Abstract:
The cartridge-like chemical sensor (140) is formed by a housing (150) having a base (151) and a cover (152) fixed to the base and provided with an input opening (159), an output hole (169) and a channel (165) for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board (153) carrying an integrated circuit (20) having a sensitive region (16) open toward the channel (165) and of a material capable to bind with target chemicals in the gas to be analyzed. A fan (170) is arranged in the housing, downstream of the integrated device (20), for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.
Abstract:
An assembly structure (10) for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die (1) having a plurality of contact pads (2) associated with said integrated circuit and connected electrically to respective rheophores (5) of said structure, wherein a shield element (4) is coupled thermally to said die (1) by a layer (3) of an adhesive material.
Abstract:
A fluidic cartridge (35; 135) for detecting chemicals, formed by a casing (40; 140), hermetically housing an integrated device (20) having a plurality of detecting regions (22) to bind with target chemicals; part of a supporting element (41; 141), bearing the integrated device; a reaction chamber (65; 165), facing the detecting regions (22); a sample feeding hole (50, 51; 150) and a washing feeding hole (52; 152), self-sealingly closed; fluidic paths (63, 64, 70, 71; 163, 164, 170, 171), which connect the sample feeding and washing feeding holes (50-52; 150, 152) to the reaction chamber (65; 165); and a waste reservoir (80; 180), which may be fluidically connected to the reaction chamber by valve elements (82, 76; 182, 176) that may be controlled from outside. The integrated device is moreover connected to an interface unit (42) carried by the supporting element (41; 141), electrically connected to the integrated device and including at least one signal processing stage and external contact regions (75; 175).