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    A METHOD OF MANUFACTURING A UD-REINFORCED PWB LAMINATE
    102.
    发明申请
    A METHOD OF MANUFACTURING A UD-REINFORCED PWB LAMINATE 审中-公开
    一种UD增强PWB层压板的制造方法

    公开(公告)号：WO1994002306A1

    公开(公告)日：1994-02-03

    申请号：PCT/EP1993001919

    申请日：1993-07-20

    Applicant: AKZO N.V. ,  MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrick

    Inventor： AKZO N.V.

    IPC: B29C67/14

    CPC classification number: B32B37/02 ,  B29C70/083 ,  B29C70/202 ,  B29C70/504 ,  B29K2105/0845 ,  B29K2105/108 ,  B29L2031/3425 ,  B32B37/1027 ,  B32B37/226 ,  B32B2305/10 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0287 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24074 ,  Y10T428/24132 ,  Y10T428/24802 ,  Y10T428/24917

    Abstract: The invention relates to a method of manufacturing a composite laminate, preferably a cross-ply laminate, in which process unidirectionally oriented (UD) fibres (3) are provided with matrix material (7) and, together with a pre-formed non-flowing UD composite or cross-ply laminate, passed through a laminating zone (13) in layers of at least two different orientational directions. More particularly, the invention relates to the manufacture of composite material which is pre-eminently suited to be used as a supporting substrate for printed wire boards. The method according to the invention is directed in particular to the utilisation of a double belt press, both for making the pre-formed non-flowing UD composite and for the manufacture of the final laminate. The invention also comprises printed wire boards (PWBs) and multilayer PWBs.

    Abstract translation: 本发明涉及一种制造复合层压材料的方法，优选地是交叉层叠层，其中单向取向（UD）纤维（3）的工艺具有基体材料（7），并与预先形成的不流动 UD复合材料或交叉层压板，以至少两个不同取向方向的层穿过层压区域（13）。 更具体地，本发明涉及复合材料的制造，其特别适用于印刷线路板的支撑基底。 根据本发明的方法特别涉及双重带式压榨机的用途，用于制造预成型的非流动UD复合材料和用于制造最终层压板。 本发明还包括印刷线路板（PWB）和多层PWB。

    METHOD OF MAKING A UD CROSSPLY PWB LAMINATE HAVING ONE OR MORE INNER LAYERS OF METAL
    105.
    发明申请
    METHOD OF MAKING A UD CROSSPLY PWB LAMINATE HAVING ONE OR MORE INNER LAYERS OF METAL 审中-公开
    制造具有一层或多层金属层的UD CROSSPLY PWB层压板的方法

    公开(公告)号：WO1995020479A1

    公开(公告)日：1995-08-03

    申请号：PCT/EP1995000274

    申请日：1995-01-25

    Applicant: AKZO NOBEL N.V. ,  MIDDELMAN, Erik ,  SERAPHIM, Donald, Philip

    Inventor： AKZO NOBEL N.V.

    IPC: B29C70/22

    CPC classification number: B29C70/504 ,  B29C70/088 ,  B29C70/202 ,  B29K2105/108 ,  B32B15/14 ,  B32B37/02 ,  B32B37/1027 ,  B32B37/226 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/0287

    Abstract: The invention relates to a method of manufacturing a composite laminate having a plurality of UD layers, i.e., layers of matrix material reinforced with unidirectionally oriented fibres, and at least one inner metal layer, i.e., a metal layer that does not form an outer surface of the laminate, the layers being arranged so as to give a balanced and symmetric laminate. The method comprises passing through a laminating zone, preferably a double-belt press, unidirectionally oriented (UD) fibres provided with not yet consolidated matrix material and consolidating the matrix material. In a first step a non-flowing sandwich laminate of at least three layers is formed, the at least three layers being UD and metal layers, the sandwich laminate being formed by passing UD fibres provided with not yet consolidated matrix material through the laminating zone together with metal foil, and in a second step the non-flowing sandwich laminate is provided on its outer surfaces with UD layers, with additional UD layers optionally being added in subsequent steps.

