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    OPTICAL SYSTEM FOR SCANNING LIGHT BEAM
    2.
    发明专利
    OPTICAL SYSTEM FOR SCANNING LIGHT BEAM 失效

    公开(公告)号：JPH04260017A

    公开(公告)日：1992-09-16

    申请号：JP27279091

    申请日：1991-10-21

    Applicant: TENCOR INSTRUMENTS

    Inventor： RII KEI GARUBUREISU

    IPC: G02B13/22 ,  G02B26/10

    Abstract: PURPOSE: To easily obtain the telecentric scanning system of a flat field at a low cost by permitting an optical element to correct the route of a polarized optical beam to permit the optical beam to scan a target plane in the substantially focus flat field. CONSTITUTION: The additional optical element, that is, a lens 15 has a spherical surface and is the positive meniscus lens placed between the scanning reflecting equipment 11 of the plane and the mirror 13 of a recessed surface in the route of the optical beam 17b. The lens 15 slightly adjusts the optical route so as to permit the reflected beam 17c from the recessed surface mirror 13 to be not only telecentric but also the image on the plane which coincides with the target object surface 19.

    PLATFORM USED TOGETHER WITH TRANSDUCER
    3.
    发明专利
    PLATFORM USED TOGETHER WITH TRANSDUCER 失效

    公开(公告)号：JPH03282394A

    公开(公告)日：1991-12-12

    申请号：JP32874890

    申请日：1990-11-27

    Applicant: TENCOR INSTRUMENTS

    Inventor： UIRIAMU AARU UIIRAA ,  AAMAN PII NIYUUKAAMANZU ,  GURAHAMU JIEI SHIDAARU

    IPC: G12B5/00

    Abstract: PURPOSE: To position a transducer(TD) accurately with respect to a substrate through a simple and stabilized structure using an X-Y-Z motion stage which can be engaged with a carrier including a substrate. CONSTITUTION: In order to inspect a substrate 35, the substrate 35 is roughly positioned with respect to a transducer(TD) 31 on an X-Y stage 19 and then a vacuum chuck 25 mounting the substrate 35 is lifted to an upper basic level plane 15 by means of a Z stage 21 while leaving a slight gap on a pad 37. After a TD 31 is offset by a reticle or the like, the TD 31 is positioned immediately above a measuring region by corrective displacement according to a program. A chuck 25 is then evacuated through the pad 27 and sucked to the surface 16 to the level plane 15. The chuck 25 is held through a vacuum line 39 and the stage 21 is lowered slightly. Consequently, the structural loop between the TD 31 and the substrate 35 is shortened while reinforcing the structure and since they move in harmony, effect of vibration can be reduced. This structure increases stability between the substrate 35 and the TD 31 thus reducing relative fluctuation.

    DOUBLE STAGE DEVICE FOR SAMPLE SCANNING
    8.
    发明专利
    DOUBLE STAGE DEVICE FOR SAMPLE SCANNING 失效

    公开(公告)号：JPH1031084A

    公开(公告)日：1998-02-03

    申请号：JP4163397

    申请日：1997-02-10

    Applicant: TENCOR INSTRUMENTS

    Inventor： SAMSAVAR AMIN ,  WHEELER WILLIAM R ,  EATON STEVEN G ,  ZHUANG JIAN-PING

    IPC: G01Q70/06 ,  G01B3/00 ,  G01B5/28 ,  G01B7/34 ,  G01B21/30 ,  G01Q10/02 ,  G01Q10/04 ,  G01Q20/00 ,  G01Q60/00 ,  G01Q90/00 ,  G12B5/00

