公开(公告)号：WO01011931A1

公开(公告)日：2001-02-15

申请号：PCT/ES1999/000258

申请日：1999-08-06

IPC: H05K3/00 ,  H05K3/36 ,  H05K3/40 ,  H05K1/14 ,  H05K3/42

CPC classification number: H05K3/366 ,  H05K3/0047 ,  H05K3/403 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/09854

Abstract: System for connecting in orthogonal position an auxiliary board to a double face or multilayer printed circuit base board, said base board (1) having internally metallized orifices (2) which are transverse to a dielectric substrate (3) and which interconnect electrically tracks (4) defined in one or two faces of said plate (1). Conductor members (5) of the auxiliary board (6) are inserted into the orifices (2) and are connected electrically to tracks (7) of said board; the conductor layer/surface lining internally the metallized orifices (2) is divided in various portions which are electrically separated. In said auxiliary board (6), a dielectric substrate (10) has appendices (8), each of which comprising various separated conductor parts (9a, 9b) which are connected to corresponding tracks (7a, 7b) of the board (6). The conductor parts (9a, 9b) of each appendice (8) correspond in number and position to those of the separated parts (2a, 2b) of each metallized orifice (2).

Abstract translation: 用于将辅助板正交位置到双面或多层印刷电路基板的系统，所述基板（1）具有横向于电介质基板（3）的内部金属化喷孔（2），并且将电气轨道（4） ）限定在所述板（1）的一个或两个面中。 辅助板（6）的导体构件（5）插入孔（2）中并且电连接到所述板的轨道（7）; 金属化孔口（2）内部的导体层/表面衬里被分成各种电气分离的部分。 在所述辅助板（6）中，电介质基板（10）具有附件（8），每个附件包括连接到板（6）的相应轨道（7a，7b）的各种分开的导体部分（9a，9b） 。 每个附件（8）的导体部分（9a，9b）的数量和位置与每个金属化孔口（2）的分离部分（2a，2b）的数量和位置相对应。

公开(公告)号：WO01004656A1

公开(公告)日：2001-01-18

申请号：PCT/US2000/019069

申请日：2000-07-13

IPC: G01R33/02 ,  G01R33/06 ,  G01R33/09 ,  H05K3/36

CPC classification number: B82Y25/00 ,  G01R33/0206 ,  G01R33/06 ,  G01R33/093 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10446

Abstract: A multi-axis magnetometer (100) is provided having three magnetic field sensing circuits for sensing a magnetic field along the X, Y and Z axes. Each magnetic field sensing circuit includes an operational amplifier and a bridge chip (10) having at least one electrical conductor. The operational amplifier (12) is electrically connected to the at least one electrical conductor of the bridge chip (10) for receiving a portion of a current flowing through the at least one electrical conductor. The operational amplifier (12) provides an output voltage based on a magnitude of the portion of the current flowing through the at least one electrical conductor. The multi-axis magnetometer (100) further includes a voltage regulator (14) providing an operating voltage.

Abstract translation: 提供具有用于感测沿着X，Y和Z轴的磁场的三个磁场感测电路的多轴磁力计（100）。 每个磁场感测电路包括运算放大器和具有至少一个电导体的桥接芯片（10）。 运算放大器（12）电连接到桥芯片（10）的至少一个电导体，用于接收流过至少一个电导体的一部分电流。 运算放大器（12）基于流过至少一个电导体的电流的一部分的大小来提供输出电压。 多轴磁力计（100）还包括提供工作电压的电压调节器（14）。

公开(公告)号：WO00074445A1

公开(公告)日：2000-12-07

申请号：PCT/EP2000/004945

申请日：2000-05-30

IPC: H05K3/34 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K3/366 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/144 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09645 ,  H01L2924/00

Abstract: According to the invention, the power substrate is used as a base plate in a housing (1) which, together, form a standardized power part from whose top surface (11) connection pins (5) project. Said projection pins are soldered inside interfacial connection via holes of the control printed circuit board (4). The printed circuit board (4) comprises contact pads (7) which are located in an open strip area (6) and which serve as control terminals and power terminals by means of which the module can be soldered directly into the slotted opening of a system printed circuit board (8).

Abstract translation: 电源基板作为在壳体（1）的底板被插入并形成与此一起提供一个标准化的功率部分，从它的上侧（11）突出的销（5），其被焊接在Durchstecklötung与驱动电路板的接触孔（4）。 的印刷电路板（4）具有一个剩余的自由带部分（6）的接触垫（7），为控制和电源连接，通过该模块可以直接焊接到系统中的印刷电路板的槽状开口（8）。

公开(公告)号：WO98033363A1

公开(公告)日：1998-07-30

申请号：PCT/JP1998/000280

申请日：1998-01-22

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K3/3405 ,  H05K3/341 ,  H05K2201/09172 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10962 ,  Y02P70/613

Abstract: There are disclosed printed board (5) on which electronic parts are mounted, a method for manufacturing the printed board, and a structure for connecting conductor elements (8, 8') to this printed board. The printed board includes an insulating supporting substrate (50) and at least one metallic terminal (53, 54). The supporting substrate is provided with at least one opening (51, 52) through the substrate, and the metallic terminal is fixed to the supporting substrate without protruding from the supporting substrate and bridges the opening.

