Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
In a multi-beam semiconductor laser including nitride III-V compound semiconductor layers stacked on one surface of a substrate of sapphire or other material to form laser structures, and including a plurality of anode electrodes and a plurality of cathode electrodes formed on the nitride III-V compound semiconductor layers, one of the anode electrodes is formed to bridge over one of the cathode electrodes via an insulating film, and another anode electrode is formed to bridge over another of the cathode electrodes via an insulating film.
Abstract:
A multi−beam semiconductor laser element (40) which provides a uniform light output from each beam, for ease of positioning, and which is a GaN multi−beam semiconductor laser element having four laser stripes (42A, 42B, 42C, 42D) emitting laser beams of the same wavelength. Each laser stripe (42A−42D) has a p−side common electrode (48) on a mesa (46) formed on a sapphire substrate (44), and respective laser stripes have respective active regions (50A, 50B. 50C, 50D). Two n−side electrodes (52A, 52B) are provided on an n−type GaN contact layer (54) on the opposite sides of the mesa (46) as common electrode facing the p−side common electrode (48). The distance A between the laser stripe (42A) and the laser stripe (42D) is up to 100 μm. The distance B 1 between the laser stripe (42A) and the laser−side end of the n−side electrode (52B) is up to 150 μm, and the distance B 2 between the laser stripe (42D) and the laser−side end of the n−side electrode (52A) is up to 150 μm.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
A GaN III-V compound semiconductor light-emitting device with high luminous efficiency and high reliability is disclosed which has an emission wavelength of not less than 440 nm. A GaN semiconductor laser device (10) comprises a stripe projected portion (18) composed of the surface layer of a sapphire substrate (12), a buffer layer (14) and a first GaN layer (16), and a multilayer structure on the sapphire substrate which is composed of a second GaN layer (20), an n-side cladding layer (22), an n-side guide layer (24), an active layer (26), a deterioration-preventing layer (28), a p-side guide layer (30), a p-side cladding layer (32), and a p-side contact layer (34). The active layer is formed as a quantum well structure of a GaInN barrier layer (36) and a GaInN well layer (38), and a planer crystal defect-suppressing layer (40) composed of an AlGaN layer is interposed between the barrier layer and either or both of the upper and lower surfaces of the well layer. The upper portions of the p-side contact layer and the p-side cladding layer are formed as a stripe ridge (42), and a mesa (44) is formed parallel to the ridge.
Abstract:
A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 mu m. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 mu m while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 mu m.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 mu m. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 mu m while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 mu m.