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公开(公告)号：KR1020070073717A
公开(公告)日：2007-07-10
申请号：KR1020070063668
申请日：2007-06-27
Applicant: 삼성전자주식회사
IPC: H03H9/56
CPC classification number: H03H9/0542 , H03H9/542 , H03H9/564 , H03H9/566
Abstract: A filter using one trimming inductor is provided to reduce a size of the filter and simplify a manufacturing process by using one trimming inductor. A filter using one trimming inductor includes a substrate, first and second series resonators(210,220), a first parallel resonator(310), a second parallel resonator(320), a trimming inductor(400), and a third parallel resonator. The substrate has a first port, a second port, and a ground port which are electrically connected to an external terminal. The first and second series resonators(210,220) connect the first port to the second port in series on the substrate. The first parallel resonator(310) is connected to a node formed between the first port and the first series resonator(310) on the substrate. The second parallel resonator(320) is connected to a node formed between the first series resonator(210) and the second series resonator(220) on the substrate. A side of the trimming inductor(400) is connected to the first and second parallel resonators(310,320). The other side of the trimming inductor(400) is connected to the ground port. A side of the third parallel resonator is connected to the second port on the substrate. The other side of the third parallel resonator is connected to the ground port. The third parallel resonator attenuates a frequency signal of a low band from a frequency pass band of the filter. At least one of the first to third parallel resonators(310,320) and the first and second series resonators(210,220) has a cavity and a via-hole formed at a lower part of the cavity.
Abstract translation: 提供使用一个微调电感器的滤波器来减小滤波器的尺寸并且通过使用一个微调电感器来简化制造过程。 使用一个修整电感器的滤波器包括衬底，第一和第二串联谐振器（210,220），第一并联谐振器（310），第二并联谐振器（320），微调电感器（400）和第三并联谐振器。 基板具有电连接到外部端子的第一端口，第二端口和接地端口。 第一和第二串联谐振器（210,220）将第一端口与第二端口串联连接在基板上。 第一并联谐振器（310）连接到形成在基板上的第一端口和第一串联谐振器（310）之间的节点。 第二并联谐振器（320）连接到形成在基板上的第一串联谐振器（210）和第二串联谐振器（220）之间的节点。 修整电感器（400）的一侧连接到第一和第二并联谐振器（310,320）。 修整电感器（400）的另一侧连接到接地端口。 第三并联谐振器的一侧连接到基板上的第二端口。 第三并联谐振器的另一侧连接到接地端口。 第三并联谐振器从滤波器的频带衰减低频带的频率信号。 第一至第三并联谐振器（310,320）和第一和第二串联谐振器（210,220）中的至少一个具有形成在空腔的下部的空腔和通孔。
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公开(公告)号：KR1020070068758A
公开(公告)日：2007-07-02
申请号：KR1020050130725
申请日：2005-12-27
Applicant: 삼성전자주식회사
IPC: H01L21/66
CPC classification number: G01N21/9501 , G01N21/01 , G01N21/8806 , G01N21/8851 , G01N2021/0106
Abstract: A semiconductor inspecting apparatus is provided to enhance the maintenance of equipment and to improve the uptime of the equipment by using an LED(Light Emitting Diode) as an automatic focus light source. A semiconductor inspecting apparatus(100) includes a light source. The light source includes an LED. The semiconductor inspecting apparatus further includes an automatic focus unit(110) for setting automatically focus. A stage is used for moving freely an inspection object body. A first controller is used for controlling the operation of the automatic focus unit. A second controller is used for controlling the operation of the stage. A third controller is used for controlling the operation of the LED.
Abstract translation: 提供半导体检查装置，以通过使用LED（发光二极管）作为自动对焦光源来增强设备的维护和提高设备的正常运行时间。 半导体检查装置（100）包括光源。 光源包括LED。 半导体检查装置还包括用于自动聚焦的自动对焦单元（110）。 舞台用于自由移动检查物体。 第一控制器用于控制自动对焦单元的操作。 第二控制器用于控制舞台的操作。 第三控制器用于控制LED的操作。
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公开(公告)号：KR100661350B1
公开(公告)日：2006-12-27
申请号：KR1020040112699
申请日：2004-12-27
Applicant: 삼성전자주식회사
IPC: B81B7/02
CPC classification number: B81C1/00269
Abstract: 본 발명에 의한 MEMS 소자 패키지는, MEMS 활성소자가 상면에 형성되어 있는 소자용 기판; MEMS 활성소자가 위치하는 공간 및 MEMS 활성소자의 전기적 경로를 제공하는 것으로, MEMS 활성소자의 양측에 배치되며, 제 1 패드 및 제 2 패드가 일정간격을 두고 대향된 구조의 내부전극패드; 내부전극패드의 외곽에 배치되는 실링패드; 실링패드를 통하여 소자용 기판과 결합되며, 내부전극패드의 간격이 위치하는 부분에 비아홀이 형성된 덮개용 기판; 일단이 내부전극패드와 접촉하도록 비아홀의 내측면에 형성된 연결부재; 및 연결부재의 타단과 접촉하도록 덮개용 기판의 상면에 형성된 외부전극패드;를 포함한다.
