公开(公告)号：KR1020170002547A

公开(公告)日：2017-01-06

申请号：KR1020167033906

申请日：2015-05-08

Applicant: 인벤센스, 인크.

Inventor： 차이,줄리어스밍-린 ,  캐그다이저,바리스 ,  림,마틴 ,  켄킨,알렉시에스.

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 적어도하나의환경센서및 적어도하나의 MEMS 음향센서의집적된패키지가개시된다. 이패키지는양 센서들을환경에노출시키는공유포트를포함하며, 환경센서는환경특성을측정하고음향센서는음향파들을측정한다. 포트는환경센서를공기흐름에노출시키고음향센서를음향파들에노출시킨다. 음향센서의실례는마이크로폰이며, 환경센서의실례는습기센서이다.

Abstract translation: 公开了至少一个环境传感器和至少一个MEMS声学传感器的集成封装。 该包装包含共享端口，将两个传感器公开到环境中，其中环境传感器测量环境的特性并且声学传感器测量声波。 该端口将环境传感器暴露于气流，声传感器暴露于声波。 声学传感器的示例是麦克风，并且环境传感器的示例是湿度传感器。

公开(公告)号：KR1020160091133A

公开(公告)日：2016-08-02

申请号：KR1020150011400

申请日：2015-01-23

Applicant: 엘지이노텍 주식회사

Inventor： 서상원 ,  서정기

IPC: B81B3/00 ,  G01R29/08 ,  B81B7/00

CPC classification number: B81B3/0018 ,  B81B7/0032 ,  B81B2201/0292 ,  G01R29/08

Abstract: 멤스자계센서가개시된다. 상기멤스자계센서는고정전극및 측정대상전류의자계에따라상기고정전극에대하여이동가능한구동전극을포함하는멤스자계센서에있어서, 상기구동전극은, 지지층; 상기지지층상부에형성되며감지기준전압을인가받는신호라인; 상기지지층상부에서상기신호라인과소정간격이격되어형성되는절연층; 및상기절연층상부표면을따라형성되며기준전류의유동경로를제공하는전류라인을포함하는멤스자계센서를제공한다.

Abstract translation: 公开了一种MEMS磁场传感器。 MEMS磁场传感器具有固定电极和能够根据待测电流的磁场相对于固定电极移动的驱动电极。 根据MEMS磁场传感器，驱动电极包括：支撑层; 信号线，形成在支撑层的上部，并施加检测基准电压; 绝缘层，形成为与支撑层的上部的信号线隔开预定距离; 以及沿绝缘层的上表面形成的电流线，提供参考电流的移动路径。

公开(公告)号：KR1020120004936A

公开(公告)日：2012-01-13

申请号：KR1020110066837

申请日：2011-07-06

Applicant: 로베르트 보쉬 게엠베하

Inventor： 샤프,울리히 ,  쿠글러,안드레아스 ,  브륀델,마티아스 ,  준더마이어,프리더

IPC: B81C1/00 ,  B81B7/00 ,  G01D21/02 ,  H01L27/00

CPC classification number: G01R33/0052 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2203/0154 ,  G01P15/0802 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  B81C1/00023 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00261 ,  B81C2203/01 ,  G01D21/02 ,  H01L27/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PURPOSE: A sensor module and a method of manufacturing the sensor module are provided to enable simple and cheap fixing of a micro-electric machine member and reduce a space to arrange integrated circuit and the micro-electric machine member on a temporary carrier. CONSTITUTION: A method of manufacturing a sensor module(M) is as follows. A metallic carrier is supplied to a temporary carrier. One or more integrated circuits(3a) are arranged on the temporary carrier. One or more micro-electric machine members(3b) are arranged on the temporary carrier. The micro-electric machine members make contact with the contact surface(1) of the metallic carrier using preferably wire bonding(6). The integrated circuits, the micro-electric machine members and the wire bonding are encased(7). The integrated circuits make contact with the contact surface using at least one re-wiring layer(8).

Abstract translation: 目的：提供一种传感器模块和制造传感器模块的方法，以使得能够简单且便宜地固定微电机构件，并且减小了将集成电路和微电机构件布置在临时载体上的空间。 构成：制造传感器模块（M）的方法如下。 金属载体被提供给临时载体。 一个或多个集成电路（3a）布置在临时载体上。 一个或多个微电机构件（3b）布置在临时载体上。 微电机构件使用优选的引线接合（6）与金属载体的接触表面（1）接触。 集成电路，微电机构件和引线接合被封装（7）。 集成电路使用至少一个再布线层（8）与接触表面接触。

公开(公告)号：KR101027892B1

公开(公告)日：2011-04-07

申请号：KR1020080028284

申请日：2008-03-27

Applicant: 인더스트리얼 테크놀로지 리서치 인스티튜트

Inventor： 쉔,렁-타이 ,  슈,슌-헌 ,  호,쩡-쉐 ,  짜이,보르-쉔

IPC: H01L23/58

CPC classification number: B81C1/00793 ,  B81B7/0054 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/053 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13023 ,  H01L2924/1461 ,  H01L2924/00

