LOGIC CIRCUITRY PACKAGE
    101.
    发明申请

    公开(公告)号:WO2020117397A1

    公开(公告)日:2020-06-11

    申请号:PCT/US2019/058048

    申请日:2019-10-25

    Abstract: A logic circuitry package for a replaceable print apparatus component includes an I2C interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to respond to communications over the I2C interface that are directed to an initial or reconfigured I2C address. The at least one logic circuit is configured to receive, via the I2C interface, a write command to a first memory address of the logic circuit to initiate a first function of the logic circuit. The at least one logic circuit is configured to generate first data in response to the first function. The at least one logic circuit is configured to receive, via the I2C interface, a first read command to a second memory address of the logic circuit. The at least one logic circuit is configured to transmit, via the I2C interface, the first data in response to the first read command to the second memory address.

    IMAGING MEDIUM
    104.
    发明申请
    IMAGING MEDIUM 审中-公开

    公开(公告)号:WO2019199331A1

    公开(公告)日:2019-10-17

    申请号:PCT/US2018/027621

    申请日:2018-04-13

    Abstract: An example of an imaging medium includes a substrate, a color-forming layer on the substrate, and a registration mark. The color-forming layer includes a repeated pattern. A repeat of the pattern includes four adjacent color-forming stripes including a black-forming stripe, a cyan-forming stripe, a magenta-forming stripe, and a yellow-forming stripe, or a grid of four color-forming sections including i) a color-forming section selected from the group consisting of black-forming, cyan-forming, light cyan-forming, yellow-forming, magenta-forming, and light magenta-forming, ii) a cyan-forming section, iii) a magenta-forming section, and iv) a yellow-forming section.

    MULTIZONAL MICROFLUIDIC DEVICES
    105.
    发明申请

    公开(公告)号:WO2019103732A1

    公开(公告)日:2019-05-31

    申请号:PCT/US2017/062943

    申请日:2017-11-22

    Abstract: A multizonal microfluidic device can include a substrate with multiple structures mounted thereon, including a first and second lid, and a first and second microchip. The first lid and the substrate can form a first microfluidic chamber between structures including a first interior surface of the first lid and a first discrete portion of the substrate. The first lid can include a first inlet and a first vent positioned relative to one another to facilitate loading of fluid to the first microfluidic chamber via capillary action. A portion of the first microchip can be positioned within the first microfluidic chamber. Furthermore, the second lid can be configured like the first lid and can also be mounted on the substrate forming a second microfluidic chamber with the second microchip positioned within the second microfluidic chamber.

    MICROFLUIDIC DEVICE CHANNEL LAYER
    107.
    发明申请

    公开(公告)号:WO2019013777A1

    公开(公告)日:2019-01-17

    申请号:PCT/US2017/041689

    申请日:2017-07-12

    Abstract: A channel layer of a digital microfluidic device may include a number of sample wells located on a first side of the die, a number of first capillary channels fluidically coupled to each of the sample wells, the first capillary channels drawing a fluid from the sample wells using capillary forces, a capillary break fluidically coupled to each of the first capillary channels to dispense a portion of the fluid drawn from the sample wells through the capillary forces, a number of intermediate chambers fluidically coupled to the capillary break, a number of second capillary channels fluidically coupled to the intermediate chambers, the second capillary channels drawing the fluid from the intermediate chambers using capillary forces, and a number of mixing chambers fluidically coupled to the second capillary channels into which the capillary forces of the second capillary channels cause the fluid to enter the mixing chambers.

    MOLDED PANELS
    108.
    发明申请
    MOLDED PANELS 审中-公开

    公开(公告)号:WO2018203872A1

    公开(公告)日:2018-11-08

    申请号:PCT/US2017/030374

    申请日:2017-05-01

    Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

    CHIP TO CHIP FLUIDIC INTERCONNECT
    109.
    发明申请

    公开(公告)号:WO2018194635A1

    公开(公告)日:2018-10-25

    申请号:PCT/US2017/028744

    申请日:2017-04-21

    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.

Patent Agency Ranking