Abstract:
Anti-microbial coatings and powders and method of forming same on medical devices are provided. The coatings are formed by depositing an anti-microbial biocompatible metal by vapour deposition techniques to produce atomic disorder in the coating such that a sustained release of metal ions sufficient to produce an anti-microbial effect is achieved. Preferred deposition conditions to achieve atomic disorder include a lower than normal substrate temperature, and one or more of a higher than normal working gas pressure and a lower than normal angle of incidence of coating flux. Anti-microbial powders formed by mechanical working to produce atomic disorder are also provided. The anti-microbial effect of the coatings or powders may be further activated or enhanced by irradiating with a low linear energy transfer form of radiation such as gamma radiation.
Abstract:
Anti-microbial coatings and powders and method of forming same on medical devices are provided. The coatings are formed by depositing an anti-microbial biocompatible metal by vapour deposition techniques to produce atomic disorder in the coating such that a sustained release of metal ions sufficient to produce an anti-microbial effect is achieved. Preferred deposition conditions to achieve atomic disorder include a lower than normal substrate temperature, and one or more of a higher than normal working gas pressure and a lower than normal angle of incidence of coating flux. Anti-microbial powders formed by mechanical working to produce atomic disorder are also provided. The anti-microbial effect of the coatings or powders may be further activated or enhanced by irradiating with a low linear energy transfer form of radiation such as gamma radiation.
Abstract:
Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are formed by depositing a biocompatible metal by vapor deposition techniques to produce atomic disorder in the coating such that a sustained release of metal ions sufficient to produce an anti-microbial effect is achieved. Preferred deposition conditions to achieve atomic disorder include a lower than normal substrate temperature, and one or more of a higher than normal working gas pressure and a lower than normal angle of incidence of coating flux. Anti-microbial powders formed by mechanical working to produce atomic disorder are also provided. The invention extends to other metal coatings and powders similarly formed so as to provide enhanced solubility.
Abstract:
Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are formed by depositing a biocompatible metal by vapor deposition techniques to produce atomic disorder in the coating such that a sustained release of metal ions sufficient to produce an anti-microbial effect is achieved. Preferred deposition conditions to achieve atomic disorder include a lower than normal substrate temperature, and one or more of a higher than normal working gas pressure and a lower than normal angle of incidence of coating flux. Anti-microbial powders formed by mechanical working to produce atomic disorder are also provided. The invention extends to other metal coatings and powders similarly formed so as to provide enhanced solubility.
Abstract:
There is provided a surface alloyed component which comprises a base alloy with a diffusion barrier layer enriched in silicon and chromium being provided adjacent thereto. An enrichment pool layer is created adjacent said diffusion barrier and contains silicon and chromium and optionally titanium or aluminum. A reactive gas treatment may be used to generate a replenishable protective scale on the outermost surface of said component.
Abstract:
A process is described of forming an electroluminescent (EL) display panel formed from an EL laminate having a phosphor layer (22) sandwiched between a front and a rear set of intersecting address lines (14,24), the rear address lines (12) being formed on a substrate (12) having sufficient rigidity to support the laminate and the phosphor layer being separated from the rear address lines by one or more dielectric layers (18,20); the process comprising the steps of: (a) providing a substrate formed with a plurality of through holes (32) patterned to be proximate the ends of the address lines to be subsequently formed; (b) forming a conductive path through each of the through holes in the substrate to provide for electrical connection of each address line, subsequently formed, to the voltage driving circuit (30); (c) forming the rear spaced address lines (14) on the substrate (12), one end of each line ending adjacent a through hole (32) and being electrically connected with the conductive path therethrough; (d) forming a dielectric layer (18,20) on the rear address lines (14); (e) forming the phosphor layer (22) above the dielectric layer: (f) optionally forming a transparent dielectric layer on the phosphor layer; and then (g) forming the front spaced address lines (24) on the underlying phosphor or transparent dielectric layer, one end of each line ending adjacent a through hole and being electrically connected with the conductive path therethrough. The invention also describes a method for laser scribing a pattern in a planar laminate (preferably an EL panel) having at least one overlying layer (e.g. a transparent layer for forming the front address lines (24)) and at least one underlying layer (e.g. a phosphor layer (22)); the method comprising: applying a focused laser beam on the overlying layer side of the laminate, said laser beam having a wavelength which is substantially unabsorbed by the overlying layer (24) but which is absorbed by the underlying layer (22), such that at least a portion of the underlying layer (22) is directly ablated and the overlying layer (24) is indirectly ablated throughout its thickness (thereby forming individual front address lines (24)).
Abstract:
An electroluminescent laminate is provided that comprises:
a planar phosphor layer (22); a front and a rear planar electrode (14,24) on either side of the phosphor layer; a planar dielectric layer, which is preferably composed of a thick layer (18) and a thin layer (20), between the rear electrode and the phosphor layer, the dielectric layer being formed from sintered ceramic material such that the dielectric layer provides a dielectric strength S which is greater than about 1.0 X 106 V/m and a dielectric constant such that the ratio of the dielectric constant of the dielectric layer to that of the phosphor layer is greater than about 50:1, the dielectric layer having a thickness sufficient to prevent dielectric breakdown during operation as determined by the equation d2 = V/S, wherein d2 is the thickness of the dielectric layer and V is the maximum applied voltage, the dielectric layer forming a surface adjacent the phosphor layer which is sufficiently smooth that the phosphor layer illuminates generally uniformly at a given excitation voltage, and wherein the dielectric layer is either in contact with the phosphor layer or spaced apart from it by at least one additional layer that is itself in contact with the phosphor layer and wherein the layer that is in contact with the phosphor layer is compatible with the phosphor layer.
Abstract translation:提供了一种电致发光叠层,其包括:平面荧光层(22); 在所述荧光体层的任一侧上的前部和后部平面电极(14,24) 在后电极和磷光体层之间的平面介电层,其优选地由厚层(18)和薄层(20)组成,介电层由烧结陶瓷材料形成,使得介电层提供介电层 大于约1.0×10 6 V / m的强度S和介电常数使得介电层的介电常数与磷光体层的介电常数之比大于约50:1,所述介电层具有足够的厚度 为了防止在由等式d2 = V / S确定的操作期间的介质击穿,其中d2是介电层的厚度并且V是最大施加电压,介电层形成邻近磷光体层的表面,该表面足够光滑, 磷光体层在给定的激励电压下通常均匀地照射,并且其中介电层或者与荧光体层接触或者与荧光体层隔开1° 它自身与磷光体层接触,并且其中与磷光体层接触的层与磷光体层相容。