Abstract:
PROBLEM TO BE SOLVED: To provide a film forming device to form a film with a mask fixed on a main surface side of a substrate, wherein only a little force is required for peeling off the mask from the substrate, and the mask is easily attached and detached. SOLUTION: The film forming device is equipped with: a substrate holding means 11; and a mask fixing means to fix the mask M having an opening pattern on the main surface side of the substrate W fixed and held by the substrate holding means 11. The device is used when the film is formed on the main surface side of the substrate W via the mask fixed by the mask fixing means, and characterized in that the substrate supporting surface 11a in the substrate holding means 11 is convexly curved. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To supply raw gas to the whole surface of a substrate when gasified organic raw material is supplied to the substrate. SOLUTION: Diffusers 7a-7d for diffusing raw gas are installed in a film forming chamber 2. The substrate 3 is installed so as to face the diffusers 7a-7d. A substrate holder 4 holding the substrate 3 vertically holds the substrate 3 and slides the substrate 3 along a row of the diffusers 7. The raw gas diffused from the diffusers 7a-7d is supplied to the whole surface of the substrate 3. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To enable an n-type AlGaN clad layer and a p-type AlGaN clad layer, which are both superior in quality, to grow so as to manufacture a high- performance semiconductor laser. SOLUTION: In a method of manufacturing a GaN semiconductor laser, the growth temperature of the p-type AlGaN clad layer is set lower than that of the n-type AlGaN clad layer, and the growth temperatures of the p-type AlGaN clad layer and the n-type AlGaN clad layer are set equal to that of a GaInN active layer or above and set at 980°C or below, e.g. 930 to 960°C. It is preferable that the surface of a base is covered with a p-type AlGaN cap layer which has been grown at the growth temperature nearly equal to that of the GaInN active layer or below before the p-type AlGaN clad layer is grown. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting element which can emit light with an optional wavelength; and a light-emitting apparatus which has a simple construction without the necessity for a vacuum state or high voltage and is not substantially degraded. SOLUTION: This light-emitting element has a semiconductor laminate structure of which the luminescent layer, which emits light by the excitation under the irradiation with ultraviolet rays, contains a group III-V compound represented by formula (I) Ba Alb Gac Ind Nw Asx Py Sbz (wherein a, b, c, d, w, x, y, and z satisfy the following equations: a+b+c+d=1; a,b,c,d>=0; w+x+y+z=1; and w,x,y,z>=0). The light-emitting apparatus has the emitter and an ultraviolet source comprising a semiconductor laser or a light-emitting diode.
Abstract translation:要解决的问题:提供一种可以发射具有任选波长的光的发光元件; 以及具有简单结构而不需要真空状态或高电压且基本上不劣化的发光装置。 解决方案:该发光元件具有通过在紫外线照射下通过激发发光的发光层含有式(I)表示的III-V族化合物的半导体叠层结构Ba Alb Gac Ind Nw Asx Py Sbz(其中a,b,c,d,w,x,y和z满足以下等式:a + b + c + d = 1; a,b,c,d> = 0; w + x + y + z = 1; w,x,y,z> = 0)。 发光装置具有发射极和包含半导体激光器或发光二极管的紫外线源。
Abstract:
PROBLEM TO BE SOLVED: To provide a nitride semiconductor, having a large low-defect region on the surface and a semiconductor element using the same, and also to provide a method of manufacturing the nitride semiconductor which enables easy reduction of surface defects in a layer formation process using lateral growth technology, and to provide a method of manufacturing the semiconductor element using the nitride semiconductor. SOLUTION: On a substrate 100, a seed crystal section 105 is formed into a stripe geometry via a buffer layer 100a, and next, a crystal is grown from the seed crystal section 105 in two-stage growing conditions, to form a nitride semiconductor layer 107. In the first stage, a low-temperature growth section 107a, whose cross-sectional shape in the thickness direction is trapezoidal, is formed at a growing temperature of 1,030 deg.C, and in the second stage; a lateral growth is made to progress dominantly at a growing temperature of 1,070 deg.C, to form a high-temperature growth section 107b between the low-temperature growth sections 107a; consequently, on the surface of the nitride semiconductor layer 107, hillocks and normal lattice defects are reduced in sections which are higher than the low-temperature growth sections 107a.