Abstract: 웨이퍼 레벨 센싱 패키지 및 그 제조 공정이 설명된다. 그 공정은 센싱 영역과 패드를 갖는 센싱 칩을 갖는 웨이퍼를 구비하는 단계; 웨이퍼에 스트레스 완화층을 형성하는 단계; 스트레스 완화층에 포토레지스트층을 클래드하는 단계; 개구 영역과 센싱 영역을 노출함이 없이 패드 및 스트레스 완화층의 일부를 노출하도록 포토레지스트층을 패턴하는 단계; 포토레지스트층에 의해 노출된 스트레스 완화층의 부분에 재배선 패드의 도전성 금속층을 형성하는 단계; 포토레지스트층을 제거하는 단계; 스트레스 완화층과 도전성 금속층에 리클래딩 포토레지스트층을 형성하는 단계; 재분배 패드 영역 상부의 리클래딩 포토레지스트층에 홀을 형성하는 단계; 도전성 금속층에 전기적으로 연결하기 위해 홀에 도전성 범프를 형성하는 단계를 포함한다.

公开(公告)号：EP3495318A2

公开(公告)日：2019-06-12

申请号：EP18210961.1

申请日：2018-12-07

Applicant: Infineon Technologies AG

Inventor： CHIANG, Chau Fatt ,  CHUA, Kok Yau ,  KUEK, Hsieh Ting ,  BAKAR, Roslie Saini bin ,  ABDUL WAHID, Junny ,  CHONG, Hock Heng ,  POK, Pei Luan ,  LEE, Chee Hong ,  SCHMALZL, Stefan ,  REISS, Werner ,  CHIN, Kon Hoe ,  LIEW, Soon Lee ,  OTHMAN, Nurfarena ,  TUAZON BERNARDEZ, April Coleen

IPC: B81B7/00 ,  B81C1/00

CPC classification number: H01L25/0657 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00095 ,  B81C2203/0154 ,  B81C2203/032 ,  B81C2203/0792 ,  H01L23/10 ,  H01L23/31 ,  H01L23/3157 ,  H01L23/498 ,  H01L23/49838 ,  H01L25/065 ,  H01L2225/06548 ,  H01L2225/06572

Abstract: Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

公开(公告)号：EP2972263A1

公开(公告)日：2016-01-20

申请号：EP14767515.1

申请日：2014-03-09

Applicant: Robert Bosch GmbH

Inventor： O'BRIEN, Gary ,  FEYH, Ando ,  GRAHAM, Andrew ,  SAMARAO, Ashwin ,  YAMA, Gary

IPC: G01N27/22

CPC classification number: G01N27/223 ,  B81B7/0006 ,  B81B2201/0292 ,  G01N27/225

Abstract: A trenched base capacitive humidity sensor includes a plurality of trenches formed in a conductive layer, such as polysilicon or metal, on a substrate. The trenches are arranged parallel to the each other and partition the conductive layer into a plurality of trenched silicon electrodes. At least two trenched silicon electrodes are configured to form a capacitive humidity sensor. The trenches that define the trenched silicon electrodes can be filled partially (
e.g. , sidewall coverage) or completely with polyimide (PI) or silicon nitride (SiN). A polyimide layer may also be provided on the conductive layer over the trenches and trenched electrodes. The trenches and the trenched silicon electrodes may have different widths to enable different sensor characteristics in the same structure.

Abstract translation: 沟底基电容式湿度传感器包括在基板上形成在诸如多晶硅或金属的导电层中的多个沟槽。 沟槽彼此平行地布置并且将导电层分隔成多个沟槽硅电极。 至少两个沟槽硅电极被配置成形成电容式湿度传感器。 限定沟槽硅电极的沟槽可以部分地（例如，侧壁覆盖）填充或完全用聚酰亚胺（Pl）或氮化硅（SiN）填充。 也可以在沟槽和沟槽电极上的导电层上设置聚酰亚胺层。 沟槽和沟槽硅电极可以具有不同的宽度，以实现相同结构中不同的传感器特性。

公开(公告)号：EP2793019A3

公开(公告)日：2015-07-15

申请号：EP14168977.8

申请日：2004-03-17

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Xie, Jun ,  Shih, Jason ,  Tai, Yu-Chong

IPC: G01N27/22 ,  B01L1/00 ,  G01L9/00

CPC classification number: G01N27/226 ,  B81B7/02 ,  B81B2201/0292 ,  B81B2201/058 ,  G01L9/0042 ,  G01L9/0072

Abstract: A microfluidic device and method for capacitive sensing. The device includes a fluid channel including an inlet at a first end and an outlet at a second end, a cavity region coupled to the fluid channel, and a Parylene membrane coupled between the fluid channel and the cavity region. Additionally, the device includes a first capacitor electrode coupled to the membrane, a second capacitor electrode coupled to the cavity region and physically separated from the first capacitor electrode by at least the cavity region, and an electrical power source coupled between the first capacitor electrode and the second capacitor electrode and causing an electric field at least within the cavity region.

