公开(公告)号：US07591649B2

公开(公告)日：2009-09-22

申请号：US12100294

申请日：2008-04-09

Applicant: Ta-Hsiang Yen ,  Yen-Hung Huang ,  Chih-Ming Lai

Inventor： Ta-Hsiang Yen ,  Yen-Hung Huang ,  Chih-Ming Lai

IPC: H01R12/00

CPC classification number: H05K1/142 ,  H05K2201/09163 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2203/167

Abstract: An illumination device using LEDs (101) has a circuit board and a plurality of LEDs disposed on the circuit board elements. The circuit board can be obtained by assembling a plurality of the circuit board elements (11) together. The circuit board element comprises a board (110) and an electric trace (1151) attached to the board. The board comprises a plurality of connecting units (111, 112, 113, 114) formed at lateral sides thereof. The circuit board element connects with an adjacent circuit board element via the connecting units. The electric trace extends from the board to the connecting units and electrically connects with the electric trace of the adjacent circuit board element.

Abstract translation: 使用LED（101）的照明装置具有布置在电路板元件上的电路板和多个LED。 可以通过将多个电路板元件（11）组装在一起来获得电路板。 电路板元件包括板（110）和连接到板的电迹线（1151）。 板包括形成在其横向侧面的多个连接单元（111,112,113,114）。 电路板元件通过连接单元与相邻的电路板元件连接。 电迹线从板延伸到连接单元，并与相邻电路板元件的电迹线电连接。

公开(公告)号：US20090065797A1

公开(公告)日：2009-03-12

申请号：US12230447

申请日：2008-08-28

Applicant: Yong Suk Kim ,  Hoon Hur

Inventor： Yong Suk Kim ,  Hoon Hur

IPC: H01L21/00 ,  G02F1/1335

CPC classification number: H05K1/142 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167

Abstract: A light emitting unit capable of widely adjusting brightness or size, and a liquid crystal display device using the same are disclosed. The light emitting unit includes a circuit board including circuit lines having a plurality of connecting members, and a plurality of unit module connected to the connecting members of the circuit board. The unit module is coupled with at least one light emitting device.

Abstract translation: 公开了能够广泛调节亮度或尺寸的发光单元以及使用其的液晶显示装置。 发光单元包括电路板，其包括具有多个连接构件的电路线，以及连接到电路板的连接构件的多个单元模块。 单元模块与至少一个发光装置耦合。

公开(公告)号：US07145779B2

公开(公告)日：2006-12-05

申请号：US11009250

申请日：2004-12-10

Applicant: Shih-Hsiung Lien

Inventor： Shih-Hsiung Lien

IPC: H05K7/10 ,  H05K7/02

CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

Abstract: A memory module includes a plurality of memory units and an assembling holder. Each of the memory units includes a memory substrate, at least a memory chipset having a predetermined memory capacity mounted on the memory substrate, and an electric terminal provided at a lower edge portion of the memory substrate. The assembling holder includes an elongated unit housing having an elongated receiving slot extended therealong and a signal terminal provided along the unit housing, wherein the electric terminals of the memory substrates are detachably inserted into the receiving slot of the unit housing to electrically connect the electric terminals with the signal terminal, such that the memory units are alignedly and detachably mounted along the receiving slot in an edge to edge manner.

Abstract translation: 存储器模块包括多个存储器单元和组装保持器。 每个存储器单元包括存储器基板，至少存储器芯片组具有安装在存储器基板上的预定存储器容量，以及设置在存储器基板的下边缘部分处的电端子。 组装保持器包括细长单元壳体，其具有沿其延伸的细长接收槽和沿单元壳体设置的信号端子，其中存储器基板的电端子可拆卸地插入到单元壳体的接收槽中，以电连接电端子 信号端子，使得存储器单元沿着接收槽以边缘到边缘的方式对齐地和可拆卸地安装。

公开(公告)号：US20050070163A1

公开(公告)日：2005-03-31

申请号：US10892880

申请日：2004-07-15

Applicant: Frank Redmond ,  Frank Redmond

Inventor： Frank Redmond ,  Frank Redmond

IPC: H01R13/514 ,  H05K1/14 ,  H01R13/66

CPC classification number: H05K1/142 ,  H01R13/514 ,  H05K2201/09963 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10S439/928

Abstract: A circuit comprises a first circuit portion that includes an electrically insulative first body having a first connector and a first circuit element coupled to the first body. The circuit further comprises a second circuit portion that includes an electrically insulative second body having a second connector coupled to the first connector and a second circuit element coupled to the second body. The circuit further comprises a first electrical conductor coupled to the first and second circuit elements.

