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    Defect inspection method and device
    91.
    发明专利
    Defect inspection method and device 审中-公开
    缺陷检查方法和设备

    公开(公告)号：JP2012137350A

    公开(公告)日：2012-07-19

    申请号：JP2010289127

    申请日：2010-12-27

    Applicant: Hitachi High-Technologies Corp ,  株式会社日立ハイテクノロジーズ

    Inventor： URANO YUTA ,  HONDA TOSHIFUMI ,  SHIBATA YUKIHIRO

    IPC: G01N21/956 ,  G01B11/02 ,  G01B11/30 ,  G06T1/00 ,  H01L21/66

    CPC classification number: G01N21/956 ,  G01B11/0608 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8854 ,  G01N2201/1045

    Abstract: PROBLEM TO BE SOLVED: To provide a defect inspection method and device solving the problem in which it is difficult to detect a defect and calculate a dimension thereof in a short time at high sensitivity, without thermally damaging a sample by a conventional technique.SOLUTION: A defect inspection method comprises: lighting a surface area of a sample as an object to be inspected under a predetermined lighting condition (lighting step); translating and rotating the sample (sample scanning step); dividing each of a plurality of scattered light beams scattered in a plurality of directions from the lighting area of the sample, into a plurality of pixels to detect the divided light beam, for each of a scanning direction at the sample scanning step and a direction approximately perpendicular to the scanning direction (scattered light beam detection step); and adding a scattered light beam scattered in an approximately same direction from an approximately same area of the sample to each of the plurality of scattered light beams detected at the scattered light beam detection step, determining the presence or absence of a defect based on the scattered light beam added, and calculating the dimension of the determined defect using at least one of a plurality of scattered light beams corresponding to the determined defect (processing step).

    Abstract translation: 要解决的问题：提供一种缺陷检查方法和装置，其解决难以在高灵敏度下在短时间内检测缺陷并计算其尺寸的问题，而不会通过常规技术对样品进行热损伤 。 解决方案：缺陷检查方法包括：在预定的照明条件（照明步骤）下照亮作为待检查对象的样品的表面区域; 平移和旋转样品（样品扫描步骤）; 将从样本的照明区域沿多个方向散射的多个散射光束中的每一个分成多个像素，以便在样本扫描步骤中的每个扫描方向和近似的方向上检测分割的光束 垂直于扫描方向（散射光束检测步骤）; 并且将从散射光束检测步骤检测到的所述多个散射光中的每一个向与所述样品的大致相同的区域大致相同的方向散射的散射光束添加到基于所述散射光束检测步骤的有无的缺陷 并且使用与所确定的缺陷对应的多个散射光束中的至少一个来计算确定的缺陷的尺寸（处理步骤）。 版权所有（C）2012，JPO＆INPIT

    Method and apparatus for inspecting pattern defects
    93.
    发明专利
    Method and apparatus for inspecting pattern defects 有权
    检查图案缺陷的方法和装置

    公开(公告)号：JP2003329610A

    公开(公告)日：2003-11-19

    申请号：JP2002134839

    申请日：2002-05-10

    Applicant: Hitachi Ltd ,  株式会社日立製作所

    Inventor： UTO YUKIO ,  YOSHIDA MINORU ,  NAKADA TOSHIHIKO ,  MAEDA SHUNJI

    IPC: G01B11/30 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

    CPC classification number: G01N21/956 ,  G01N21/94 ,  G01N2021/9513 ,  G01N2201/10 ,  G01N2201/1045

