公开(公告)号：EP2499368A2

公开(公告)日：2012-09-19

申请号：EP10781481.6

申请日：2010-11-12

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： FOUILLET, Yves ,  BALERAS, François ,  COCHET, Martine ,  MAUBERT, Sandrine

IPC: F04B43/04 ,  B81B1/00 ,  B81C1/00 ,  F04D33/00 ,  B81B3/00

CPC classification number: F04B43/046 ,  A61M5/14586 ,  B81B2201/036 ,  B81B2203/0127 ,  B81C1/00182 ,  B81C2201/0167 ,  B81C2201/019 ,  F04B43/02 ,  F04B43/043 ,  F05C2203/02 ,  F05C2203/06 ,  Y10T29/494

Abstract: A method for producing at least one deformable membrane micropump including a first substrate and a second substrate assembled together, the first substrate including at least one cavity and the second substrate including at least one deformable membrane arranged facing the cavity. In the method: the cavity is produced in the first substrate; then the first and second substrates are assembled together; then the deformable membrane is produced in the second substrate.

公开(公告)号：EP2497745A2

公开(公告)日：2012-09-12

申请号：EP12170755.8

申请日：2006-08-17

Applicant: Qualcomm Mems Technologies, Inc.

Inventor： The designation of the inventor has not yet been filed

IPC: B81B3/00 ,  G02B26/00 ,  G02B26/08

CPC classification number: G02B26/0841 ,  B81B3/0072 ,  B81B2201/047 ,  B81B2203/0163 ,  B81B2203/019 ,  B81B2203/0307 ,  B81B2203/053 ,  B81C1/00142 ,  B81C1/00666 ,  B81C2201/0167 ,  G02B26/001 ,  Y10S359/90

Abstract: Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within the overlying support structures and the movable layer are substantially equal. In another embodiment, the residual stresses within the overlying support structures and the underlying support structures are substantially equal. In certain embodiments, substantially equal residual stresses are obtained through the use of layers made from the same materials having the same thicknesses. In further embodiments, substantially equal residual stresses are obtained through the use of support structures and/or movable layers which are mirror images of one another.

Abstract translation: MEMS器件的实施方案包括通过上覆的支撑结构支撑的可移动层，并且因此可以包括下面的支撑结构。 在一个，实施方式的残留应力的上覆的支承结构内，并且所述可移动层基本上相等。 在另一个实施例中的上覆的支承结构内的残余应力和底层支撑结构基本上相等。 在某些实施方案中，基本上相等的残余应力是通过使用由具有相同厚度的相同材料制成的层而得到的。 在进一步的实施方案中，基本上相等的残余应力是通过使用支撑结构和/或哪些是彼此的镜像可动层而获得的。

公开(公告)号：EP1976428B1

公开(公告)日：2009-11-25

申请号：EP06840258.5

申请日：2006-12-14

Applicant: Medtronic, Inc.

Inventor： SCHUGT, Michael A. ,  MOTHILAL, Kamal Deep ,  LARSON, Lary R. ,  MATTES, Michael F. ,  RUBEN, David A.

IPC: A61B5/0215 ,  A61N1/05

CPC classification number: A61N1/056 ,  A61B5/0215 ,  B81B3/0072 ,  B81C2201/0167 ,  H01L21/4857 ,  H05K1/0271 ,  H05K3/4061 ,  H05K3/4092

Abstract: Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

公开(公告)号：EP1846320B8

公开(公告)日：2009-04-08

申请号：EP06709238.7

申请日：2006-02-02

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： FLEURY, Gatien ,  CHARVET, Pierre-Louis

IPC: B81B3/00 ,  H01H50/00

CPC classification number: B81C1/00666 ,  B81B2201/016 ,  B81C2201/0167

Abstract: The invention relates to a micromechanical device comprising a mobile beam (1), said beam being attached by the two ends (2) thereof to a rigid frame (3) provided with two arms (4) each having two ends (5). The ends (5) of an arm (4) are respectively fixed to the two ends (2) of the mobile beam (1). Each arm (4) has a central part (6) arranged between the two ends (5) of the corresponding arm (4). A rear face of the central part (6) of each arm (4) is attached to a base support (10). The frame (3) comprises at least one stressed element (11) for adjusting the stressed state of the beam. The stressed element (11) can be centred between the front face and the rear face of the corresponding arm (4). The frame (3) can comprise pairs of front and rear stressed elements (11) which are respectively arranged on the front face and the rear face of the arms (4) in such a way that they face each other.