Abstract translation: 电路包括第一电路部分，其包括具有第一连接器的电绝缘的第一主体和耦合到第一主体的第一电路元件。 电路还包括第二电路部分，其包括电绝缘的第二主体，其具有耦合到第一连接器的第二连接器和耦合到第二主体的第二电路元件。 电路还包括耦合到第一和第二电路元件的第一电导体。

公开(公告)号：US20050033125A1

公开(公告)日：2005-02-10

申请号：US10897465

申请日：2004-07-23

Applicant: Nagao Miyazaki ,  Yoshihiko Suzuki

Inventor： Nagao Miyazaki ,  Yoshihiko Suzuki

IPC: H01R4/04 ,  H01R13/66 ,  H05K1/00 ,  H05K1/14 ,  H05K3/32 ,  A61B5/05

CPC classification number: H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

Abstract: In a construction for electrically connecting electrical unit with joint surfaces thereof opposed to each other, wiring patterns electrically connected with distortion gauges are formed on function-element forming surfaces of each electrical three-dimensional unit and are extended to edge portions formed between the function-element forming surfaces and adjacent wiring surfaces as the joint surfaces to form first lands; second lands extending from the edge portions by a specified distance are formed at positions of the wiring surfaces corresponding to the first lands; and electrical connectors displaying a joining performance upon being pressed together are formed to bridge the first and second lands while being held in close contact with the first and second lands. A plurality of three-dimensional electrical unit can be securely and easily electrically connected with each other with high precision.

Abstract translation: 在将电气单元与其相对的接合面电连接的结构中，在每个电三维单元的功能元件形成表面上形成与变形量规电连接的布线图案，并延伸到形成在功能元件之间的边缘部分， 元件形成表面和相邻布线表面作为接合表面以形成第一焊盘; 在与第一焊盘对应的布线面的位置处形成从边缘部延伸规定距离的第二焊盘; 并且形成在被压在一起时显示接合性能的电连接器，以在与第一和第二焊盘保持紧密接触的同时桥接第一和第二焊盘。 多个三维电气单元可以以高精度牢固且容易地彼此电连接。

公开(公告)号：US20020060904A1

公开(公告)日：2002-05-23

申请号：US09961172

申请日：2001-09-24

Inventor： Kazuhito Higuchi

IPC: H05K007/02 ,  H05K007/06

CPC classification number: H05K3/4617 ,  H01L25/50 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K3/205 ,  H05K2201/0195 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2201/09963 ,  H05K2203/016 ,  H05K2203/1189

Abstract: An electronic component including an element main body section for performing an electrical function and a terminal section for electrically connecting the element main body section to a conductive member of an external device, the electronic component comprises a pair of sections arranged above the terminal section and opposite to each other in a stacking direction of the electronic component and a distance between the sections corresponding to a maximum thickness of the electronic component.

Abstract translation: 一种电子部件，包括用于执行电功能的元件主体部分和用于将元件主体部分电连接到外部装置的导电部件的端子部分，所述电子部件包括布置在所述端子部分上方的一对部分， 在电子部件的层叠方向上彼此相对的距离和对应于电子部件的最大厚度的部分之间的距离。

公开(公告)号：WO2010028006A2

公开(公告)日：2010-03-11

申请号：PCT/US2009055678

申请日：2009-09-02

Applicant: USG INTERIORS INC ,  BOSS DANIEL ,  QUALLS SCOTT ,  MCDONALD DAVID ,  KAISERMAN TERRANCE Z ,  MARGOLIN KEITH J ,  WASSIEF MICHAEL ,  CHAI LIANG

Inventor： BOSS DANIEL ,  QUALLS SCOTT ,  MCDONALD DAVID ,  KAISERMAN TERRANCE Z ,  MARGOLIN KEITH J ,  WASSIEF MICHAEL ,  CHAI LIANG

IPC: H01B3/00

CPC classification number: H01H59/00 ,  H01B5/02 ,  H01B13/165 ,  H01H49/00 ,  H01R4/2404 ,  H01R25/147 ,  H05K3/103 ,  H05K2201/09672 ,  H05K2201/09963 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T307/74

Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

Abstract translation: 提供了包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体，其中绝缘体位于第一和第二导体之间以将它们电隔离。 电源可以连接在第一和第二导体之间以向其提供电力，并且电气设备可以跨越第一和第二导体连接。

