公开(公告)号：SG135001A1

公开(公告)日：2007-09-28

申请号：SG2003069838

申请日：2003-11-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MUFF SIMON

IPC: H01L25/065 ,  H01L21/58 ,  H01L23/48 ,  H01L23/12 ,  H01L23/31

Abstract: Semiconductor component, especially a memory module has a circuit board with a number of semiconductor chips which are attached to the circuit board with their longitudinal axis perpendicular to it. An Independent claim is made for a method of manufacture of semiconductor memory modules in which the memory chips are manufactured with contacts on both sides of one of their foot or small cross section ends. The chip is then attached to a support circuit board with the longitudinal axis perpendicular to the circuit board.

公开(公告)号：DE102004041888B4

公开(公告)日：2007-03-08

申请号：DE102004041888

申请日：2004-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L23/50 ,  H01L21/60

Abstract: The present invention provides an apparatus having stacked semiconductor components. Two semiconductor components (21, 26) are arranged such that their contact regions (28, 22) are opposite one another. A contact-connection device (29) forms a short electrical connection between the two contact regions (28, 22). The contact regions (28, 22) are connected to external contact regions (36) of the apparatus via a rewiring (23).

公开(公告)号：DE102005041451A1

公开(公告)日：2007-03-01

申请号：DE102005041451

申请日：2005-08-31

Applicant: INFINEON TECHNOLOGIES AG ,  INFINEON TECHNOLOGIES FLASH GM

Inventor： ROEPER HEIKO ,  HANKOFER JOHANNES ,  KOHLHASE ARMIN ,  STEIN VON KAMIENSKI ELARD ,  HEDLER HARRY

IPC: H01R13/66 ,  G06K19/077 ,  H01L23/488 ,  H05K1/18

Abstract: USB (Universal Serial Bus) interface plug in electronic unit has a moulded housing (8) with electronic components (3-5) including multiple layer connection of integrated circuits through a lead frame (7) integrated in a connector with pins (2) and shield (1).

公开(公告)号：DE19943385B4

公开(公告)日：2006-06-14

申请号：DE19943385

申请日：1999-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY

IPC: H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/50

公开(公告)号：DE102004052921A1

公开(公告)日：2006-05-11

申请号：DE102004052921

申请日：2004-10-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  HEDLER HARRY

IPC: H01L21/60 ,  H01L21/56 ,  H01L21/58 ,  H01L21/78 ,  H01L25/065

Abstract: In a method for fabricating semiconductor components a first carrier is provided and at least one semiconductor component is arranged on the first carrier between ist boundary lines. The semiconductor has at least one semiconductor contact-connection region which is located on a first surface of the first carrier. Then conical trenches having sidewalls and a trench bottom are introduced into the first carrier, wherein the sidewalls are inclined by an angle between 0° to 90° with respect to the first carrier and the trenches are arranged along the boundary lines. A conductive layer is applied and patterned in order to form a rewiring device for connecting the semiconductor contact-connection region to one of the inclined sidewalls. A second carrier having an adhesive surface is fitted to the side of the first surface and the first carrier is thinned from one side, which is opposite to the first surface, at least until the trench bottom is exposed in order to singulate the semiconductor component being rewired.

公开(公告)号：DE102004041889A1

公开(公告)日：2006-03-02

申请号：DE102004041889

申请日：2004-08-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY

IPC: H01L21/60 ,  H01L23/50

Abstract: A semiconductor device comprises at least one first semiconductor component being located in a first plane and comprising an active area which has a first contact region and at least one second semiconductor component being located in a second plane and comprising a second active area which has a second contact region. The second semiconductor component is located at a distance vertically to the first semiconductor component and is orientated relative to the first semiconductor component, so that the first active area faces away from the second semiconductor component and the second active area faces away from the first semiconductor component. An adhesive layer is arranged between the first and the second semiconductor components and a frame region adjoins laterally the first semiconductor component and the second semiconductor component on at least one side. The frame region comprises a first surface and a second surface which is located opposite to the second surface. A wiring device is introduced in the frame region and connects the first contact region to the second contact region.

公开(公告)号：DE10221646B4

公开(公告)日：2004-08-26

申请号：DE10221646

申请日：2002-05-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： POHL JENS ,  HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H01L23/48 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L25/065 ,  H01L23/50 ,  H01L21/60

Abstract: Process for connecting chips comprises preparing first chip (1) with first main surface (HF1), preparing second chip (1') with second main surface (HF2) and third main surface (HF3), applying spacer (4) on chips to secure predetermined distance (h) between chips, applying adhesive (8) on first or second main surface, aligning first chip on second chip and joining chips, and hardening adhesive to form solid connection. An Independent claim is also included for a composite chip arrangement prepared by the above process.

公开(公告)号：DE10255844B3

公开(公告)日：2004-07-15

申请号：DE10255844

申请日：2002-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/50

Abstract: Integrated circuit (14) is mounted upside down on carrier (10), such that connection element (15) contacts with insulator (17), through the hole of carrier. Patterned rewriting elements (18, 19) attached in insulator, are internally connected by patterned solder resist element (20). Solder balls (22) are attached in area that is uncovered by resist element, of rewriting element, in patterned form. An Independent claim is also included for integrated circuit.

公开(公告)号：DE10239866B3

公开(公告)日：2004-04-08

申请号：DE10239866

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA

IPC: H01L23/31 ,  H01L21/60 ,  H01L23/50 ,  H01L23/02

Abstract: Production of a semiconductor component (1) comprises; (a) forming electrical contact surfaces together within a smaller contacting region (31) as the whole surface of the front side (33) of the semiconductor chip (3); (b) applying a buffer layer (7) on a rear plate (83) forming the rear side surface (81); (c) applying and fixing the chip on the buffer layer to the rear side; (d) applying a buffer layer on and around the chip; and (e) fixing a contact passage plate (84) with a recess (85) on the buffer layer on the front side of the chip. An Independent claim is also included for an alternative process for the production of the semiconductor component.

公开(公告)号：DE10236184A1

公开(公告)日：2004-02-19

申请号：DE10236184

申请日：2002-08-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA ,  IRSIGLER ROLAND ,  STRUTZ VOLKER

IPC: H01L23/04 ,  H01L23/32 ,  H01L23/50

Abstract: A semiconductor element (1) for mounting on a conductor plate comprises a chip (3) with a housing (4) and electrical contacts (5) directly to the plate. The housing is only glued to the chip and has a protective cover (8) and frame (9) which does not touch the chip but mechanically supports the housing on the plate.