Abstract:
PROBLEM TO BE SOLVED: To solve the problem, when semiconductor layers are formed by laterally growing the layers from a plurality of spots, of the meting sections of the layers not being neatly joining to each other on the atomic level and cause crystal defects, the crystallographic axes of the layers are deviated on the left and right sides of the joints, and the surfaces of the layers become rough due to stresses. SOLUTION: A method of manufacturing nitride semiconductor device includes a step of forming a mask layer 22, composed of a silicon oxide film having a plurality of openings 23 on a gallium nitride layer (first semiconductor layer) 11 formed on a substrate 10, and a step of laterally growing gallium nitride layers (second semiconductor layers) 12, along the surface of the gallium nitride layer 11 from the surfaces of the layer 11 exposed through the openings 23. The growth of one (12a) of the gallium nitride layers 12 is stopped, immediately before the layer 12a meets the adjacently grown other gallium nitride layer (12b) of the layers 12.
Abstract:
PROBLEM TO BE SOLVED: To provide a display device which has superior productivity, a wide field angle, and low power consumption, and is thin. SOLUTION: This device has a light emission part 10 including a semiconductor light emitting element which emits light of a prescribed wavelength, a shutter part 20 which controls the passage of the light emitted by the light emission part in pixel units, and a fluorescent body part 30 including fluorescent bodies 30R, 30G, and 30B which are excited with the light arriving from the light emission part 10 through the shutter part 20 to emit visible light.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor element and its manufacturing method for improving crystallization of nitride-based III-V group compound semiconductor on a sapphire substrate. SOLUTION: After a seed crystal layer 12 with a crystal part 12A made of nitride-based III-V group compound semiconductor crystal and an opening 12B is formed on a sapphire substrate, a recess 11B continuously joined to the opening 12B is formed in the sapphire substrate. An n-side contact layer 15 is grown from the crystal part 12A. As a result, a crystal grown sidewise from the crystal part 12A is prevented from being in contact with the sapphire substrate 11, and the n-side contact layer 15 and the nitride-based III-V group compound semiconductor crystal have a low density of through dislocation while a fluctuation in crystal orientation is made small.
Abstract:
PROBLEM TO BE SOLVED: To improve conductivity by making current easy to flow across a hetero interface in a semiconductor device or a semiconductor light-emitting element containing the hetero interface where two nitride III-V compound semiconductor layers different from each other are in contact with each other and a band discontinuity exists. SOLUTION: In a semiconductor device or a semiconductor light-emitting element containing a hetero interface where two nitride III-V compound semiconductor layers different from each other are in contact with each other and a band discontinuity exists, a superlattice layer or a composition gradient layer extinguishing or decreasing the band discontinuity falsely is inserted in the hetero interface. In a GaN semiconductor laser, an n-type AlGaN/GaN superlattice layer 5 or an n-type AlGaN graded layer is inserted in a hetero interface between an n-type GaN contact layer 4 and an n-type AlGaN clad layer 6, and a p-type AlGaN/GaN superlattice layer 12 or a p-type AlGaN graded layer is inserted in a hetero interface between a p-type AlGaN clad layer 11 and a p-type GaN contact layer 13.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for growing a nitride III-V compound semiconductor which enables efficient growth of a nitride-based III-V compound semiconductor of high quality. SOLUTION: The pressure inside a reaction tube 1 of an MOCVD device is set at not less than 1.1 atm., particularly not less than 1.1 atm. and not more than 2 atm., preferably 1.2-1.8 atm., and a nitride-based III-V compound semiconductor, for example, GaN, InGaN or the like is grown. The reaction tube 1 is made of quartz glass so as to obtain sufficient strength for withstanding the difference between inner and outer pressures. The surface of a substrate 3 on which the nitride-based III-V compound semiconductor may face upward or downward.