Abstract translation: 公开了其上安装有电子部件的印刷电路板（5），印刷电路板的制造方法以及用于将导体元件（8,8'）连接到该印刷电路板的结构。 印刷电路板包括绝缘支撑基板（50）和至少一个金属端子（53,54）。 支撑基板设置有穿过基板的至少一个开口（51,52），并且金属端子固定到支撑基板而不从支撑基板突出并且桥接开口。

公开(公告)号：JPWO2011152175A1

公开(公告)日：2013-07-25

申请号：JP2012518302

申请日：2011-05-10

Applicant: アルプス電気株式会社

Inventor： 山縣　一芳 ,  一芳 山縣 ,  笹川　英人 ,  英人 笹川 ,  鈴木　潤 ,  潤 鈴木 ,  裕 高島 ,  裕 高島

IPC: G06F3/041 ,  G06F3/045

CPC classification number: G06F3/045 ,  H01R12/62 ,  H05K1/147 ,  H05K2201/09172

Abstract: フレキシブルプリント基板が介在する領域の下部基板及び上部基板の構造を改良して、フレキシブルプリント基板の厚さを吸収できるようにし、さらに優れた接続性を得ることが可能な入力装置を提供することを目的とする。下部基板(22)に設けられた第1配線層(52)は、フレキシブルプリント基板(54)との接続位置まで引き延ばされて第1接続部(52a)を構成し、上部基板(21)に設けられた第2配線層(45)は、フレキシブルプリント基板(54)との接続位置まで引き延ばされ、第1接続部(52a)と重ならない位置にて第2接続部(45a)を構成する。フレキシブルプリント基板(54)には第1接続部と接続される第1端子部(80)、第2接続部と接続される第2端子部(81)が形成されている。第1端子部(80)に対向する上部基板(21)、第2端子部(81)に対向する下部基板(22)には、高さ方向に抜ける空間部(21a),(22a)が形成されている。

公开(公告)号：JP5117689B2

公开(公告)日：2013-01-16

申请号：JP2006170324

申请日：2006-06-20

Applicant: 三星電子株式会社Samsung Electronics Co.,Ltd.

Inventor： 基 哲 金 ,  珠 完 趙 ,  相 吉 李 ,  敦 ▲さん▼ 趙 ,  相 裕 李

IPC: F21S2/00 ,  F21V23/00 ,  F21Y101/02 ,  G02F1/13357

CPC classification number: H05K1/142 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K1/056 ,  H05K1/117 ,  H05K3/107 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2203/167

公开(公告)号：JP2011222454A

公开(公告)日：2011-11-04

申请号：JP2010093347

申请日：2010-04-14

Applicant: Yazaki Corp ,  矢崎総業株式会社

Inventor： TAKAMURA NAOKI ,  KUROSAWA TORU

IPC: H01R13/64 ,  H01L27/14 ,  H01R12/72 ,  H04N5/225

CPC classification number: H05K5/0026 ,  G03B17/02 ,  H01L27/14618 ,  H01L27/14806 ,  H01L2924/0002 ,  H01R12/51 ,  H01R12/721 ,  H01R13/05 ,  H01R2201/26 ,  H04N5/2253 ,  H04N5/2257 ,  H05K1/117 ,  H05K2201/0311 ,  H05K2201/09172 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a compact electronic component which maintains a good connection status between a circuit board and a pair of connection terminals connected to the circuit board.SOLUTION: An electronic component 1 comprises a circuit board 4, a pair of connection terminals 7 connected to the circuit board 4, and a housing 5 to which the pair of connection terminals 7 are attached. The circuit board 4 includes a plurality of terminals 43 to be connected to the pair of connection terminals 7. At each one of the pair of connection terminals 7, a spring member 72, which is elastically deformable, to clip one of the plurality of terminals 43 between thereof is provided. The housing 5 includes through-holes 54 for each of the pair of connection terminals 7 to run through. The circuit board 4 is accommodated in a substrate storage 56, and ribs 57 extending from a bottom 56a of the substrate storage 56 to the circuit board 4 in convex shape are provided so as to proceed between the plurality of terminals 43.

