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    인쇄회로기판 및 이를 이용한 반도체 패키지
    104.
    发明公开
    인쇄회로기판 및 이를 이용한 반도체 패키지 无效
    印刷电路板和使用相同的半导体封装

    公开(公告)号：KR1020100066941A

    公开(公告)日：2010-06-18

    申请号：KR1020080125464

    申请日：2008-12-10

    Applicant: 에스케이하이닉스 주식회사

    Inventor： 도은혜

    IPC: H05K1/02 ,  H05K1/09

    CPC classification number: H05K1/0209 ,  H05K1/111 ,  H05K3/0061 ,  H05K2201/09372

    Abstract: PURPOSE: A printed circuit board and a semiconductor package using the same are provided to prevent the deterioration of a semiconductor device property by easily releasing heat. CONSTITUTION: A conductive pattern(108) is formed on the top and bottom side of a core layer(102). The conductive pattern has a bond finger(104) and a ball land(106). A solder resist(110) is formed on the top and bottom side of the core layer. The solder resist exposes the bond finger and the ball land. The solder resist comprises a first solder resist(110a) and a second solder resist(110b). The inside of the second solder resist is composed of an insulating material. The insulating material contains a conductive filler(112).

    Abstract translation: 目的：提供一种印刷电路板和使用其的半导体封装，以通过容易地释放热量来防止半导体器件性质的劣化。 构成：在芯层（102）的顶侧和底侧形成导电图案（108）。 导电图案具有粘结指状物（104）和球状区域（106）。 在芯层的顶侧和底侧形成阻焊剂（110）。 阻焊剂暴露粘结指状物和球状物。 阻焊剂包括第一阻焊剂（110a）和第二阻焊剂（110b）。 第二阻焊层的内部由绝缘材料构成。 绝缘材料包含导电填料（112）。

    카메라 모듈 및 그 제조방법
    105.
    发明公开
    카메라 모듈 및 그 제조방법 有权
    相机模块及其制造方法

    公开(公告)号：KR1020090128273A

    公开(公告)日：2009-12-15

    申请号：KR1020080054352

    申请日：2008-06-10

    Applicant: 삼성전기주식회사

    Inventor： 박명재 ,  권세문 ,  석진수 ,  강환준

    IPC: H04N5/225

    CPC classification number: H04N5/2251 ,  H05K2201/05 ,  H05K2201/09372

    Abstract: PURPOSE: A camera module and a manufacturing method of the same are provided to prevent conductive filling agent from being flown into a side of a substrate, thereby preventing short. CONSTITUTION: A connection board(20) comprises one or more connection pads. The connection pads are electrically connected to an actuator. A substrate comprises at least one connection terminal electrically connected to the connection pads. Cavities(35) receive the sections of the connection pads.

    Abstract translation: 目的：提供相机模块及其制造方法，以防止导电填充剂流入基板侧，从而防止短路。 构成：连接板（20）包括一个或多个连接垫。 连接垫电连接到致动器。 基板包括电连接到连接焊盘的至少一个连接端子。 空穴（35）接收连接垫的部分。

    인쇄회로기판
    106.
    发明公开
    인쇄회로기판 无效
    印刷电路板

    公开(公告)号：KR1020090069830A

    公开(公告)日：2009-07-01

    申请号：KR1020070137634

    申请日：2007-12-26

    Applicant: 삼성전기주식회사

    Inventor： 김성호 ,  신영환 ,  이태곤

    IPC: H05K1/11

    CPC classification number: H05K1/111 ,  H05K3/103 ,  H05K2201/09372 ,  H05K2201/10287

    Abstract: A printed circuit board is provided to increase the number of pads formed in a limited region by reducing width of the pad from one end to the other end. A printed circuit board(200) includes an insulation layer(220), a contact point(212), and a plurality of pads(210). A plurality of pads is formed on the insulation layer. Width of the pad is reduced from one end(a) to the other end(b). The pad has a trapezoidal shape. The pad is electrically bonded in an electrode of an electronic device through a wire. One end and the other end of the pads are alternately arranged according to a width direction in order to secure a dimension for a wire bonding. Opposite side surfaces of adjacent pads are engaged each other.