    Abstract translation: 本发明涉及一种制造具有多个UD层的复合层压体的方法，即，用单向取向纤维增强的基体材料层，以及至少一个内金属层，即不形成外表面的金属层 的层叠体，这些层被布置成得到平衡和对称的层压体。 该方法包括通过层压区域，优选双层带式压榨机，单向定向（UD）纤维，其提供有尚未固化的基质材料并固结基质材料。 在第一步骤中，形成至少三层的不流动的夹层板，至少三层为UD和金属层，夹层层压板通过将尚未固化的基质材料提供的UD纤维通过层压区域一起形成 并且在第二步骤中，在其外表面上设置不流动夹层叠层的UD层，在随后的步骤中可选地添加另外的UD层。

    METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRE BOARD
    106.
    发明申请
    METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRE BOARD 审中-公开
    制造多层印刷线路板的方法

    公开(公告)号：WO1992022192A1

    公开(公告)日：1992-12-10

    申请号：PCT/EP1992001133

    申请日：1992-05-19

    Applicant: AKZO N.V. ,  MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

    Inventor： AKZO N.V.

    IPC: H05K03/46

    CPC classification number: H05K3/4655 ,  B32B37/12 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/249994

    Abstract: A process for manufacturing a multilayer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate (8) based on a UD-reinforced synthetic material, provided on either side with traces (7), is combined with and bonded to a back-up substrate (9), wherein during the laminating process the back-up substrate (9) is added to the basic substrate, the back-up substrate (9) comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer (15), and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces (7) of the basic substrate (8), and the space between these traces is filled with the adhesive material, so bonding the basic substrate (8) and the back-up substrate (9).

    Abstract translation: 一种制造多层印刷线路板的方法，也被称为多层，其包括至少两个电绝缘基底，其中至少三个表面设有导电迹线或层，其中通过压力层压， 基于在两侧设置有迹线（7）的UD增强合成材料的固化的基底基板（8）与支撑基板（9）结合并结合到支撑基板（9）上，其中在层压工艺期间，支撑基板 （9）被添加到基本基板中，所述支撑基板（9）包括至少在面向基础基板的导电迹线的一侧上设置的UD增强的固化芯层，其具有仍然可塑性（可流动的）粘合剂层 （15），并且这样的压力施加在层压板上，以使支撑衬底的固化芯层与基底衬底（8）的导电迹线（7）接触或实际上接触，并且t 这些迹线之间的空间填充有粘合剂材料，从而粘结基底（8）和支撑基片（9）。

    PRINTED WIRE BOARDS AND METHOD OF MAKING SAME
    107.
    发明申请
    PRINTED WIRE BOARDS AND METHOD OF MAKING SAME 审中-公开
    印刷线及其制作方法

    公开(公告)号：WO1992022191A1

    公开(公告)日：1992-12-10

    申请号：PCT/EP1992001132

    申请日：1992-05-19

    Applicant: AKZO N.V. ,  MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

    Inventor： AKZO N.V.

    IPC: H05K01/03

    CPC classification number: H05K1/036 ,  B32B5/12 ,  H05K1/0366 ,  H05K2201/0236 ,  H05K2201/0287 ,  Y10T428/24058 ,  Y10T428/24124 ,  Y10T428/24917 ,  Y10T442/656

    Abstract: The invention relates to a method of manufacturing a supporting board for printed circuits and to the board so obtainable, the method comprising the following steps: manufacturing an electrically non-conducting synthetic layer reinforced with unidirectionally oriented fibres, which will not be made to flow during the subsequent steps; coating at least part of the aforementioned unidirectional laminate with an adhesive on one or both sides; stacking the laminates which have at any rate been coated in part with an adhesive in such a way that there is at least one layer of adhesive between each pair of layers and practically the same amount of material of even thickness and composition is disposed in the virtually perpendicularly intersecting orientation directions; bonding the stacked UD-laminates by activating the adhesive layers.

    Abstract translation: 本发明涉及一种制造用于印刷电路的支撑板和可获得的板的方法，该方法包括以下步骤：制造用单向取向纤维增强的不导电合成层，其不会在 后续步骤; 在一侧或两侧用粘合剂涂覆上述单向层叠体的至少一部分; 堆叠层压板，其任何速率部分地用粘合剂涂覆，使得在每对层之间存在至少一层粘合剂，并且实际上相同量的均匀厚度和组成的材料被放置在实际上 垂直相交的取向方向; 通过激活粘合剂层来粘结堆叠的UD-层压板。

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