印刷电路板（7），具有至少一个表面与在所述树脂体（4）因此限定（10）之间的分离间隙的表面抵接 至少一个突出反对的外部金属散热片（2）的金属块（3）和一表面（5，9A，9B）的部分的所述表面并得到正常的焊接过程中填充有熔融焊料合金（8） 其处理的板进行。