公开(公告)号：US20070299159A1

公开(公告)日：2007-12-27

申请号：US11800831

申请日：2007-05-08

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: C08G64/38

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US20070145585A1

公开(公告)日：2007-06-28

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US06956635B2

公开(公告)日：2005-10-18

申请号：US09988408

申请日：2001-11-19

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/13 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板的组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US06358627B2

公开(公告)日：2002-03-19

申请号：US09768112

申请日：2001-01-23

Applicant: Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L2144

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract translation: 集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。 柔韧的材料将球与芯片和衬底的焊盘可动地接触。 由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。 与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

公开(公告)号：US06332786B1

公开(公告)日：2001-12-25

申请号：US09480259

申请日：2000-01-11

Applicant: Yasuhiro Suga ,  Noriyuki Honda

Inventor： Yasuhiro Suga ,  Noriyuki Honda

IPC: H01R458

CPC classification number: H01L24/31 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29017 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An anisotropic electrically conductive film which reduces a connection resistance value in electrical connection to assure reliable electric connection, and an electrical connecting device employing this anisotropic electrically conductive film. To this end, metal coated particles having a resin (40) as a core material are dispersed in an insulating adhesive (8) to give an anisotropic electrically eonductive film. The resin (40) of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.

Abstract translation: 各向异性导电膜，其降低电连接中的连接电阻值以确保可靠的电连接;以及使用该各向异性导电膜的电连接装置。 为此，将具有树脂（40）作为芯材的金属涂覆的颗粒分散在绝缘粘合剂（8）中，得到各向异性的电导膜。 金属涂覆颗粒的树脂（40）涂覆有厚度为1000至3000的金属层。

公开(公告)号：US6110399A

公开(公告)日：2000-08-29

申请号：US98885

申请日：1998-06-17

Applicant: Ciaran Bernard McArdle ,  Joseph Burke

Inventor： Ciaran Bernard McArdle ,  Joseph Burke

IPC: H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  H01B1/02

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01R4/04 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347

Abstract: The invention provides a composition (3) comprising:(i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and(ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid.Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry.The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles.The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

Abstract translation: 本发明提供一种组合物（3），其包含：（i）含有非磁性载体液体中的铁磁颗粒的胶体悬浮液（4）的铁磁流体，和（ii）具有基本均匀的多个导电颗粒 尺寸和形状，分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒（5）。 通过磁体装置（8）对组合物（3）施加基本均匀的磁场使得导电颗粒（5）形成规则图案（9）。 该组合物用于在电子工业中的两组导体（2a，2b; 7a，7b）之间提供各向异性导电通路（9a，9b）。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：US5235741A

公开(公告)日：1993-08-17

申请号：US928036

申请日：1992-08-11

Applicant: Akira Mase

Inventor： Akira Mase

IPC: H01R4/04 ,  H05K1/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49201

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

Abstract translation: 描述形成在第一和第二基板上的电极布置之间的电连接。 将第一衬底放置在第二衬底上，在它们之间具有UV光可固化粘合剂。 UV光固化型粘合剂携带分散在其中的第一和第二颗粒。 将第一和第二基板彼此挤压并暴露于UV光以使粘合剂硬化。 第一颗粒由导电颗粒制成并且优选地是弹性的并且用于在第一和第二基板的电极之间形成电流路径。 第二颗粒起到防止第一颗粒被过度变形破坏的作用。

公开(公告)号：US5130833A

公开(公告)日：1992-07-14

申请号：US575442

申请日：1990-08-30

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/13 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: G02F1/13452 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  G02F2203/69 ,  H05K1/0306 ,  H05K1/148 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036 ,  H05K3/368

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US5034245A

公开(公告)日：1991-07-23

申请号：US485745

申请日：1990-02-27

Applicant: Hiroshi Matsubara

Inventor： Hiroshi Matsubara

IPC: G09F9/00 ,  G02F1/13 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/32

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/13 ,  H01L24/81 ,  H05K3/247 ,  H05K3/321 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0373 ,  H05K3/06 ,  H05K3/102

Abstract: A connection electrodes producing method has a step of forming resin layer which can be softened after hardened, on a circuit substrate on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.

Abstract translation: 连接电极的制造方法具有在形成有电极图案的电路基板上形成硬化后可以软化的树脂层的工序。 然后，仅电极图案上的树脂层材料固化并残留。 此后，通过软化树脂层并且通过软化树脂层将导电颗粒散布在电路基板上，导电颗粒仅粘附到电极图案上的树脂层。

公开(公告)号：US4729809A

公开(公告)日：1988-03-08

申请号：US16496

申请日：1987-02-17

Applicant: Ronald A. Dery ,  Warren C. Jones ,  William J. Lynn ,  John R. Rowlette

Inventor： Ronald A. Dery ,  Warren C. Jones ,  William J. Lynn ,  John R. Rowlette

IPC: H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K3/32 ,  H05K3/36 ,  B29C65/02 ,  B29C65/54 ,  B32B5/16 ,  B32B7/12

CPC classification number: H05K3/323 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K3/361 ,  Y10T156/109 ,  Y10T156/1093

Abstract: An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18). The units (24) are sufficiently spaced apart, however, to preclude electrical conductivity between adjacent areas on the same substrate. A method for electrically connecting conductive areas on two substrates by means of said anisotropically conductive adhesive composition (10) and products produced by said method are also disclosed.

Abstract translation: 公开了一种用于将一个基板（12）上的至少一个导电区域（14）与第二基板（18）上的至少一个导电区域（20）电连接的各向异性导电粘合剂组合物（10）。 组合物（10）由导电颗粒和非导电粘合剂粘合剂（26）的混合物组成。 导电颗粒在多个不连续的导电单元（24）中分散在整个粘合剂中，使得当在一个基板上的导电和绝缘区域（14,16）上施加组合物（10）的层（30） 12）并且以导电关系定位并且将所述至少一个导电区域（20）与所述第一基板（12）上的所述至少一个导电区域（14）粘附在所述第二基板（18）上，所述单元（24）建立 在两个基板（12,18）上的粘合的导电区域（14,20）之间的电连接。 然而，单元（24）足够间隔开以排除相同基板上的相邻区域之间的导电性。 还公开了通过所述各向异性导电粘合剂组合物（10）和由所述方法产生的产品电连接两个基板上的导电区域的方法。