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公开(公告)号:WO2020117397A1
公开(公告)日:2020-06-11
申请号:PCT/US2019/058048
申请日:2019-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: LINN, Scott A. , CUMBIE, Michael W. , GARDNER, James Michael
Abstract: A logic circuitry package for a replaceable print apparatus component includes an I2C interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to respond to communications over the I2C interface that are directed to an initial or reconfigured I2C address. The at least one logic circuit is configured to receive, via the I2C interface, a write command to a first memory address of the logic circuit to initiate a first function of the logic circuit. The at least one logic circuit is configured to generate first data in response to the first function. The at least one logic circuit is configured to receive, via the I2C interface, a first read command to a second memory address of the logic circuit. The at least one logic circuit is configured to transmit, via the I2C interface, the first data in response to the first read command to the second memory address.
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公开(公告)号:WO2020117305A1
公开(公告)日:2020-06-11
申请号:PCT/US2019/026145
申请日:2019-04-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: GARDNER, James Michael , LINN, Scott A. , PANSHIN, Stephen D. , WARD, Jefferson P. , ROETHIG, David Owen , OLSEN, David N. , STUDER, Anthony D. , CUMBIE, Michael W. , LU, Sirena Chi
Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.
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公开(公告)号:WO2020106293A1
公开(公告)日:2020-05-28
申请号:PCT/US2018/062291
申请日:2018-11-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHEN, Chien-Hua , CUMBIE, Michael W.
Abstract: A fluid ejection module may include a plurality of fluid ejection dies coupled to a thermoset material and singulated, and a thermoplastic material coupled to the singulated, fluid ejection dies. The thermoplastic material may be bent to form a curvature in the fluid ejection module.
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公开(公告)号:WO2019199331A1
公开(公告)日:2019-10-17
申请号:PCT/US2018/027621
申请日:2018-04-13
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: BHATT, Jayprakash C. , CUMBIE, Michael W.
IPC: B41M5/34
Abstract: An example of an imaging medium includes a substrate, a color-forming layer on the substrate, and a registration mark. The color-forming layer includes a repeated pattern. A repeat of the pattern includes four adjacent color-forming stripes including a black-forming stripe, a cyan-forming stripe, a magenta-forming stripe, and a yellow-forming stripe, or a grid of four color-forming sections including i) a color-forming section selected from the group consisting of black-forming, cyan-forming, light cyan-forming, yellow-forming, magenta-forming, and light magenta-forming, ii) a cyan-forming section, iii) a magenta-forming section, and iv) a yellow-forming section.
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公开(公告)号:WO2019103732A1
公开(公告)日:2019-05-31
申请号:PCT/US2017/062943
申请日:2017-11-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: TORNIAINEN, Erik D. , ELY, Hilary , CUMBIE, Michael W. , WHITE, Rachel M. , HIGGINS, Adam
IPC: B01L3/00
Abstract: A multizonal microfluidic device can include a substrate with multiple structures mounted thereon, including a first and second lid, and a first and second microchip. The first lid and the substrate can form a first microfluidic chamber between structures including a first interior surface of the first lid and a first discrete portion of the substrate. The first lid can include a first inlet and a first vent positioned relative to one another to facilitate loading of fluid to the first microfluidic chamber via capillary action. A portion of the first microchip can be positioned within the first microfluidic chamber. Furthermore, the second lid can be configured like the first lid and can also be mounted on the substrate forming a second microfluidic chamber with the second microchip positioned within the second microfluidic chamber.
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公开(公告)号:WO2019022773A1
公开(公告)日:2019-01-31
申请号:PCT/US2017/044447
申请日:2017-07-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CUMBIE, Michael W. , CHEN, Chien-Hua
IPC: B41J2/14
Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.
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公开(公告)号:WO2019013777A1
公开(公告)日:2019-01-17
申请号:PCT/US2017/041689
申请日:2017-07-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: SHKOLNIKOV, Viktor , CUMBIE, Michael W. , CHEN, Chien-Hua
Abstract: A channel layer of a digital microfluidic device may include a number of sample wells located on a first side of the die, a number of first capillary channels fluidically coupled to each of the sample wells, the first capillary channels drawing a fluid from the sample wells using capillary forces, a capillary break fluidically coupled to each of the first capillary channels to dispense a portion of the fluid drawn from the sample wells through the capillary forces, a number of intermediate chambers fluidically coupled to the capillary break, a number of second capillary channels fluidically coupled to the intermediate chambers, the second capillary channels drawing the fluid from the intermediate chambers using capillary forces, and a number of mixing chambers fluidically coupled to the second capillary channels into which the capillary forces of the second capillary channels cause the fluid to enter the mixing chambers.
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公开(公告)号:WO2018203872A1
公开(公告)日:2018-11-08
申请号:PCT/US2017/030374
申请日:2017-05-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHEN, Chien-Hua , CUMBIE, Michael W.
IPC: B29C64/112 , B29C64/209 , B41J2/135 , B81B1/00 , B81C1/00
Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.
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公开(公告)号:WO2018194635A1
公开(公告)日:2018-10-25
申请号:PCT/US2017/028744
申请日:2017-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CUMBIE, Michael W. , SHKOLNIKOV, Viktor , CHEN, Chien-Hua
Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
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公开(公告)号:WO2018186844A1
公开(公告)日:2018-10-11
申请号:PCT/US2017/026049
申请日:2017-04-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CHEN, Chien-Hua , CUMBIE, Michael W. , PRZYBYLA, James R.
IPC: B41J2/175 , B41J29/377 , B41J2/18
Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.
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