公开(公告)号：US20130029157A1

公开(公告)日：2013-01-31

申请号：US13386049

申请日：2010-07-20

Applicant: Nakis Karapatis

Inventor： Nakis Karapatis

IPC: B81C1/00 ,  B81B1/00

CPC classification number: B81C1/00682 ,  B81B2201/035 ,  B81C1/00674 ,  B81C2201/0178 ,  Y10T29/49986

Abstract: A method of fabricating a reinforced silicon micromechanical part includes: micromachining the part, or a batch of parts in a silicon wafer; forming a silicon dioxide layer over the entire surface of the part, in one or plural operations, so as to obtain a thickness of silicon dioxide that is at least five times greater than the thickness of native silicon dioxide; and removing the silicon dioxide layer by etching.

Abstract translation: 制造增强硅微机械部件的方法包括：在硅晶片中微加工所述部件或一批部件; 在一个或多个操作中在整个表面上形成二氧化硅层，以获得比天然二氧化硅的厚度大至少五倍的二氧化硅的厚度; 并通过蚀刻去除二氧化硅层。

公开(公告)号：US20110303546A1

公开(公告)日：2011-12-15

申请号：US13212636

申请日：2011-08-18

Applicant: Clément SAUCY

Inventor： Clément SAUCY

IPC: C25D1/00 ,  C25D7/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

公开(公告)号：US08025782B2

公开(公告)日：2011-09-27

申请号：US11717773

申请日：2007-03-14

Applicant: Clément Saucy

Inventor： Clément Saucy

IPC: C25D1/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。

公开(公告)号：US20110062112A1

公开(公告)日：2011-03-17

申请号：US12952825

申请日：2010-11-23

Applicant: Clément SAUCY

Inventor： Clément SAUCY

IPC: C25D1/20 ,  C25D1/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。

公开(公告)号：US20070227893A1

公开(公告)日：2007-10-04

申请号：US11717773

申请日：2007-03-14

Applicant: Clement Saucy

Inventor： Clement Saucy

IPC: C25D5/02 ,  C25D1/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。

公开(公告)号：US20070065595A1

公开(公告)日：2007-03-22

申请号：US11601780

申请日：2006-11-20

Applicant: Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: C23C14/02

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。

公开(公告)号：US20010023010A1

公开(公告)日：2001-09-20

申请号：US09791634

申请日：2001-02-26

Applicant: Fuji Xerox Co. Ltd.

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: B44C001/22 ,  C03C015/00 ,  B32B001/00

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

公开(公告)号：US6082208A

公开(公告)日：2000-07-04

申请号：US53569

申请日：1998-04-01

Applicant: M. Steven Rodgers ,  Jeffry J. Sniegowski ,  Samuel L. Miller ,  Paul J. McWhorter

Inventor： M. Steven Rodgers ,  Jeffry J. Sniegowski ,  Samuel L. Miller ,  Paul J. McWhorter

IPC: B81B5/00 ,  F16H19/00 ,  F16H57/00

CPC classification number: B81C1/00198 ,  F16H19/00 ,  B81B2201/035 ,  B81B2203/06 ,  Y10S310/06 ,  Y10T74/19614 ,  Y10T74/19619

Abstract: A process for forming complex microelectromechanical (MEM) devices having five layers or levels of polysilicon, including four structural polysilicon layers wherein mechanical elements can be formed, and an underlying polysilicon layer forming a voltage reference plane. A particular type of MEM device that can be formed with the five-level polysilicon process is a MEM transmission for controlling or interlocking mechanical power transfer between an electrostatic motor and a self-assembling structure (e.g. a hinged pop-up mirror for use with an incident laser beam). The MEM transmission is based on an incomplete gear train and a bridging set of gears that can be moved into place to complete the gear train to enable power transfer. The MEM transmission has particular applications as a safety component for surety, and for this purpose can incorporate a pin-in-maze discriminator responsive to a coded input signal.

