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公开(公告)号：US06682802B2
公开(公告)日：2004-01-27
申请号：US09737213
申请日：2000-12-14
Applicant: George Hsieh , Terrance J. Dishongh , Scott Dixon
Inventor： George Hsieh , Terrance J. Dishongh , Scott Dixon
IPC: B32B512
CPC classification number: B29C70/083 , B32B5/12 , B32B27/04 , H05K1/0271 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , Y10S428/901 , Y10T428/24058 , Y10T428/24074 , Y10T428/24091 , Y10T428/24099 , Y10T428/24116 , Y10T428/24124
Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.
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公开(公告)号：US06558780B2
公开(公告)日：2003-05-06
申请号：US10045344
申请日：2001-10-25
Applicant: Takeshi Suzuki , Toshihiro Nishii , Satoru Tomekawa , Fumio Echigo
Inventor： Takeshi Suzuki , Toshihiro Nishii , Satoru Tomekawa , Fumio Echigo
IPC: B32B300
CPC classification number: H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953
Abstract: A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.
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公开(公告)号：US20020076522A1
公开(公告)日：2002-06-20
申请号：US09737213
申请日：2000-12-14
Applicant: Intel Corporation
Inventor： George Hsieh , Terrance J. Dishongh , Scott Dixon
IPC: B32B005/12 , B29B007/00
CPC classification number: B29C70/083 , B32B5/12 , B32B27/04 , H05K1/0271 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , Y10S428/901 , Y10T428/24058 , Y10T428/24074 , Y10T428/24091 , Y10T428/24099 , Y10T428/24116 , Y10T428/24124
Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.
Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中是特别重要的。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。
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公开(公告)号：US5807793A
公开(公告)日：1998-09-15
申请号：US755630
申请日：1996-11-25
Applicant: Diego Armando Scari , Marco Scari
Inventor： Diego Armando Scari , Marco Scari
IPC: B29B11/16 , B29C70/10 , B29K105/06 , B32B5/12 , B32B5/28 , D03D15/00 , D03D15/12 , D03D19/00 , H05K1/03 , B29C67/14 , B29C53/80 , H05K1/00
CPC classification number: D03D13/006 , D03D15/0011 , D03D19/00 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , Y10S428/901 , Y10S428/902 , Y10T442/2008 , Y10T442/3179 , Y10T442/322
Abstract: A description is provided of laminates for printed circuits using unidirectional glass fabric produced with continuous yarn which is twisted, has a low number of twists or zero twisting turns with different gramme weights, interlaced warpwise with a leno interwoven binding using glass yarns of 5.5 to 22 Tex at a spacing of up to 20 cm. The application of these laminates to the manufacture of printed circuits offers advantages in terms of surface roughness and waviness, dimensional stability, evenness and perforability.
Abstract translation: 提供了使用单向玻璃织物的印刷电路板的描述，所述单向玻璃织物是用连续的纱线制成的，连续纱线是扭曲的，具有不同的克重重量的低捻数或零扭转匝数，使用5.5至22的玻璃纱与纬纱交织结合 Tex的间距可达20厘米。 这些层压板在制造印刷电路中的应用在表面粗糙度和波纹度，尺寸稳定性，均匀性和穿孔性方面具有优势。
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95.发明授权Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products 失效用于生产印刷电路板的增强塑料层压板以及用于制造这种层压板和所得产品的工艺
公开(公告)号：US5037691A
公开(公告)日：1991-08-06
申请号：US398128
申请日：1989-08-23
Applicant: Jonas Medney , Fred E. Klimpl
Inventor： Jonas Medney , Fred E. Klimpl
CPC classification number: B29C53/564 , B29C53/76 , B29C53/8016 , B29C70/202 , B29C70/347 , H05K1/0366 , B29L2031/3425 , H05K2201/0145 , H05K2201/0278 , H05K2201/0287 , H05K2203/085 , H05K2203/1327 , H05K3/0047 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/30 , Y10T428/31721
Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
Abstract translation: 通过在第一组横向缠绕第二组股线的情况下围绕扁平心轴缠绕第一组股线或细丝来生产无翘曲层压体。 两组可以相互垂直。 将长丝保持在可控制的张力下，同时用树脂浸渍并在随后的树脂固化期间。 为了允许形成无翘曲的产品，卷绕图案使得其形成关于中性轴或对称平面的镜像。 卷绕图案可以被选择成以预定图案提供间隙，允许冲孔或高速钻孔用于随后的印刷电路应用。
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Patent Agency Ranking
公开(公告)号：US4980217A
公开(公告)日：1990-12-25
申请号：US226013
申请日：1988-07-29
Applicant: Michael A. Grundfest , Joseph A. Grundfest
Inventor： Michael A. Grundfest , Joseph A. Grundfest
CPC classification number: B29C70/202 , H05K1/0366 , H05K1/115 , B29C2793/0045 , B29L2031/3425 , H05K2201/0287 , H05K2201/0296 , H05K2201/09854 , H05K3/0047 , H05K3/005 , Y10S428/901 , Y10T428/24124 , Y10T428/24322 , Y10T428/24917 , Y10T428/249924
Abstract: The reinforcing fibers in a printed circuit board laminate are arranged in an ordered manner to leave fiber-free zones for the formation of holes. The holes may be oblong to enhance the connection to electrical leads of components mounted on the printed circuit board. The holes may be oriented with their long dimensions transverse to the side of an electrical component, and the electrical component may have its leads correspondingly oriented, to improve wiring flexibility and allow more direct wiring paths.