公开(公告)号：WO2009043670A3

公开(公告)日：2009-06-18

申请号：PCT/EP2008061599

申请日：2008-09-03

Applicant: SIEMENS AG ,  BIRNER MARTIN ,  KREUTZER RAINER ,  SCHIERLING HUBERT ,  SELIGER NORBERT

Inventor： BIRNER MARTIN ,  KREUTZER RAINER ,  SCHIERLING HUBERT ,  SELIGER NORBERT

IPC: H01L25/065 ,  H01L23/373 ,  H01L23/538

CPC classification number: H05K1/142 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/09963 ,  Y10T29/49117 ,  H01L2924/00

Abstract: The invention relates to an electronic circuit. In order to improve manufacture thereof, the electronic circuit is composed of modules of sub-circuits that are arranged on a common substrate, such as a cooling body, and that are electrically interconnected by means of a planar electrical contact element.

Abstract translation: 一种电子电路被模块化为在子电路，其被布置在共同的载体上，诸如散热器改进的生产，并且由平坦的电接触电连接。

公开(公告)号：WO2008037450A1

公开(公告)日：2008-04-03

申请号：PCT/EP2007/008371

申请日：2007-09-26

Applicant: SAKMA ELECTRONICA INDUSTRIAL, S.A. ,  SANABRA CUNILL, Angel

Inventor： SANABRA CUNILL, Angel

IPC: H01L25/075 ,  H05K1/14 ,  F21S2/00

CPC classification number: H05K1/0286 ,  F21K9/00 ,  H05K1/142 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09845 ,  H05K2201/09963 ,  H05K2201/10106

Abstract: This device includes boards (1) housing a large number of LEDs (2) electrically connected with the tracks of a printed circuit (3), arranged in the board (1) according to an equilateral triangular distribution and separated from one another at a fixed distance "a", these light emitting diodes project beams of light interlacing from a certain distance "d" of the board, giving even mass of light to the device at the above mentioned distance "d", without points or appreciable zones of shadow. The boards (1) are equipped with interlocking sections (11) (12) on both edges which are used as a guide for centring for the side connection of successive boards (1), as in a jigsaw puzzle, and the formation of a lighting panel (4) having a larger surface.

Abstract translation: 该装置包括容纳大量与印刷电路（3）的轨道电连接的LED（2）的板（1），根据等边三角形分布布置在板（1）中并以固定的方式彼此分离 距离“a”，这些发光二极管投射光束从板的一定距离“d”交织，在上述距离“d”处给设备提供均匀质量的光，没有点或明显的阴影区域。 板（1）在两个边缘上配备有互锁部分（11）（12），其用作对于连续板（1）的侧连接的定心的引导件，如在拼图中，并且形成照明 面板（4）具有较大的表面。

公开(公告)号：WO2007079121A3

公开(公告)日：2007-10-04

申请号：PCT/US2006049378

申请日：2006-12-27

Applicant: SANDISK CORP ,  TOSHIBA KK ,  HIGASHITANI MASAAKI ,  CHIU CHIN-TIEN ,  YU CHEEMEN ,  TAKIAR HEM ,  CHIEN JACK CHANG ,  TSAI MENG-JU

Inventor： HIGASHITANI MASAAKI ,  CHIU CHIN-TIEN ,  YU CHEEMEN ,  TAKIAR HEM ,  CHIEN JACK CHANG ,  TSAI MENG-JU

IPC: H01L25/10 ,  H01L23/498 ,  H05K1/14 ,  H05K3/00 ,  H05K3/40

CPC classification number: H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/142 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/1053 ,  H05K2201/10727 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages (160a, 160b) are batch processed on a substrate panel (100). The panel includes a plurality of through-holes (120) drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line (162) between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads (170). After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract translation: 公开了一种电子部件，其包括以并排配置焊接在一起的多个半导体封装。 包装（160a，160b）在衬底面板（100）上被批量处理。 面板包括穿过面板钻出的多个通孔（120），随后填充有诸如铜或金的金属。 这些填充的通孔沿相邻封装之间的切割线（162）位于相邻封装之间，使得在分割时，填充的通孔被切割，并且填充的通孔的一部分在单个封装的侧边缘处露出。 填充的通孔的这些暴露部分形成垂直表面贴装技术（SMT）焊盘（170）。 在半导体封装被单个化并且SMT焊盘限定在侧边缘中之后，使用SMT来将第一半导体封装的SMT焊盘焊接到第二半导体封装的相应SMT焊盘，以将两个封装结合和电耦合在一起 逐侧。