    Abstract translation: 提供一种印刷电路板，用于通过从一端到另一端减小垫的宽度来增加在有限区域中形成的焊盘的数量。 印刷电路板（200）包括绝缘层（220），接触点（212）和多个焊盘（210）。 绝缘层上形成有多个焊盘。 垫的宽度从一端（a）减小到另一端（b）。 垫具有梯形形状。 焊盘通过导线电连接在电子设备的电极中。 焊盘的一端和另一端根据宽度方向交替布置，以确保引线接合的尺寸。 相邻垫的相对侧表面彼此接合。

    연성 회로 기판 및 그 제조방법
    107.
    发明公开
    연성 회로 기판 및 그 제조방법 无效
    柔性印刷电路及其制造方法

    公开(公告)号：KR1020080085443A

    公开(公告)日：2008-09-24

    申请号：KR1020070026980

    申请日：2007-03-20

    Applicant: 한화테크윈 주식회사

    Inventor： 김기수 ,  임현태 ,  오종수 ,  국승정

    IPC: H05K1/02 ,  G02F1/1345

    CPC classification number: H05K1/113 ,  G02F1/1345 ,  H05K1/0393 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/09372

    Abstract: A flexible printed circuit board and a method for fabricating the same are provided to increase the number of channels by connecting pads of a second wiring pattern array to electrode lines through conductive material filled in through holes. A flexible printed circuit board includes a first wiring pattern array(110) and a second wiring pattern array(120). The first wiring pattern array is formed at an upper part of a base film(100) and includes a plurality of wiring patterns. The wiring patterns are separated from each other and include electrode lines(111) and pads(115). The pads are formed at one ends of the electrode lines. The second wiring pattern array includes a plurality of wiring patterns. The wiring patterns are separated from each other and include pads(125) and electrode lines(121). The pads are formed at the upper part of the base film. The electrode lines are formed at a lower part of the base film.

    Abstract translation: 提供柔性印刷电路板及其制造方法，以通过将第二布线图案阵列的焊盘通过填充在通孔中的导电材料连接到电极线来增加通道数。 柔性印刷电路板包括第一布线图形阵列（110）和第二布线图案阵列（120）。 第一布线图案阵列形成在基膜（100）的上部，并且包括多个布线图案。 布线图案彼此分离并且包括电极线（111）和焊盘（115）。 焊盘形成在电极线的一端。 第二布线图形阵列包括多个布线图案。 布线图案彼此分离并且包括焊盘（125）和电极线（121）。 垫片形成在基膜的上部。 电极线形成在基膜的下部。

    전기 접속구조
    108.
    发明公开
    전기 접속구조 有权
    电气连接结构

    公开(公告)号：KR1020080044800A

    公开(公告)日：2008-05-21

    申请号：KR1020077019709

    申请日：2006-10-27

    Applicant: 가부시키가이샤 아사히 덴카 겐큐쇼

    Inventor： 미조구치마사노리

    IPC: H05K1/11

    CPC classification number: H05K1/115 ,  H05K1/118 ,  H05K2201/09372

    Abstract: There is provided an electrical connection structure (C) in which a connection portion is lowered in height and is freely attached and detached. In the electrical connection structure (C), a flexible substrate is used as a first connection member (A) and the first connection member is provided with an insulating film (1) having flexibility, at least one conductive pad (2) formed on at least one surface (1a) of the insulating film (1), a conductor circuit pattern (3) led out from the edge of the pad (2), a through-hole (4) formed in the area of the pad (2) and in the thickness direction of the insulating film (1), and a small hole (5) formed in the area of the pad (2) so as to communicate with the through-hole (4). A second connection member (B) has a conductive projection (7) formed on at least one surface (6a) and electrically connected to a conductor circuit pattern (8) formed inside or on the surface (6a). The conductive projection (7) is inserted into the small hole (5) of the pad (2), forming the electrical connection structure (C) in which the pad (2) and the conductive projection (7) are mechanically contacted with the though-hole (4) of the first connection member (A).

