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    PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE AND CORRESPONDING COMBINED MICROELECTROMECHANICAL DEVICE
    2.
    发明公开
    PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE AND CORRESPONDING COMBINED MICROELECTROMECHANICAL DEVICE 审中-公开

    公开(公告)号：EP4098607A1

    公开(公告)日：2022-12-07

    申请号：EP22172711.8

    申请日：2022-05-11

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  SEGHIZZI, Luca ,  OGGIONI, Laura ,  CORSO, Lorenzo

    IPC: B81B7/02 ,  B81C1/00

    Abstract: A process for manufacturing a combined microelectromechanical device (30) provides for: forming, in a die (1) of semiconductor material, at least a first (2a) and a second (2b) microelectromechanical structures; performing a first bonding phase to bond a cap (10) to the die (1) by means of a bonding region (14), to define at least a first (20a) and a second (20b) cavity at the first and, respectively, second microelectromechanical structures, the cavities being at a controlled pressure having a first value; forming an access channel (22) through the cap in fluidic communication with the first cavity to control the pressure value inside the first cavity in a distinct manner with respect to a respective pressure value inside the second cavity; performing a second bonding phase, after which the bonding region deforms to hermetically close the first cavity with respect to the access channel.

    MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT
    4.
    发明公开
    MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT 审中-公开

    公开(公告)号：EP4322410A1

    公开(公告)日：2024-02-14

    申请号：EP23188080.8

    申请日：2023-07-27

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  GATTERE, Gabriele ,  ALLEGATO, Giorgio ,  AZPEITIA URQUIA, Mikel ,  DANEI, Alessandro

    IPC: H03K17/975

    Abstract: A microelectromechanical button device (5) is provided with a detection structure (14) having: a substrate (22) of semiconductor material with a front surface (22a) and a rear surface (22b); a buried electrode (28) arranged on the substrate; a mobile electrode (32), arranged in a structural layer (30) overlying the substrate and elastically suspended above the buried electrode at a separation distance so as to form a detection capacitor (Cd); and a cap (46) coupled over the structural layer and having a first main surface (46a) facing the structural layer and a second main surface (46b) that is designed to be mechanically coupled to a deformable portion (3) of a case (2) of an electronic apparatus (1) of a portable or wearable type. The cap has, on its first main surface, an actuation portion (48) arranged over the mobile electrode and configured to cause, in the presence of a pressure applied on the second main surface, a deflection of the mobile electrode and its approach to the buried electrode, with a consequent capacitive variation of the detection capacitor, which is indicative of an actuation of the microelectromechanical button device.

    CAPACITIVE, MEMS-TYPE ACOUSTIC TRANSDUCER HAVING SEPARATE SENSITIVE AND TRANSDUCTION AREAS AND MANUFACTURING PROCESS THEREOF
    5.
    发明公开
    CAPACITIVE, MEMS-TYPE ACOUSTIC TRANSDUCER HAVING SEPARATE SENSITIVE AND TRANSDUCTION AREAS AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：EP4408023A1

    公开(公告)日：2024-07-31

    申请号：EP24151115.3

    申请日：2024-01-10

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  CERINI, Fabrizio ,  ADORNO, Silvia

    IPC: H04R19/00

    CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R2201/00320130101

    Abstract: Capacitive, MEMS-type acoustic transducer, having a sound collection part (51) and a transduction part (52). A substrate region (63) surrounds a first chamber (59) arranged in the sound collection part (51) and open towards the outside; a fixed structure (62) is coupled to the substrate region (63); a cap region (56) is coupled to the fixed structure (62). A sensitive membrane (70) is arranged in the sound collection part (51), is coupled to the fixed structure (62) and faces the first chamber (59) . A transduction chamber (58) is arranged in the transduction part (52), hermetically closed with respect to the outside and accommodates a detection membrane (72). An articulated structure (67) extends between the sensitive membrane (70) and the detection membrane (72), through the walls of the transduction chamber (58). A fixed electrode (92; 69C) faces and is capacitively coupled to the detection membrane (72). Conducive electrical connection regions (69A, 69C, 69D) extend above the substrate region (63), into the transduction chamber (58).