MEMS, 소자, 패키지, 웨이퍼, 기판, 비아홀, Au, 전극, 실링-
公开(公告)号：KR1020060128277A
公开(公告)日：2006-12-14
申请号：KR1020050049576
申请日：2005-06-10
Applicant: 삼성전자주식회사
Inventor： 김종석
IPC: H01L21/66
CPC classification number: H01L22/12 , G01N21/8851 , G01N21/9501 , G01N2021/8854
Abstract: A method for testing defects of a wafer is provided to improve efficiency and precision of wafer detection by efficiently detecting defects on the wafer. A pattern formed on a wafer is divided into a plurality of regions according to characteristics(S100). A process parameter for detecting defects is set according to respective regions(S200). Threshold values for judging defects of respective regions according to the set parameters(S300). Defects are detected by regions based on the threshold values(S400). The parameter is at least one selected from the group consisting of contrast, intensity, brightness, or size. Light is irradiated to respective regions of the wafer to scan the regions. Scanning results in respective regions are compared with threshold values of the parameters. It is judged that regions of the wafer having a value greater than the threshold value are defective.
Abstract translation: 提供了一种用于测试晶片缺陷的方法，以通过有效地检测晶片上的缺陷来提高晶片检测的效率和精度。 根据特性将形成在晶片上的图案分割成多个区域（S100）。 根据各个区域设定用于检测缺陷的处理参数（S200）。 用于根据设定参数判断各区域的缺陷的阈值（S300）。 基于阈值的区域检测缺陷（S400）。 该参数是从对比度，强度，亮度或大小组成的组中选择的至少一个。 将光照射到晶片的各个区域以扫描该区域。 将各个区域的扫描结果与参数的阈值进行比较。 判断晶片的具有大于阈值的值的区域是有缺陷的。
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公开(公告)号：KR100633101B1
公开(公告)日：2006-10-12
申请号：KR1020050068213
申请日：2005-07-27
Applicant: 삼성전자주식회사
IPC: H01H59/00
Abstract: An RF MEMS switch is provided to easily detach the switch from a contact surface by differently setting the rigidity of spring elements positioned at left/right sides of a membrane. An RF MEMS(Micro Electro Mechanical System) switch includes support members positioned on a substrate, membranes positioned on both sides of the support members and suspended by spring elements(340a,340b), and a lower electrode formed on an upper surface of the substrate at a position corresponding to the membrane. The spring element positioned on the both sides of the membrane has asymmetric rigidity. When the RF MEMS switch is off, the membrane corresponding to the spring element with higher rigidity is firstly detached from a contact surface.
Abstract translation: 通过不同地设置位于膜的左侧/右侧的弹簧元件的刚度，RF MEMS开关被设置为容易地将开关从接触表面分离。 RF MEMS（微机电系统）开关包括定位在基板上的支撑构件，定位在支撑构件的两侧上并由弹簧元件（340a，340b）悬置的膜以及形成在基板的上表面上的下电极 在对应于膜的位置。 位于膜两侧的弹簧元件具有非对称刚性。 当RF MEMS开关断开时，与刚性较高的弹簧元件相对应的膜首先从接触表面分离。
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Patent Agency Ranking96.发明授权
公开(公告)号：KR100631217B1
公开(公告)日：2006-10-04
申请号：KR1020050068486
申请日：2005-07-27
Applicant: 삼성전자주식회사
Abstract: An integrated filter comprising an FBAR(Film Bulk Acoustic Resonator) and a SAW(Surface Acoustic Wave) resonator and a method for fabricating the same are provided to reduce the size and to improve the yield by integrating the FBAR and the SAW resonator into one substrate. An integrated filter comprising an FBAR and an SAW resonator comprises a substrate(110), a first electrode(120), a first piezoelectric layer(130), a second electrode(150), a second piezoelectric layer(140) and an inter digital transducer(IDT) electrode. The first electrode(120) is located at a predetermined first area of the top surface of the substrate(110). The first piezoelectric layer(130) is located on the first electrode(120). The second electrode(150) is located on the first piezoelectric layer(130). The second piezoelectric layer(140) is located at a predetermined second area of the top surface of the substrate(110). The IDT electrode is located on the second piezoelectric layer(140). The IDT electrode includes a first IDT electrode(160) with a comb structure and a second IDT electrode(170) with the comb structure engaged with the first IDT electrode(160).