公开(公告)号：EP1461286A1

公开(公告)日：2004-09-29

申请号：EP02716555.4

申请日：2002-05-02

Applicant: Silverbrook Research Pty. Limited

Inventor： SILVERBROOK, KiaSilverbrook Research Pty Ltd

IPC: B81B3/00 ,  B81C1/00 ,  C30B29/68 ,  H01L21/20

CPC classification number: B81C1/00666 ,  B81C2201/0167 ,  B81C2201/017 ,  C23C14/024 ,  C23C14/0641 ,  C30B23/02 ,  C30B29/38 ,  C30B29/605

Abstract: A crystalline thin film structure formed by the deposition of a predominant first crystalline material in two or more layers interleaved by layers of a second crystalline material having a lattice constant that differs from the lattice constant of the predominant first crystalline material in order to disrupt the growth of columnar crystals in the predominant first crystalline material in order to reduce the differential stress profile through the thickness of the film structure relative to the differential stress profile of a crystalline thin film structure formed solely from the predominant first crystalline material.

公开(公告)号：EP1183566B1

公开(公告)日：2004-08-18

申请号：EP00930822.2

申请日：2000-05-19

Applicant: MCNC

Inventor： GOODWIN-JOHANSSON, Scott, Halden

IPC: G02B26/02

CPC classification number: B81C1/00666 ,  B81B2201/032 ,  B81B2203/0118 ,  B81C2201/0167 ,  G02B6/353 ,  G02B6/3566 ,  G02B6/357 ,  G02B6/3594 ,  H01H59/0009 ,  H01H2059/0081

Abstract: A MEMS (Micro Electro Mechanical System) electrostatic device operated with lower and more predictable operating voltages is provided. An electrostatic actuator, an electrostatic attenuator of electromagnetic radiation, and a method for attenuating electromagnetic radiation are provided. Improved operating voltage characteristics are achieved by defining a non increasing air gap between the substrate electrode and flexible composite electrode within the electrostatic device. A medial portion of a multilayer flexible composite overlying the electromechanical substrate is held in position regardless of the application of electrostatic force, thereby sustaining the defined air gap. The air gap is relatively constant in separation from the underlying microelectronic surface when the medial portion is cantilevered in one embodiment. A further embodiment provides an air gap that decreases to zero when the medial portion approaches and contacts the underlying microelectronic surface. A moveable distal portion of the flexible composite is biased to curl naturally due to differences in thermal coefficients of expansion between the component layers. In response to electrostatic forces, the distal portion moves and thereby alters the distance separating the flexible composite from the underlaying microelectronic surface. Structures and techniques for controlling bias in the medial portion and the resulting air gap are provided. The electrostatic device may be disposed to selectively clear or intercept the path of electromagnetic radiation. Materials used in the attenuator can be selected to pass, reflect, or absorb various types of electromagnetic radiation. A plurality of electromagnetic attenuators may be disposed in an array and selectively activated in subsets.

公开(公告)号：EP1155442A1

公开(公告)日：2001-11-21

申请号：EP00903763.1

申请日：2000-02-09

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： MORICEAU, Hubert ,  RAYSSAC, Olivier ,  CARTIER, Anne-Marie ,  ASPAR, Bernard

IPC: H01L21/20 ,  H01L21/18 ,  H01L21/762 ,  B81B3/00

CPC classification number: B81C1/00666 ,  B81C2201/0167 ,  H01L21/185 ,  H01L21/76254 ,  Y10T428/12528 ,  Y10T428/31678

Abstract: The invention concerns a multilayer structure with controlled internal stresses comprising successively: a first main layer (110a), at least a first stress-adapting layer (130) in contact with the first main layer, at least a second stress-adapting layer (120) placed in contact by adherence with said first stress-adapting layer and a second main layer (110b) in contact with the second stress-adapting layer, the first and second stress-adapting layers having contact stresses with the first and second main layers. The invention is useful for electronic circuits and diaphragm devices.