    METHOD OF MANUFACTURING A STATOR FOR AN ELECTRIC MOTOR, STATOR, AND ELECTRIC MOTOR
    7.
    发明公开
    METHOD OF MANUFACTURING A STATOR FOR AN ELECTRIC MOTOR, STATOR, AND ELECTRIC MOTOR 审中-公开

    公开(公告)号：EP4304053A1

    公开(公告)日：2024-01-10

    申请号：EP23175892.1

    申请日：2023-05-29

    Applicant: STMicroelectronics S.r.l.

    Inventor： SEGHIZZI, Luca ,  VERCESI, Federico ,  LONGONI, Gianluca

    IPC: H02K1/14 ,  H02K3/26 ,  H02K99/00 ,  H01F41/04 ,  H02K15/02

    Abstract: A stator (1) for an electric actuator or motor, comprising: a solid body (20; 35); a ferromagnetic core region (8) between the layers of semiconductor material (24, 38), electrically insulated from said layers of semiconductor material (24, 38); a plurality of conductive through vias (14) through the solid body (20; 35); a first plurality of conductive strips (10), which extend parallel to one another above the core (8); and a second plurality of conductive strips (10), which extend parallel to one another above the core and opposite to the first plurality of conductive strips; wherein the first plurality of conductive strips (10), the plurality of conductive through vias (14), and the second plurality of conductive strips (10) form a winding or coil of the stator (1).

    MICRO-ELECTRO-MECHANICAL OPTICAL SHUTTER WITH ROTATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS
    8.
    发明公开
    MICRO-ELECTRO-MECHANICAL OPTICAL SHUTTER WITH ROTATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP4187289A1

    公开(公告)日：2023-05-31

    申请号：EP22207166.4

    申请日：2022-11-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  CERINI, Fabrizio ,  GUERINONI, Luca ,  BONI, Nicolò

    IPC: G02B5/00 ,  G02B26/04

    Abstract: A MEMS shutter including: a substrate (2) of semiconductor material traversed by a main aperture (9), and a first semiconductor layer (14) and a second semiconductor layer (16), which form a supporting structure (28, 71) fixed to the substrate; a plurality of deformable structures (29, 59, 69); a plurality of actuators (36; 96); and a plurality of shielding structures (33; 35; 333; 335; 433), each of which is formed by a corresponding portion of at least one between the first semiconductor layer and the second semiconductor layer, the shielding structures being arranged angularly around the underlying main aperture so as to provide shielding of the main aperture, each shielding structure being further coupled to the supporting structure via a corresponding deformable structure. Each actuator may be controlled so as to cause a rotation of a corresponding shielding structure between a respective first position and a respective second position, thus varying shielding of the main aperture. The first and second positions of the shielding structures are such that, in at least one operating condition of the MEMS shutter (1), pairs of adjacent shielding structures at least partially overlap one another.

    MICRO-ELECTROMECHANICAL OPTICAL SHUTTER WITH TRANSLATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS
    9.
    发明公开
    MICRO-ELECTROMECHANICAL OPTICAL SHUTTER WITH TRANSLATING SHIELDING STRUCTURES AND RELATED MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP4187288A1

    公开(公告)日：2023-05-31

    申请号：EP22207130.0

    申请日：2022-11-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： VERCESI, Federico ,  BONI, Nicolò ,  CERINI, Fabrizio ,  GUERINONI, Luca

    IPC: G02B5/00 ,  G02B26/04 ,  G02B26/02

    Abstract: A MEMS shutter (1) including: a semiconductor substrate (2) traversed by an aperture (9); a first semiconductor layer (14) and a second semiconductor layer (16), which form a supporting structure (28, 71, 87; 28, 171) fixed to the substrate; a plurality of deformable structures (29, 59, 68, 85; 169), each of which is formed by a corresponding portion of at least one between the first and second semiconductor layers; a plurality of actuators (36; 96); a plurality of shielding structures (33; 35; 333; 335; 433), each of which is formed by a corresponding portion of at least one between the first and second semiconductor layers, the shielding structures being arranged angularly around the underlying aperture so as to provide shielding of the aperture, each shielding structure being further coupled to the supporting structure via a deformable structure. Each actuator may be controlled so as to translate a corresponding shielding structure between a first position and a second position, thus varying shielding of the aperture; the first and second positions of the shielding structures are such that, in at least one operating condition, pairs of adjacent shielding structures at least partially overlap one another.

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