Abstract translation: 一种用于形成具有五层或多层多晶硅的复合微机电（MEM）器件的方法，包括可形成机械元件的四个结构多晶硅层，以及形成电压参考平面的下层多晶硅层。 可以使用五电平多晶硅工艺形成的特定类型的MEM器件是用于控制或互锁静电电动机和自组装结构之间的机械功率传递的MEM传输（例如，铰链式弹出式反射镜，用于与 入射激光束）。 MEM传动基于不完整的齿轮系和可以移动到位的桥接齿轮组，以完成齿轮系以实现功率传递。 MEM传输具有特定应用作为保证的安全部件，为此，可以根据编码的输入信号结合引入迷宫识别器。

公开(公告)号：US5729074A

公开(公告)日：1998-03-17

申请号：US407155

申请日：1995-03-20

Applicant: Hiromu Shiomi ,  Yoshiki Nishibayashi ,  Shin-ichi Shikata

Inventor： Hiromu Shiomi ,  Yoshiki Nishibayashi ,  Shin-ichi Shikata

IPC: B81B3/00 ,  B81C1/00 ,  G01C19/56 ,  G01H3/08 ,  G01H11/00 ,  G01H11/06 ,  G01L9/00 ,  G01P15/08 ,  G01P15/125 ,  G01Q70/14 ,  G01Q80/00

CPC classification number: G01P15/0802 ,  B81B3/007 ,  B81C1/0015 ,  B81C1/00682 ,  G01H11/00 ,  G01H11/06 ,  G01H3/08 ,  G01P15/125 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/034 ,  B81B2201/035 ,  B81B2201/054 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C2201/0109 ,  G01P2015/0828

Abstract: A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.

公开(公告)号：US5364742A

公开(公告)日：1994-11-15

申请号：US948189

申请日：1992-09-21

Applicant: Long-Shen Fan ,  Hans H. Zappe

Inventor： Long-Shen Fan ,  Hans H. Zappe

IPC: C23C28/00 ,  B81B5/00 ,  B81C99/00 ,  G03F7/00 ,  G03F7/11 ,  G03F7/26 ,  H01L21/306 ,  H02N1/00 ,  G03C5/00 ,  B44C1/22

CPC classification number: G03F7/11 ,  B81C99/0085 ,  G03F7/00 ,  H02N1/008 ,  B81B2201/035 ,  B81B2201/037

Abstract: In the fabrication of a free-standing miniaturized structure in a range of about 10 to 20 .mu.m thick, a method based on a sacrificial system includes the steps of selecting a substrate material, depositing on the substrate material a sacrificial layer of material and patterning the sacrificial layer to define a shape. A photoresist layer of material is deposited on the sacrificial layer and patterned by contrast-enhanced photolithography to form a photoresist mold. Upon the mold there is plated a metallic layer of material. The electroplated structure conforms to the resist profile and can have a thickness many times that of conventional polysilicon microstructures. The photoresist mold and the sacrificial layer are thereafter dissolved using etchants to form a free standing metallic structure in a range of about 10 to 20 .mu.m thick, with vertical to lateral aspect ratios of 9:1 to 10:1 or more.

Abstract translation: 在制造大约10至20μm厚的独立小型化结构的过程中，基于牺牲系统的方法包括以下步骤：选择衬底材料，在衬底材料上沉积材料的牺牲层和图案化 牺牲层来定义一个形状。 材料的光致抗蚀剂层沉积在牺牲层上并通过对比度增强的光刻法形成光致抗蚀剂模具。 在模具上镀有金属层材料。 电镀结构符合抗蚀剂轮廓，并且其厚度可以是常规多晶硅微结构的厚度。 然后，使用蚀刻剂溶解光致抗蚀剂模具和牺牲层，以形成约10至20μm厚的独立金属结构，垂直与横向纵横比为9:1至10:1或更高。