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for inspecting pattern defects provided with an illumination optical system and a detecting optical system wherein the quantity of detected light of an image sensor does not change depending on the place by the change of the incident angle of an illumination light and the thickness change of a thin film formed on a specimen surface, and an unevenness in brightness is not produced on the detected image. SOLUTION: This apparatus for inspecting pattern defects is provided with a laser light source 3 eradiating the illumination light on a specimen, a coherent reducing optical system for reducing the coherence of the laser, a converging means for converging the laser light to the pupil position of an object lens 11, and a means for detecting the reflected light from a circuit pattern formed on a substrate from a position above the substrate. An illuminance light impinged onto the object substrate to be inspected is partially adjusted by matching the illumination light impinged on the specimen 1 with the irradiation form of the laser light converged at the pupil position of the object lens by the converging means. Therefore, the fluctuation in the intensity of the reflected light due to the thickness difference of the specimen surface can be reduced, an unevenness in brightness of the detected image can be suppressed and a minute defect can be detected. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供一种用于检查具有照明光学系统和检测光学系统的图案缺陷的设备，其中图像传感器的检测光的量根据事件的变化而不会改变 检测图像上不产生照明光的角度和形成在试样表面上的薄膜的厚度变化，亮度不均匀。 解决方案：用于检查图案缺陷的装置设置有对标本上的照明光进行扫描的激光光源3，用于降低激光器的相干性的相干减少光学系统，用于将激光会聚到 物镜11的光瞳位置，以及用于从基板上方的位置检测来自形成在基板上的电路图案的反射光的装置。 通过使被照射在被检体1上的照明光与会聚装置在物镜的瞳孔位置会聚的激光的照射形式匹配，照射被检查物体基板上的照度光。 因此，可以减少由于样品表面的厚度差引起的反射光强度的波动，可以抑制检测图像的亮度不均匀性并且可以检测到微小的缺陷。 版权所有（C）2004，JPO

    System and method for double sided optical inspection of thin film disks or wafers
    96.
    发明公开
    System and method for double sided optical inspection of thin film disks or wafers 审中-公开
    系统与Verfahrenfürdoppelseitige optische Inspektion vonDünnfilmplattenoder Wafern

    公开(公告)号：EP2378273A2

    公开(公告)日：2011-10-19

    申请号：EP10182395.3

    申请日：2004-12-03

    Applicant: Candela Instruments

    Inventor： Meeks, Steven W.

    IPC: G01N21/21 ,  G01N21/47 ,  G01N21/95 ,  H01L21/66

    CPC classification number: G01N21/9506 ,  G01B11/0616 ,  G01B11/0641 ,  G01B11/065 ,  G01B11/303 ,  G01B11/306 ,  G01N21/21 ,  G01N21/47 ,  G01N21/9501 ,  G01N21/958 ,  G01N2021/8427 ,  G01N2021/8841 ,  G01N2201/103 ,  G01N2201/104 ,  G01N2201/1045 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A double-sided optical inspection system is presented which may detect and classify particles, pits and scratches on thin film disks or wafers in a single scan of the surface. In one embodiment, the invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction on both surfaces of the wafer or thin film disk. The scattered light from radial and circumferential beams is separated via their polarization or by the use of a dichroic mirror together with two different laser wavelengths.

    Abstract translation: 一种用于测量物体表面上的缺陷的方法，包括：将第一光束在第一入射平面中朝向物体上的第一位置引导; 将第二光束引导到物体（4501）上的第二位置的第二入射平面中，其中第一入射平面和第二入射平面之间的角度为零，并且其中第一光束被引导在圆周 方向（4504），并且所述第二光束被引导在所述物体（4501）的径向方向上; 检测第一散射光束; 并检测第二散射光束; 其中所述第一散射光束包括来自所述第一位置的散射光强度，并且所述第二散射光束包括来自所述第二位置的散射光强度，所述方法还包括比较所述第一散射光束和所述第二散射光束以确定 物体表面上的缺陷的第一纵横比（4501）。

    Method of and apparatus for real-time crystallographic axis orientation determination
    100.
    发明公开
    Method of and apparatus for real-time crystallographic axis orientation determination 失效
    实时晶体轴方位测定方法与装置

    公开(公告)号：EP0263621A3

    公开(公告)日：1990-01-10

    申请号：EP87308443.8

    申请日：1987-09-24

    Applicant: Weiser, Sidney

    Inventor： Weiser, Sidney

    IPC: G01N21/55

    CPC classification number: G01N21/55 ,  G01N2201/1045 ,  G01N2201/1087

    Abstract: A specific small area of a crystal sample (11) is scanned by a laser beam in a spiral pattern (2a, 2b). The laser beam is reflected different amounts for different beam positions to produce a reflectance pattern indicative of crystallographic orientation. The reflected beam radiation may be determined with a photodetector (12) and the reflectance pattern may be interpreted with circuitry (13) which also controls steering of the beam.

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