    Abstract translation: 提供了一种电连接结构（C），其中连接部分的高度降低并且自由地附接和分离。 在电连接结构（C）中，柔性基板用作第一连接部件（A），第一连接部件设置有具有柔性的绝缘膜（1），至少一个形成在其上的导电焊盘 绝缘膜（1）的至少一个表面（1a），从焊盘（2）的边缘引出的导体电路图案（3），形成在焊盘（2）的区域中的通孔（4） 和绝缘膜（1）的厚度方向，以及形成在所述垫（2）的区域中以与所述通孔（4）连通的小孔（5）。 第二连接构件（B）具有形成在至少一个表面（6a）上的导电突起（7）并电连接到形成在表面（6a）内部或表面（6a）上的导体电路图案（8）。 导电突起（7）插入到焊盘（2）的小孔（5）中，形成电连接结构（C），其中焊盘（2）和导电突起（7）机械地接触焊盘 - 第一连接构件（A）的孔（4）。

    이미지 센서 모듈 및 이를 구비한 카메라 모듈
    109.
    发明公开
    이미지 센서 모듈 및 이를 구비한 카메라 모듈 失效
    图像传感器模块和包含相机的摄像机模块

    公开(公告)号：KR1020080031570A

    公开(公告)日：2008-04-10

    申请号：KR1020060097600

    申请日：2006-10-04

    Applicant: 한화테크윈 주식회사

    Inventor： 차지범 ,  정하천 ,  황산덕

    IPC: H04N5/225

    CPC classification number: H04N5/2251 ,  H04N5/335 ,  H05K3/4007 ,  H05K2201/05 ,  H05K2201/09372

    Abstract: An image sensor module and a camera module having the same are provided to mount an image pickup device and a passive device on a multilayer PCB of which end portions are formed in the upper and lower sides, thereby protecting the image pickup device and the passive device from an external impact. An image pickup region and a bump are formed in the front of an image pickup device(105), and incident light is converted into an electric signal in the image pickup region. The bump connects the image pickup region to the outside electrically. The image pickup device is mounted to a multilayer PCB(Printed Circuit Board)(110). At least one cavity is formed on the multilayer PCB to mount a passive device(104) on the upper side and the lower side of the multilayer PCB. The multilayer PCB has a through hole(A) for exposing the image pickup region and an electrode pad formed in the rear to be connected to the bump. The at least one passive device is built in the cavity. A top layer and a bottom layer are composed of hard PCBs(103) out of the multilayer PCB. At least one layer out of inner layers of the multilayer PCB is composed of a flexible PCB(102).

    Abstract translation: 提供了一种图像传感器模块和具有该图像传感器模块和相机模块以将图像拾取装置和无源装置安装在其上端和下侧形成端部的多层PCB上，从而保护图像拾取装置和无源装置 从外部影响。 在图像拾取装置（105）的前部形成图像拾取区域和凸块，并且入射光在图像拾取区域中被转换为电信号。 凸块将图像拾取区域连接到外部。 图像拾取装置安装到多层PCB（印刷电路板）（110）。 在多层PCB上形成至少一个空腔，以在多层PCB的上侧和下侧安装无源器件（104）。 多层印刷电路板具有用于曝光图像拾取区域的通孔（A）和形成在后面的待连接到凸块的电极焊盘。 至少一个无源器件被构建在腔中。 顶层和底层由多层PCB中的硬PCB（103）组成。 多层PCB的内层中的至少一层由柔性PCB（102）组成。

    인쇄회로기판에 ＳＭＤ부품을 실장하는 방법
    110.
    发明公开
    인쇄회로기판에 ＳＭＤ부품을 실장하는 방법 无效
    方法安装印刷电路板上的SMD

    公开(公告)号：KR1020070023254A

    公开(公告)日：2007-02-28

    申请号：KR1020050077613

    申请日：2005-08-24

    Applicant: 삼성전자주식회사

    Inventor： 조정석

    IPC: H05K3/30

    CPC classification number: H05K3/3452 ,  H05K3/3484 ,  H05K2201/09372

    Abstract: 본 발명은, 인쇄회로기판에 SMD부품을 실장하는 방법에 관한 것으로서, 상기 인쇄회로기판에 회로패턴을 형성하는 단계; 상기 인쇄회로기판에 상기 회로패턴의 일영역에 솔더마스크를 형성하는 PSR 단계; 상기 솔더마스크의 영역에 동일한 크기로 SMD부품이 실장되는 랜드를 형성하는 단계; 상기 랜드에 솔더크림을 도포하고 상기 SMD부품을 실장하여 상기 솔더크림을 경화시키는 단계를 포함하는 것을 특징으로 한다. 이에 의하여, 솔더크림이 경화될 때 SMD부품이 들뜨는 맨하턴 불량의 발생율을 낮출 수 있는 일정한 랜드형상을 만들 수 있다.

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