Abstract translation: 提供包括FBAR（薄膜体声波谐振器）和SAW（表面声波）谐振器的集成滤波器及其制造方法，以通过将FBAR和SAW谐振器集成到一个基底中来减小尺寸并提高产量 。 包括FBAR和SAW谐振器的集成滤波器包括基板（110），第一电极（120），第一压电层（130），第二电极（150），第二压电层（140）和内部数字 换能器（IDT）电极。 第一电极（120）位于基板（110）的顶表面的预定第一区域处。 第一压电层（130）位于第一电极（120）上。 第二电极（150）位于第一压电层（130）上。 第二压电层（140）位于基板（110）的顶表面的预定第二区域处。 IDT电极位于第二压电层（140）上。 IDT电极包括具有梳状结构的第一IDT电极（160）和梳状结构与第一IDT电极（160）接合的第二IDT电极（170）。
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公开(公告)号：KR100631216B1
公开(公告)日：2006-10-04
申请号：KR1020040034969
申请日：2004-05-17
Applicant: 삼성전자주식회사
IPC: H03H9/24
CPC classification number: H03H9/173 , H03H3/02 , H03H2003/021 , Y10T29/42
Abstract: 에어갭 형 박막벌크음향공진기가 개시된다. 본 에어갭 형 박막벌크음향공진기는 상부 표면의 소정영역에 공동부가 형성된 기판, 제1전극, 압전물질, 및 제2전극이 차례로 적층된 구조로 상기 공동 상부에 형성된 공진부, 및 상기 기판 하부를 관통하여 상기 공동부로 연결된 적어도 하나의 비아홀을 포함한다. 본 에어갭 형 박막벌크음향공진기는 공진특성이 종래에 비해 향상되며, 에어갭 형성 과정에서 공진부의 손상이 최소화될 수 있다.
FBAR(Film Bulk Acoustic Resonator), 압전막, 비아홀, 에어갭-
公开(公告)号：KR100612453B1
公开(公告)日：2006-08-16
申请号：KR1020040093737
申请日：2004-11-16
Applicant: 삼성전자주식회사
Inventor： 김종석
IPC: H04W4/14
Abstract: 본 발명은 웹 서버 기능과 SMS 송수신이 가능한 전화 시스템을 갖추고 외부 인터넷에서 웹 서버로 접속하여 사용자별 단문 메시지를 관리하고, 공중전화망 또는 이동통신망과 연결된 가입자에게 단문 메시지를 전송하는 복합 단말을 이용한 단문메시지 관리 시스템 및 방법에 관한 것으로, 본 발명의 일 측면에 따른 복합 단말을 이용한 단문메시지 관리 방법은, 복합 단말이 착/발신하는 단문메시지에 대한 개별 사용자 각각의 데이터베이스를 복합 단말에 구축하는 단계와 개별 사용자가 인터넷을 통해 상기 복합 단말 제공 웹 서버에 접속하여 사용자별 단문 메시지 관리를 수행하는 단계를 포함한다.
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公开(公告)号：KR1020060025467A
公开(公告)日：2006-03-21
申请号：KR1020040074277
申请日：2004-09-16
Applicant: 삼성전자주식회사
Inventor： 김종석
CPC classification number: H04M3/58 , H04M3/42042 , H04M3/4288 , H04M15/08
Abstract: 본 발명에 따른 2국선 이상의 선로를 갖는 전화 시스템에서의 통화중 착/발신 전환 장치 및 방법은, CID를 이용하여 통화중인 외부 가입자에게 다른 회선을 통해 통화로를 전환함과 동시에 착/발신을 변경하는 것이다. 따라서, 회사(단체)에서 공적인 전화를 받았을 경우, 개인이나 고객이 비용을 부담하지 않고 회사측 전화로 다시 전화통화를 하여 과금문제를 해결할 수 있는 것이다.
2국선, 사설 교환기 시스템, CID, FSK 변조,-
公开(公告)号：KR1020050109870A
公开(公告)日：2005-11-22
申请号：KR1020040034969
申请日：2004-05-17
Applicant: 삼성전자주식회사
IPC: H03H9/24
CPC classification number: H03H9/173 , H03H3/02 , H03H2003/021 , Y10T29/42
Abstract: An air-gap type thin-film bulk acoustic resonator has a substrate having a cavity formed on a predetermined portion of an upper surface thereof; a resonance part having a structure of a first electrode, a piezoelectric substance, and a second electrode deposited in order and formed over the upper side of the cavity; and at least one via hole penetrating a lower surface of the substrate and connecting to the cavity.
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