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    CAPACITIVE SWITCH, SIGNAL RECEIVING AND SENDING DEVICE, AND MANUFACTURING METHOD
    105.
    发明公开
    CAPACITIVE SWITCH, SIGNAL RECEIVING AND SENDING DEVICE, AND MANUFACTURING METHOD 有权
    KAPAZITIVER SCHALTER，SIGNALEMPFANGS- UND SENDEVORRICHTUNG UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2814174A1

    公开(公告)日：2014-12-17

    申请号：EP13795985.4

    申请日：2013-03-20

    Applicant: Huawei Device Co., Ltd.

    Inventor： YANG, Xiong ,  CAO, Bocheng ,  WANG, Lei

    IPC: H03K17/96

    CPC classification number: B81B3/0072 ,  B81B3/001 ,  B81B2201/014 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

    Abstract: Embodiments of the present invention provide a capacitive switch, an apparatus for transceiving a signal, and a method for manufacturing the capacitive switch. The capacitive switch includes: a first conductive cantilever, a second conductive cantilever, a substrate, and a coplanar waveguide arranged on the substrate, where the coplanar waveguide includes a first conductor configured to transmit an electrical signal and a second conductor and a third conductor that are arranged as ground wires on two sides of the first conductor; an insulation medium layer is arranged on the first conductor, and a conducting layer is arranged on the insulation medium layer; the first conductive cantilever is connected to the second conductor by using a first fixed end, and the second conductive cantilever is connected to the third conductor by using a second fixed end; and when a direct-current signal is transmitted on the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever contact the conducting layer. In the capacitive switch provided in this embodiment, a stress generated by a metal film bridge of the capacitive switch is released by using a cantilever separate structure, thereby ensuring transmission quality of a signal.

    Abstract translation: 本发明的实施例提供一种电容式开关，用于收发信号的装置，以及制造该电容开关的方法。 电容开关包括：布置在基板上的第一导电悬臂，第二导电悬臂，基板和共面波导，其中共面波导包括被配置为传输电信号的第一导体和第二导体，以及第三导体， 在第一导体的两侧布置为接地线; 绝缘介质层布置在第一导体上，导电层布置在绝缘介质层上; 第一导电悬臂通过使用第一固定端连接到第二导体，并且第二导电悬臂通过使用第二固定端连接到第三导体; 并且当电容性开关上传输直流信号时，第一导电悬臂的第一自由端和第二导电悬臂的第二自由端接触导电层。 在本实施例中提供的电容开关中，通过使用悬臂分离结构来释放由电容开关的金属膜桥产生的应力，从而确保信号的传输质量。

    ELIMINATION OF SILICON RESIDUES FROM MEMS CAVITY FLOOR
    106.
    发明公开
    ELIMINATION OF SILICON RESIDUES FROM MEMS CAVITY FLOOR 有权
    ENTFERNUNG VONSILICIUMRÜCKSTÄNDENAUS MEMS-HOHLRAUMBÖDEN

    公开(公告)号：EP2739562A2

    公开(公告)日：2014-06-11

    申请号：EP12746449.3

    申请日：2012-08-03

    Applicant: Cavendish Kinetics Inc.

    Inventor： TROY, Brian I. ,  RENAULT, Mickael ,  MAGUIRE, Thomas L. ,  LACEY, Joseph Damian Gordon ,  BOBEY, James F.

    IPC: B81C1/00

    CPC classification number: B81C1/00484 ,  B81B3/0008 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0108 ,  H01H1/0036 ,  H01H2001/0089

    Abstract: The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter is typically used to adhere sacrificial material to material above the substrate. The adhesion promoter is the removed along with then sacrificial material. However, the adhesion promoter leaves silicon based residues within the cavity upon removal. The inventors have discovered that the adhesion promoter can be removed from the cavity area prior to depositing the sacrificial material. The adhesion promoter which remains over the remainder of the substrate is sufficient to adhere the sacrificial material to the substrate without fear of the sacrificial material delaminating. Because no adhesion promoter is used in the cavity area of the device, no silicon residues will be present within the cavity after the switching element of the MEMS device is freed.

    Abstract translation: 本发明一般涉及一种MEMS器件，其中来自粘合促进剂材料的硅残余物从空腔底板减少甚至消除。 粘合促进剂通常用于将牺牲材料粘附到衬底上方的材料。 粘附促进剂与牺牲材料一起被去除。 然而，粘合促进剂在除去后离开硅基残留物。 本发明人已经发现，在沉积牺牲材料之前，可以从空腔区域去除粘合促进剂。 保留在基材的其余部分上的粘合促进剂足以将牺牲材料粘附到基材上，而不用担心牺牲材料分层。 因为在器件的空腔区域中没有使用粘合促进剂，所以在MEMS器件的开关元件被释放之后，腔内将不存在硅残余物。

    A MEMS DEVICE WITH BI-DIRECTIONAL ELEMENT
    108.
    发明公开
    A MEMS DEVICE WITH BI-DIRECTIONAL ELEMENT 审中-公开
    MEMS配置双向元

    公开(公告)号：EP2162894A1

    公开(公告)日：2010-03-17

    申请号：EP08779783.3

    申请日：2008-06-26

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： GASPARYAN, Arman ,  GATES, Ohn, VanAtta ,  SIMON, Maria, Elina

    IPC: H01H37/00

    CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H37/00 ,  H01H2001/0047 ,  H01H2037/008 ,  H01H2061/006 ,  H01H2061/008

    Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

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