Abstract translation: 印刷电路板层叠体中的增强纤维以有序的方式布置以留下用于形成孔的无纤维区域。 孔可以是长圆形的，以增强与安装在印刷电路板上的部件的电引线的连接。 孔可以以其横向于电气部件的侧面的长尺寸定向，并且电气部件可以使其引线相应地定向，以提高布线灵活性并允许更直接的布线路径。
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公开(公告)号：US4012267A
公开(公告)日：1977-03-15
申请号：US594580
申请日：1975-07-10
Applicant: Theodore Harold Klein
Inventor： Theodore Harold Klein
IPC: B32B15/04 , B29C70/02 , B29C70/52 , B32B5/02 , B32B15/08 , H05K1/03 , H05K3/02 , B29G7/00 , B32B15/14
CPC classification number: B32B5/02 , B29C70/028 , B29C70/521 , H05K1/0366 , H05K3/022 , B29K2067/06 , B29K2705/10 , H05K2201/0287 , H05K2201/029 , H05K2203/068 , H05K2203/0783 , H05K2203/1545
Abstract: A method of continuously producing clad composites is disclosed. The cladding is combined with a resin-wet reinforcement and pultruded through a forming and curing die in a single processing step.
Abstract translation: 公开了一种连续生产复合材料的方法。 将包层与树脂湿润增强合并，并通过成形和固化模头在单一加工步骤中拉挤。
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公开(公告)号：WO2009051239A1
公开(公告)日：2009-04-23
申请号：PCT/JP2008/068894
申请日：2008-10-17
CPC classification number: H01L23/49827 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H05K1/036 , H05K1/0366 , H05K1/115 , H05K3/002 , H05K3/0055 , H05K3/426 , H05K3/4602 , H05K2201/0287 , H05K2201/09536 , H05K2201/0959 , H05K2203/1476 , H01L2224/0401
Abstract: 【課題】本発明は、スルーホール導体の剥離を抑制する要求に応える配線基板、実装構造体、並びに配線基板の製造方法を提供することを目的とする。 【解決手段】一方向に沿って配された単繊維８と単繊維８を被覆する樹脂とを具備する繊維層９と、繊維層９を貫通するスルーホールＳと、を有する基体５と、スルーホールＳ内に形成されるスルーホール導体１１と、を備え、単繊維８は、その一部がスルーホールＳの内壁面よりスルーホール導体１１側に突出し、突出部がスルーホール導体１１で被覆されていることを特徴とする配線基板２。
Abstract translation: 提供了满足通孔导体的剥离要求的布线基板，安装结构以及布线基板的制造方法。 布线板（2）设有基体（5）和通孔导体（11）。 基体设置有纤维层（9）和通孔（S）。 纤维层具有沿着一个方向布置的单个纤维（8）和用于覆盖单个纤维（8）的树脂。 通孔（S）穿过纤维层（9），通孔导体形成在通孔中。 单个纤维（8）从通孔（S）的内壁表面部分地突出到通孔导体（11）的侧面，并且突出部分被通孔导体（11）覆盖。
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公开(公告)号：WO2008120619A1
公开(公告)日：2008-10-09
申请号：PCT/JP2008/055639
申请日：2008-03-26
IPC: C08J5/04
CPC classification number: C08J5/04 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , H05K2201/0296 , Y10T428/24099 , Y10T428/24149 , Y10T428/24994
Abstract: 複数の単繊維２３を一方向に配列させた単繊維層２０，２１，２２を複数積層した繊維束２と、繊維束２における単繊維２３を相互に接着するための接着剤３と、を含む繊維強化樹脂であって、繊維束２は、断面がハニカム状とされていることを特徴とする、繊維強化樹脂。
Abstract translation: 公开了含有纤维束（2）的纤维增强树脂，该纤维束（2）通过层叠多个单纤维层（20,21,22）而获得，所述多个单纤维层（20,21,22）在多个单根纤维（23） ，以及用于将纤维束（2）中的单根纤维（23）彼此粘合的粘合剂（3）。 该纤维强化树脂的特征在于纤维束（2）具有蜂窝状的横截面。
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公开(公告)号：WO2008056500A1
公开(公告)日：2008-05-15
申请号：PCT/JP2007/069673
申请日：2007-10-09
Inventor： 小勝 俊亘
IPC: H05K3/46
CPC classification number: H05K3/4688 , H05K1/0366 , H05K1/0393 , H05K3/4635 , H05K3/4691 , H05K2201/0287 , H05K2201/029 , H05K2201/0296 , H05K2201/09018 , H05K2203/302 , Y10T428/24917 , Y10T442/3065 , Y10T442/3195 , Y10T442/3236
Abstract: 携帯される電子機器の多層配線基板において、高強度であり、なおかつ従来構造よりも弾性変形領域が大きく柔軟性があり、曲面化が可能である多層配線基板を提供する。 この多層配線基板は、１層以上の絶縁層を有する多層配線基板である。そして、該基板の少なくとも１層の絶縁層が、面内方向成分の機械特性が異方性を示す材料で構成されている。
Abstract translation: 提供了一种用于移动电子设备的多层布线基板。 多层布线基板非常坚固，并且具有比现有技术的结构更大的弹性变形区域和更高的弹性，使得其可以是弯曲的。 多层布线基板具有至少一个绝缘层。 该绝缘层由材料制成，其面内成分具有各向异性的机械特性。
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