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    大型部品実装構造及び大型部品実装方法
    103.
    发明专利
    大型部品実装構造及び大型部品実装方法 有权

    公开(公告)号：JPWO2015071969A1

    公开(公告)日：2017-03-09

    申请号：JP2015547316

    申请日：2013-11-13

    Applicant: 富士機械製造株式会社

    Inventor： 芝芳 戸谷 ,  芝芳 戸谷

    IPC: H05K3/34

    CPC classification number: H05K3/3478 ,  H05K3/3484 ,  H05K2201/10371 ,  H05K2201/10984

    Abstract: 基板(12)の実装面に大型部品であるシールド部品(11)を半田付けする場合に、まず、基板の実装面のうちのシールド部品を半田付けするランド(13)に半田ペーストを印刷して半田印刷部(14)を形成すると共に、シールド部品のうちの基板の半田印刷部に接合される凸状部(15)を転写槽内の液状又はペースト状の半田に浸して当該凸状部の下端面に半田転写部(17)を形成する。この後、シールド部品の半田転写部を基板の半田印刷部に重ね合わせるように位置合わせして該シールド部品を該基板に搭載する。この後、シールド部品が搭載された基板をリフロー装置内に搬入して半田転写部及び半田印刷部を加熱して該シールド部品を該基板にリフロー半田付けする。

    Coreless package substrate, and method of manufacturing the same
    106.
    发明专利
    Coreless package substrate, and method of manufacturing the same 审中-公开
    无线封装基板及其制造方法

    公开(公告)号：JP2011040702A

    公开(公告)日：2011-02-24

    申请号：JP2009263062

    申请日：2009-11-18

    Applicant: Kinko Denshi Kofun Yugenkoshi ,  欣興電子股▲分▼有限公司

    Inventor： HSU SHIH-PING

    IPC: H01L23/12 ,  H05K3/24 ,  H05K3/46

    CPC classification number: H05K3/4007 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/3473 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10984 ,  Y10T29/49147 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a coreless package substrate capable of having electric contact bumps with better uniformity in superfine pitch and altitude, and to provide a method of manufacturing the same. SOLUTION: The coreless package substrate includes a substrate body 2 constituted of an auxiliary dielectric layer 24 having a first surface 24a and a second surface 24b which are opposed to each other, an inner layer circuit 26 provided to the second surface, and a build-up structure provided to the second surface and inner layer circuit; and a plurality of electric contact bumps 25 each constituted of a metal column 252 having a first end 252a and a second end 252b which are opposed to each other and a solder layer 251 provided to the first end, wherein the second end of the metal column is positioned at the auxiliary dielectric layer and electrically connected to the inner layer circuit 26, and the first end of the metallic column and the solder layer protrude from the first surface of the auxiliary dielectric layer. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够在超细间距和高度上具有更好的均匀性的电接触凸块的无芯封装基板，并提供其制造方法。 无芯封装基板包括由辅助介电层24构成的基板主体2，该辅助介电层24具有彼此相对的第一表面24a和第二表面24b，设置在第二表面的内层电路26，以及 提供给第二表面和内层电路的积聚结构; 以及多个电接触凸块25，每个电接触凸块25由具有彼此相对的第一端252a和第二端252b的金属柱252和设置在第一端的焊料层251构成，其中金属柱的第二端 位于辅助电介质层并电连接到内层电路26，并且金属柱和焊料层的第一端从辅助介电层的第一表面突出。 版权所有（C）2011，JPO＆INPIT

    Component having mechanical contact and method of manufacturing the same
    109.
    发明专利
    Component having mechanical contact and method of manufacturing the same 审中-公开
    具有机械接触的部件及其制造方法

    公开(公告)号：JP2010050461A

    公开(公告)日：2010-03-04

    申请号：JP2009192804

    申请日：2009-08-24

    Applicant: Robert Bosch Gmbh ,  ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh

    Inventor： KUNERT PETER

    IPC: H05K7/12 ,  H01R12/04 ,  H01R12/32 ,  H01R43/00

    CPC classification number: H05K3/308 ,  H05K3/305 ,  H05K2201/10151 ,  H05K2201/1059 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/1163

    Abstract: PROBLEM TO BE SOLVED: To provide a component having a contact capable of joining a holding body with a high holding force, and to provide a method of manufacturing the component.
    SOLUTION: A component 1 is provided with a mechanical contact 4 that joins the component 1 to a holding body 3, especially, to a printed circuit board. A coated part 6 made of an adhesive material is formed on the contact 4. The adhesive material contains an encapsulated adhesive. A method of manufacturing the component is provided for joining the component to the holding body, especially, to the printed wiring board, and a mechanical contact is provided on the component for joining the component to the holding body. The coated part 6, constituted by the adhesive material, is attached to the contact, and the adhesive material contains an encapsulated adhesive.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有能够以高保持力接合保持体的接触部件，并提供制造该部件的方法。 解决方案：组件1设置有机械接触件4，其将部件1连接到保持体3，特别是连接到印刷电路板。 在接触件4上形成由粘合剂材料制成的涂覆部分6.粘合剂材料包含胶粘剂。 提供了一种制造该部件的方法，用于将部件连接到保持体，特别是与印刷线路板接合，并且在用于将部件接合到保持体的部件上设置有机械接触。 由粘合剂材料构成的涂布部分6附着到触点上，并且粘合剂材料包含胶粘剂。 版权所有（C）2010，JPO＆INPIT

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