Abstract translation: 要解决的问题：提供一种在电路板和连接到电路板的一对连接端子之间保持良好连接状态的紧凑型电子部件。 解决方案：电子部件1包括电路板4，连接到电路板4的一对连接端子7和连接有一对连接端子7的壳体5。 电路板4包括要连接到一对连接端子7的多个端子43.在一对连接端子7中的每一个处，可弹性变形的弹簧构件72夹住多个端子之一 43之间。 壳体5包括用于一对连接端子7中的每一个穿过的通孔54。 电路基板4容纳在基板收纳部56中，从基板收容部56的底面56a向凸状的电路基板4设置肋57，从而在多个端子43之间进行。 （C）2012，JPO＆INPIT

公开(公告)号：JP2010219090A

公开(公告)日：2010-09-30

申请号：JP2009060724

申请日：2009-03-13

Applicant: Aisin Aw Co Ltd ,  Toyota Motor Corp ,  アイシン・エィ・ダブリュ株式会社 ,  トヨタ自動車株式会社

Inventor： MURAKAMI NAOTAKA ,  TOMINAGA KEIICHI ,  MATSUBARA MASATO

IPC: H01L25/04 ,  H01L25/18

CPC classification number: H05K1/147 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09109 ,  H05K2201/09172 ,  H05K2203/0195

Abstract: PROBLEM TO BE SOLVED: To improve reliability in an electronic circuit device by relaxing stress operating on a flexible wiring board around a connection section with a connection terminal at the side of a circuit board. SOLUTION: The electric circuit device 20 includes: the circuit board 22 with electronic components 21 packaged thereon; and the flexible wiring board 23 permitting electric connection between the circuit board 22 and external equipment. The circuit board 22 has a plurality of connection terminals 26 disposed side by side on a non-packaging surface. The flexible wiring board 23 includes: a plurality of connection terminals 236 disposed side by side on the surface so that they oppose the connection terminals 26 of the circuit board 22; and a plurality of free ends 23f that are formed such that each accommodates one of the connection terminals 236. Each free end 23f is not adhered to the circuit board 22, and the connection terminals 26 and the corresponding connection terminals 26 are electrically connected while facing one another. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了通过在电路板侧的连接端子处在连接部分周围的柔性布线板上松弛应力来提高电子电路器件的可靠性。 解决方案：电路装置20包括：电路板22，其上封装有电子部件21; 并且柔性布线板23允许电路板22和外部设备之间的电连接。 电路板22具有在非封装表面上并排配置的多个连接端子26。 柔性布线板23包括：多个连接端子236，其在表面上并排设置，使得它们与电路板22的连接端子26相对; 以及形成为各自容纳一个连接端子236的多个自由端23f。每个自由端23f不粘附到电路板22，并且连接端子26和相应的连接端子26电连接，同时面向 另一个。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009146666A

公开(公告)日：2009-07-02

申请号：JP2007321339

申请日：2007-12-12

Applicant: Japan Aviation Electronics Industry Ltd ,  日本航空電子工業株式会社

Inventor： KITAJIMA NAOYA ,  TAKAHASHI MASAYA ,  ARAI KATSUMI

IPC: H01R11/01 ,  H01R4/26 ,  H01R13/11

CPC classification number: H05K1/118 ,  H01R12/716 ,  H01R13/2414 ,  H05K3/0058 ,  H05K3/027 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09172 ,  H05K2201/09663 ,  H05K2203/0369

Abstract: PROBLEM TO BE SOLVED: To provide a connector having a new and simple structure and capable of solving a problem about contact reliability in the case contaminant such as oil or grease is adhered onto a contact part.
SOLUTION: A contact part or its vicinity in a conductive film is made to be a concavo-convex structure, and electric contact is provided by the convex part, and contaminant is removed by the concave part. As a configuration, for example, (1) a part corresponding to a contact part of an insulation film is made a concavo-convex shape, then a conductive pattern is formed, (2) a conductive pattern is directly processed into a concavo-convex shape, (3) a contact part is structured by a plurality of thin wires, and gaps between the thin wires are used for removing contaminant.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供具有新的和简单的结构的连接器，并且能够解决在诸如油或油脂的污染物的情况下的接触可靠性的问题粘附到接触部分上。 解决方案：将导电膜中的接触部分或其附近形成为凹凸结构，并且由凸部提供电接触，​​并且通过凹部去除污染物。 作为构成，例如（1）将与绝缘膜的接触部对应的部分为凹凸形状，形成导体图案，（2）将导电图案直接加工为凹凸 形状，（3）接触部分由多条细线构成，细线之间的间隙用于去除污染物。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP3115597U

公开(公告)日：2005-11-10

申请号：JP2005006431

申请日：2005-08-09

Applicant: Uro電子工業株式会社

Inventor： 川 雄 二 市 ,  川 朝 夫 石

IPC: H01F27/29 ,  H03H7/48

CPC classification number: H01F27/292 ,  H01F19/04 ,  H01F27/2828 ,  H01F2017/067 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09172 ,  H05K2201/1003 ,  H05K2201/10287

Abstract: 【課題】プリント配線板の配線パターンの構成に影響を与えることなく取り付け得る面実装用トランスを提供すること。
【解決手段】フェライトコアに巻線が巻装されて構成されたトランス本体１０と、前記トランス本体を載置するのに必要な大きさを有する絶縁基板２１の少なくとも一面に配線パターンが形成され、かつ前記絶縁基板の周囲に巻線の端部を接続するための接続用端子２２が形成された台座２０とをそなえた面実装用トランス。
【選択図】図１