Abstract:
A semiconductor light emitting device using nitride III-V compound semiconductors is improved to reduce the threshold current density with almost no increase of the operation voltage. In a GaN semiconductor laser as one version thereof, the p-type cladding layer (10) is made of two or more semiconductor layers (10a, 10b) different in band gap, and a part (10a) of the p-type cladding layer (10) near one of its boundaries nearer to the active layer is made of a semiconductor layer having a larger band gap than that of the remainder part (10b). More specifically, in a AlGaN/GaN/GaInN SCH-structured GaN semiconductor laser, a p-type AlGaN cladding layer (10) is made of a p-type Alx1Ga1-x1N layer (10a) in contact with a p- type GaN optical guide layer (9), and a p-type Alx2Ga1-x2N layer (10b) overlying the p-type Alx1Ga1-x1N layer (10a) (where 0≤x2
Abstract:
A semiconductor light emitting device using nitride III-V compound semiconductors is improved to reduce the threshold current density with almost no increase of the operation voltage. In a GaN semiconductor laser as one version thereof, the p-type cladding layer (10) is made of two or more semiconductor layers (10a, 10b) different in band gap, and a part (10a) of the p-type cladding layer (10) near one of its boundaries nearer to the active layer is made of a semiconductor layer having a larger band gap than that of the remainder part (10b). More specifically, in a AlGaN/GaN/GaInN SCH-structured GaN semiconductor laser, a p-type AlGaN cladding layer (10) is made of a p-type Alx1Ga1-x1N layer (10a) in contact with a p- type GaN optical guide layer (9), and a p-type Alx2Ga1-x2N layer (10b) overlying the p-type Alx1Ga1-x1N layer (10a) (where 0≤x2
Abstract:
PROBLEM TO BE SOLVED: To reduce speckles without lowering utilization efficiency of light in each wavelength band. SOLUTION: In an image projector that has a light source outputting light of different wavelengths and one-dimensional light modulator, there is arranged a light scattering element 20 in the one-dimensional intermediate image forming position of light by the light modulator. This light scattering element 20 is provided with diffraction gratings 20R, 20G, 20B corresponding to each wavelength of the light source, and is arranged in the manner that the image forming position of the one-dimensional intermediate image corresponding to each wavelength is shifted in the direction of the arrow x corresponding to the scanning direction of a scanning optical system. The diffraction angle for each wavelength is uniformized; thus, the lowering of the utilization efficiency of light is avoided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To display a horizontally long image with an excellent image quality. SOLUTION: An image projection apparatus is configured to scan a light beam, modulated by a one-dimensional spatial light modulating element, by a polygon scanner having four or five mirror facets in a direction that is substantially perpendicular to the length direction of the one-dimensional spatial light modulating element so as to display an image. Optical precision can be maintained and the light beam can efficiently be projected by using the polygon scanner having four or five mirror facets. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of growing a semiconductor layer, which suppresses the size of produced voids in the Pendeo growth method and also the inclination of the c-axis of the crystal in the semiconductor layer to reduce defects in this layer, and to provide a method of manufacturing semiconductor light-emitting elements using the same. SOLUTION: A first semiconductor layer 12b of a III-V compound, such as GaN, is projectedly formed on a substrate 11, and a second semiconductor layer 12 of a III-V compund, such as GaN, is grown in vapor phase on the first layer 12b surface at a higher growth rate Gb in a main surface inward direction of the substrate than the growth rate Ga in the vertical direction with respect to the main surface of the substrate with the pressure in a vapor phase growth reactor chamber being controlled, so that this pressure is higher than 400 Torrs, whereby the side S of the underside of the second semiconductor layer 12 makes an acute angle with its underside so that the side S forms a (11-22) plane, etc.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-quality nitride III-V compound semiconductor light-emitting element, by which problem of nonuniformity in mixed crystal composition of a nitride III-V compound semiconductor layer is settled, especially for improved uniformity in mixed crystal, when indium is contained. SOLUTION: A manufacturing method of a semiconductor light-emitting element such as a laser diode is provided which comprises a process where, by an organic metal chemical vapor-phase growth method, the nitride III-V compound semiconductor layer containing indium and the like is crystal-grown and formed. Here, the flow velocity of material gas 34 containing ammonia gas and the like in a reactive tube 30 for crystal growth is set to 3-5 m/s while the pressure in the reactive tube is set to higher than a normal pressure, to form at least a part of the III-V compound semiconductor layer such as a light- emitting layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride III-V compound semiconductor, which is high in crystallinity and does not lack nitrogen, even if it is grown at a low temperature and a method of manufacturing a semiconductor device by the use of the same. SOLUTION: Material gas, which contains hydrazine or its substitution product or nitrogen-containing compound such as amine or azide as a nitrogen material, is fed to the reaction tube of an MOCVD device together with the carrier gas. These nitrogen-containing compounds have a higher decomposition efficiency than ammonia. Therefore, even if growth temperature is 900 deg.C or lower, when a MOCVD is carried out, a large amount of nitrogen material seeds conductive to the growth of a semiconductor layer can be supplied onto the growth surface (that is, on a base layer 23) of a substrate 21. Therefore, a nitride III-V compound semiconductor layer 24 can be improved in crystallinity. The supplied amount of nitrogen material can be reduced with respect to that of the V element material.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device where electric characteristic is excellent, the life can be prolonged and the freedom of design can be improved by obtaining a nitride based III-V compound semiconductor layer excellent in crystallinity, in a semiconductor device where the nitride based III-V compound semiconductor layer is formed, and to provide a manufacturing method of the device. SOLUTION: In a nitride based III-V compound semiconductor device where an epitaxial growth semiconductor layer 4 containing a GaN layer is formed on a sapphire substrate 2, lattice constant (a) of the GaN layer is made at least lower than or equal to 0.3183 nm. Thereby a nitride based III-V compound semiconductor layer excellent in crystallinity can be obtained.
Abstract:
PROBLEM TO BE SOLVED: To manufacture nitride based III-V compound semiconductor in which non-luminescence center is few and crystallinity is superior. SOLUTION: In this method, a nitride based III-V compound semiconductor is manufactured by vapor deposition using material of a group III element, ammonia as material of group V element and hydrogen. Vapor phase mol. ratio (H2/(H2+NH3) of hydrogen to the total amount of hydrogen and ammonia is specified as 0.3