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公开(公告)号:JPH11131221A
公开(公告)日:1999-05-18
申请号:JP24545998
申请日:1998-08-31
Applicant: UNITED TECHNOLOGIES CORP
Inventor: MARSZAL DEAN N , BEERS RUSSELL A , HENDRICKS ROBERT E , NOETZEL ALLAN A , WRIGHT ROBERT J , ERVIN DAVID R , SILEO GERARD A
Abstract: PROBLEM TO BE SOLVED: To provide an efficient gaseous phase deposition forming device capable of continuously applying coating of high quality to many substrates and good in the efficiency of the cost. SOLUTION: A geseous phase deposition forming device for applying substrates with coating is provided, and this device contains plural gaseous phase deposition coaters 14, plural platers 16, a plater docking station 18 and a device for carrying the platers between the coaters and the plater docking station. A shuttle truck connects the plater docking station and coaters. The plater selectively discharged from the coater is carried to the plater docking station along the shuttle truck, where the treated substrate is taken down from the plater, and untreated substrate is placed on the plater.
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公开(公告)号:JPH11140630A
公开(公告)日:1999-05-25
申请号:JP24546098
申请日:1998-08-31
Applicant: UNITED TECHNOLOGIES CORP
Inventor: HENDRICKS ROBERT E , BEERS RUSSELL A , MARSZAL DEAN N , NOETZEL ALLAN A , WRIGHT ROBERT J
Abstract: PROBLEM TO BE SOLVED: To provide a cathode arc vapor deposition device good in the cost effectiveness and capable of executing uniform coating with high quality on a substrate. SOLUTION: A device 10 for coating the surface of a substrate 12 with a material by a cathode arc vapor deposition method has a vessel 14, a device 16 for keeping this vessel vacuum, an annular cathode 18 stretching between a primary edge face and a secondary edge face and having an evaporating face 44 provided with an opening part, a means 24 for selectively maintaining the electric energy of an arc between the cathode 18 and an anode 26 and a device for moving the arc to the cathode. The device 74 for moving the arc is arranged at the opening part of the cathode 18 and substantially generates the magnetic field stretching parallel to the evaporating face 44. The annular anode 26 is, on the inside in the radial direction of the substrate 12 arranged in the vessel, allowed to stand in a row with this.
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公开(公告)号:JPH11140629A
公开(公告)日:1999-05-25
申请号:JP24545898
申请日:1998-08-31
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , NOETZEL ALLAN A , WRIGHT ROBERT J , ROYAL TYRUS E
Abstract: PROBLEM TO BE SOLVED: To provide a cathode vapor deposition device good in the cost effectiveness and capable of executing uniform coating with high quality on a substrate. SOLUTION: A device 10 for coating the surface of a substrate 12 with a material by a cathode arc vapor deposition method has a vessel 14, a device 16 for keeping this vessel vacuum, a cathode 18, a contactor 20, a means 24 for selectively maintaining the electric energy of an arc between the cathode 18 and an anode 26 and an actuator 22. The cathode 18 and the contactor 20 are arranged on the inside of the vessel, and the contactor 20 is electrically connected to the means 24 for selectively keeping the electric energy of the arc. The actuator 22 electrically connects the contactor 20 to the cathode 18 selectively and connects the cathode 18 to the means 24 for keeping the electric energy of the arc.
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公开(公告)号:SG67548A1
公开(公告)日:1999-09-21
申请号:SG1998003324
申请日:1998-08-27
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , NOETZEL ALLAN A , WRIGHT ROBERT J
Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.
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公开(公告)号:DE69840142D1
公开(公告)日:2008-12-04
申请号:DE69840142
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , WRIGHT ROBERT J , NOETZEL ALLAN A , ROYAL TYRUS E
Abstract: An apparatus (10) for applying material by cathodic arc deposition to a substrate (12) is provided which includes a vessel (14), means (16) for maintaining a vacuum in the vessel, a cathode (18), a contactor (20), means (24) for selectively sustaining an arc of electrical energy between the cathode and an anode (26), and an actuator (22). The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.
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公开(公告)号:DE69832016D1
公开(公告)日:2005-12-01
申请号:DE69832016
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , MARSZAL DEAN N , NOETZEL ALLAN A , SILEO GERARD A , HENDRICKS ROBERT E , WRIGHT ROBERT J , ERVIN DAVID R
Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.
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公开(公告)号:SG67549A1
公开(公告)日:1999-09-21
申请号:SG1998003327
申请日:1998-08-27
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , NOETZEL ALLAN A , WRIGHT ROBERT J , ERVIN DAVID R , SILEO GERARD A
Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.
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公开(公告)号:DE69835324T2
公开(公告)日:2007-08-23
申请号:DE69835324
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSEL A , HENDRICKS ROBERT E , MARSZAL DEAN N , WRIGHT ROBERT J , NOETZEL ALLAN A
Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.
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公开(公告)号:DE69835324D1
公开(公告)日:2006-09-07
申请号:DE69835324
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSEL A , HENDRICKS ROBERT E , MARSZAL DEAN N , WRIGHT ROBERT J , NOETZEL ALLAN A
Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.
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公开(公告)号:DE69832016T2
公开(公告)日:2006-07-13
申请号:DE69832016
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP HARTF
Inventor: BEERS RUSSELL A , MARSZAL DEAN N , NOETZEL ALLAN A , SILEO GERARD A , HENDRICKS ROBERT E , WRIGHT ROBERT J , ERVIN DAVID R
Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.
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