公开(公告)号：EP0663692A2

公开(公告)日：1995-07-19

申请号：EP94120791.2

申请日：1994-12-27

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Biebl, Markus

IPC: H01L23/00 ,  G01L21/00

CPC classification number: G01L9/0042 ,  B81C1/00666 ,  B81C2201/0167

Abstract: Zur Herstellung einer Schicht (15) mit reduzierten mechanischen Spannungen wird die Schicht (15) aus mindestens zwei Teilschichten (13, 14) zusammengesetzt, die so aufeinander abgestimmt sind, daß sich die Streßgradienten in den beiden Schichten (13, 14) im wesentlichen kompensieren. Das Verfahren ist insbesondere bei der Herstellung von Strukturen in der Oberflächen-Mikromechanik einsetzbar.

Abstract translation: Prodn。 一个层的具有降低的机械应力包括：（a）从至少一个第一部分的层（13）和一个第二部分的层（14）产生所述层（15）; （B）到衬底（11,12）施加所述第一局部层（13）; （C）涂布于第一局部层的第二子层（14）（13）; 及（d）调节在彼此象两个层的应力梯度的层（13,14）被补偿。

公开(公告)号：WO2014005496A1

公开(公告)日：2014-01-09

申请号：PCT/CN2013/078523

申请日：2013-06-29

Applicant: 无锡华润上华半导体有限公司

Inventor： 代丹 ,  张新伟 ,  周国平 ,  夏长奉

IPC: B81B7/00 ,  B81C1/00 ,  H01L27/00

CPC classification number: B81C1/00825 ,  B81B7/0029 ,  B81C1/0038 ,  B81C2201/0167 ,  B81C2201/053

Abstract: 一种MEMS薄片（100），包括硅衬底层（110）、第一氧化层（120）及第一薄膜层（130）；所述硅衬底层包括用于微机电工艺的正面（112）及与所述正面相对的背面（114），所述正面及所述背面均为抛光面；所述第一氧化层主要成分为二氧化硅，形成于所述硅衬底层的背面；所述第一薄膜层主要成分为氮化硅，形成于所述第一氧化层表面。上述微机电系统薄片中，通过在硅衬底层的背面依次层叠第一氧化层及第一薄膜层，有效保护了背面，防止其在进行微机电工艺过程中划伤，同时还提供了一种MEMS薄片的制造方法。

公开(公告)号：WO2011058140A3

公开(公告)日：2011-12-01

申请号：PCT/EP2010067390

申请日：2010-11-12

Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  FOUILLET YVES ,  BALERAS FRANCOIS ,  COCHET MARTINE ,  MAUBERT SANDRINE

Inventor： FOUILLET YVES ,  BALERAS FRANCOIS ,  COCHET MARTINE ,  MAUBERT SANDRINE

IPC: F04B43/04 ,  B81B1/00

CPC classification number: F04B43/046 ,  A61M5/14586 ,  B81B2201/036 ,  B81B2203/0127 ,  B81C1/00182 ,  B81C2201/0167 ,  B81C2201/019 ,  F04B43/02 ,  F04B43/043 ,  F05C2203/02 ,  F05C2203/06 ,  Y10T29/494

Abstract: The invention relates to a method for producing at least one deformable membrane micropump comprising a first substrate (10) and a second substrate (20) assembled together, the first substrate (10) comprising at least one cavity (12-2) and the second substrate (20) comprising at least one deformable membrane (22-2) arranged facing said cavity (12-2). Said method comprises the following steps: said cavity (12-2) is produced in the first substrate (10), then - the first (10) and second (20) substrates are assembled together, then - said deformable membrane (22-2) is produced in the second substrate (10).

Abstract translation: 本发明涉及一种用于制造至少一个可变形膜微型泵的方法，所述微型泵包括组装在一起的第一基板（10）和第二基板（20），所述第一基板（10）包括至少一个空腔（12-2），所述第二 衬底（20）包括面向所述空腔（12-2）布置的至少一个可变形膜（22-2）。 所述方法包括以下步骤：在第一基板（10）中制造所述空腔（12-2），然后 - 将第一基板（10）和第二基板（20）组装在一起，然后 - 所述可变形膜（22-2 ）在第二基板（10）中产生。