公开(公告)号：EP2829509A1

公开(公告)日：2015-01-28

申请号：EP14177871.2

申请日：2014-07-21

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Ollier, Eric ,  Marcoux, Carine

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B7/007 ,  B81B2201/0214 ,  B81B2201/0292 ,  B81B2201/058 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00309 ,  B81C2203/0118 ,  G01N30/6095

Abstract: Dispositif comportant un substrat comprenant une structure microélectronique et/ou nanoélectronique comportant au moins une partie sensible et un canal fluidique (2) défini entre ledit substrat et un capot (6), ledit canal comportant au moins deux ouvertures pour assurer une circulation dans ledit canal, ladite structure étant située à l'intérieur du canal fluidique, ledit capot étant assemblé avec le substrat au niveau d'une interface d'assemblage, ledit dispositif comportant des connexions électriques (8) entre ladite structure et l'extérieur du canal fluidique, ces connexions étant formées par des vias réalisés à travers le substrat (4) à l'aplomb de ladite structure et en contact électrique avec ladite structure, ledit dispositif comportant également une couche intermédiaire (120, 220) située au moins en partie dans le canal fluidique et recouvrant au moins en partie la structure à l'exception de sa partie sensible.

公开(公告)号：EP2663842A1

公开(公告)日：2013-11-20

申请号：EP12734282.2

申请日：2012-01-11

Applicant: Inputive Corporation

Inventor： BONNAT, Pierre

IPC: G01F1/68

CPC classification number: G01P5/04 ,  B81B7/0061 ,  B81B2201/0292 ,  B81B2203/0118 ,  B81B2203/0163 ,  G01P13/0026 ,  G01P13/0033

Abstract: A MEMS/MOEMS sensor and method for using such sensor to detect a person's breath or other fluid for purposes of controlling a user interface of an electronic device.

公开(公告)号：EP2252727A2

公开(公告)日：2010-11-24

申请号：EP09722137.8

申请日：2009-03-12

Applicant: GSI Helmholtzzentrum für Schwerionenforschung GmbH

Inventor： CORNELIUS, Thomas ,  ENSINGER, Wolfgang ,  NEUMANN, Reinhard ,  RAUBER, Markus

IPC: C25D1/08 ,  C25D5/18

CPC classification number: C25D1/006 ,  B01J19/0093 ,  B01J23/42 ,  B01J23/72 ,  B01J35/0006 ,  B01J2219/00783 ,  B01J2219/00835 ,  B01J2219/00846 ,  B01J2219/00853 ,  B01J2219/0086 ,  B01J2219/00873 ,  B22F1/0025 ,  B22F3/002 ,  B81B2201/0292 ,  B81B2201/051 ,  B81C99/0085 ,  B82Y15/00 ,  B82Y30/00 ,  B82Y40/00 ,  C25D1/00 ,  C25D1/003 ,  C25D1/04 ,  C25D1/08 ,  C25D5/18 ,  G01F1/688 ,  G01N25/00 ,  Y10S977/762 ,  Y10T29/49117 ,  Y10T428/12201 ,  Y10T428/12389 ,  Y10T428/24562 ,  Y10T428/24893 ,  Y10T428/25

Abstract: The invention relates to a nanowire structural element suitable for installing, for example, in a microreactor system or microcatalyst system. A template-based method is used for producing the nanowire structural element, wherein electrochemical deposition of the nanowires takes place in nanopores, preferably continuing at least until caps have formed and at least partially grown together. After reinforcing the two cover layers, the structured hollow space between the two cover layers is exposed by dissolving the template foil and removing the dissolved template material, wherein the two cover layers remain intact. The result is a stable, sandwich-like nanostructure having a two-dimensional, open-celled hollow space structure, bounded on two sides by the cover layers and penetrated by the nanowires in a columnar manner in the plane parallel to the cover layers.

Abstract translation: 本发明涉及适用于例如安装在微反应器系统或微型催化剂系统中的纳米线结构元件。 使用基于模板的方法来制造纳米线结构元件，其中纳米线的电化学沉积发生在纳米孔中，优选至少持续直到帽已经形成并且至少部分地一起生长。 在增强两个覆盖层之后，通过溶解模板箔片并去除溶解的模板材料来暴露两个覆盖层之间的结构化中空空间，其中两个覆盖层保持完整。 其结果是具有二维开孔中空结构的稳定的三明治状纳米结构，其两侧由覆盖层界定，并且在平行于覆盖层的平面中以柱状方式被纳米线穿透。