    Abstract: PROBLEM TO BE SOLVED: To provide a double stage device for scanning a sample as well as a sample detection method using a sensor for detecting a sample to detect a sample parameter. SOLUTION: A double stage scanning device 100 includes a sensor 60 for detecting a parameter of a sample 90, as well as a rough adjustment stage 80 (80a to 80b) and a fine adjustment stages 70 for causing a relative motion between the sensor 60 and the sample 90. The rough adjustment stage 80 has a resolving power of approximately 1 micrometer, and the fine adjustment stage 70 has a resolving power of 1 nanometer or more. Furthermore, the sensor 60 is used to detect the aforementioned parameter, when both of the stages 70 and 80 causes a relative motion between the sensor 60 and the sample 90. The sensor 60 has the capability of detecting a change in height of the surface of the sample 90 or the heat thereof, as well as the electrostatic, magnetic and light reflectance and transmission parameters of the sample surface, concurrently with the variation of the height. A long scanning process with a rough resolution power is implemented, while a short scanning process with a high resolving power is implemented by use of the end of the same probe, or the ends of two probes fixed and kept at a constant positional relationship. Data obtainable from both of the aforementioned long and short scanning processes can be accurately correlated to each other.

    METHOD FOR APPROXIMATING NUMBER OF PARTICLES ON PATTERNED REGION OF WAFER SURFACE AND PRECISE INSPECTING DEVICE FOR SURFACE
    9.
    发明专利
    METHOD FOR APPROXIMATING NUMBER OF PARTICLES ON PATTERNED REGION OF WAFER SURFACE AND PRECISE INSPECTING DEVICE FOR SURFACE 失效

    公开(公告)号：JPH04305951A

    公开(公告)日：1992-10-28

    申请号：JP12767791

    申请日：1991-05-30

    Applicant: TENCOR INSTRUMENTS

    Inventor： AAMAN PII NIYUUKAAMANZU ,  PIITAA SHII JIYAN ,  RARUFU UORUFU ,  DEIBITSUDO UORUZE ,  SUTANREE SUTOKOBUSUKI

    IPC: H01L21/66 ,  G01N21/94 ,  H01L21/027

    Abstract: PURPOSE: To provide a method and an apparatus for determining the number of contaminant material particles in a patterned circuit region on a semiconductor wafer. CONSTITUTION: A diffraction grating pattern is formed in same mode simultaneously with formation of a reflection circuit pattern on a wafer 10. The wafer is scanned by means of a laser beam 23 and since a diffraction pattern to be generated by a grating pattern is known, it can be detected when and which grating pattern is being scanned by the light beam. Scattering light from a non-grating region is separated spatially from the diffracted light from the grating and only the light scattered from a particle or a defect existing in the grating region is collected and detected by a photodetector 44. Number of particles in the grating region is calculated from a detected scattering light and the number of particles in the circuit pattern region is estimated by extrapolation. Alternatively, a stripped region may be inspected precisely.

    CONTAMINANT PRESENT ON SURFACE OF ELECTRICALLY CONDUCTIVE MATERIAL AND METHOD FOR DETERMINING THICKNESS THEREOF IF PRESENT
    10.
    发明专利
    CONTAMINANT PRESENT ON SURFACE OF ELECTRICALLY CONDUCTIVE MATERIAL AND METHOD FOR DETERMINING THICKNESS THEREOF IF PRESENT 失效

    公开(公告)号：JPH04278446A

    公开(公告)日：1992-10-05

    申请号：JP3761591

    申请日：1991-03-04

    Applicant: TENCOR INSTRUMENTS

    Inventor： SUTANREE SUTOKOBUSUKI ,  DEIBITSUDO UORUZE ,  AAMAN PII NIYUUKAAMANZU

    IPC: G01N23/22 ,  G01N21/00 ,  G01N27/00

    Abstract: PURPOSE: To give compensation for capacitive current and photovoltaic current effect in a method using a change in photoelectron discharging current from a spot irradiating a surface to determine the presence and thickness or other spatial range of contaminants in each of a plurality of at least two positions on the surface of a electrically conductive material such as semiconductor, metal or metal silicide. CONSTITUTION: A system 31 comprises a light beam 36 and light source 35 focused lenses 37, 37 for illuminating an irradiation place 39 on the surface of a conductive material 33 and earth layer 33 material. Photoelectrons discharged from the material 33 are collected to a first collected 41 to provided a first output signal 47 and further current due to a capacitive effect received by a second electron collector 49 provides a second output signal 53. A difference between two output signals is formed by a difference module 55 to provide output signal on 57.

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