HEAT-RESISTANT ADHESIVE AND METHOD OF BONDING THEREWITH

    公开(公告)号:JPH05112768A

    公开(公告)日:1993-05-07

    申请号:JP9669292

    申请日:1992-04-16

    Abstract: PURPOSE:To obtain the title adhesive capable of bonding at low temperatures and low pressure and excellent in adhesiveness by incorporating a polyamic acid and/or a polyimide each terminated with a specified compound and comprising specified repeating units. CONSTITUTION:The title adhesive comprises a polyamic acid and/or a polyimide each terminated with an aromatic dicarboxylic acid anhydride of formula I (wherein Z is a bivalent group selected from among monocyclic and fused polycyclic aromatic groups and nonfused polycyclic aromatic groups consisting of aromatic groups bonded to each other directly or through bridging members and comprising repeating units of formula II [wherein Y is a group of formula III or IV (wherein X is a direct bond, -CO- or -O-)].

    POLYAMIDE RESIN AND ITS RESIN COMPOSITION

    公开(公告)号:JPH0578476A

    公开(公告)日:1993-03-30

    申请号:JP2920892

    申请日:1992-02-17

    Abstract: PURPOSE:To obtain a melt-moldable polyamide resin having excellent heat- resistance and thermal stability by carrying out the polycondensation reaction of a specific diamine and an aromatic dicarboxylic acid in the presence of a dehydrohalogenation agent in an organic solvent. CONSTITUTION:The objective aromatic polyamide resin of formula II (X is halogen; Z is condensed polycyclic aromatic group; (n) is 1-1,000) is produced by the polycondensation of (A) 1,3-bis(4-aminophenoxy)-5-halogenobenzene and/or 1,3-bis(3-aminophenoxy)-5-halogenobenzene of formula I and (B) an aromatic dicarboxylic acid dihalide such as aromatic dicarboxylic acid dichloride in the presence of (C) a dehydrohalogenation agent such as trimethylamine in an organic solvent such as N,N-dimethylformamide at

    SOLUTION FOR TREATING POLYIMIDE RESIN COMPOSITION AND METHOD FOR TREATING THE SAME

    公开(公告)号:JPH059316A

    公开(公告)日:1993-01-19

    申请号:JP16424491

    申请日:1991-07-04

    Abstract: PURPOSE:To readily carry out surface treatment at a low cost and remarkably improve adhesion by dipping a specific polyimide resin composition in a treating solution of a specific composition. CONSTITUTION:A polyimide resin composition containing a polyimide resin having recurring units expressed by the formula is dipped in a treating solution composed of 1.5-9.0 pts.wt. alcohol such as methanol, ethanol, propanol, butanol, pentanol and/or hexanol, 0.3-1.5 pts.wt. inorganic base such as sodium hydroxide, potassium hydroxide, lithium hydroxide, magnesium hydroxide, calcium hydroxide and/or barium hydroxide and 0.05-1.0 pt.wt. organic base such as hydrazine hydrate, ethylenediamine, propylenediamine and/or hexamethylenediamine based on 1 pt.wt. water. Thereby, surface treatment is readily carried out.

    POLYIMIDE OF GOOD MOLDABILITY AND ITS PRODUCTION

    公开(公告)号:JPH04331231A

    公开(公告)日:1992-11-19

    申请号:JP12378291

    申请日:1991-05-28

    Abstract: PURPOSE:To obtain a melt-moldable polyimide having excellent heat and chemical resistances and good transparency by reacting a specified diamine with a specified tetracarboxylic acid dianhydride in the presence of phthalic anhydride. CONSTITUTION:A diamine component comprising a diamine of formula I (wherein (n) is 1 or 2) or a mixture thereof is reacted with a tetracarboxylic acid dianhydride component comprising 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride or 4,4'-(p-phenylenedioxy)diphthalic dianhydride in the presence of phthalic anhydride to produce a polyamic acid having 0.001-1.0mol, per mol of the diamine component, of phthalic anhydride. The obtained polyamic acid is thermally or chemically imidized to obtain a polyimide comprising repeating structural units of formula III (wherein X is a tetravalent group of formula IV or V; and (n) is 1 or 2) and terminated with a bivalent aromatic group derived from phthalic anhydride of formula II.

    POLYAMIDE RESIN AND RESIN COMPOSITION CONTAINING THE SAME

    公开(公告)号:JPH04331228A

    公开(公告)日:1992-11-19

    申请号:JP41556190

    申请日:1990-12-28

    Abstract: PURPOSE:To obtain an aromatic polyamide excellent in heat resistance, processability and low water absorptivity by polycondensing a specified aromatic diamine with an aromatic dicarboxylic acid in an organic solvent, and to obtain a resin composition improved in mechanical strengths and dimensional stability by mixing the aromatic polyamide with a fibrous reinforcement. CONSTITUTION:2,2-Bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluorop ropane of formula II and/or 2,2-bis[4-(3aminophenoxy)phenyl]-1,1,1,3,3,3- hexafluoropropane of formula II are polycondensed with an aromatic dicarboxylic acid dihalide at 60 deg.C or below in an organic solvent in the presence of a dehydrohalogenating agent to give an aromatic polyamide represented by formula I (wherein X is a condensed polycyclic aromatic group or the like; and (n) is an integer of 1-1000).

    AROMATIC POLYAMIDE
    117.
    发明专利

    公开(公告)号:JPH0331323A

    公开(公告)日:1991-02-12

    申请号:JP16365789

    申请日:1989-06-28

    Abstract: PURPOSE:To obtain the subject new melt moldable polyamide, expressed by specific recurring units, excellent in heat resistance and processability with low water absorptivity and useful as a substrate for space aircraft, equipment and materials for electrical and electronic parts, raw material for heat-resistant fiber, etc. CONSTITUTION:The objective polyamide expressed by formula I (the positions of the two carbonyl groups are the o-, m- or p-positions of the benzene nuclei; n is 1-1000). Furthermore, the aforementioned polyamide is produced by polymerizing bis[4-{4-(4-aminophenoxy)phenoxy}phenyl]sulfone expressed by formula II with a benzenedicarboxylic acid, such as isophthalic acid, a benzenedicarbonyl chloride, such as terephthaloyl dichloride, and a benzenedicarboxylic acid derivative, such as dimethyl terephthalate, in a solvent.

    PRODUCTION OF POLYIMIDE OF GOOD HEAT STABILITY

    公开(公告)号:JPH02199124A

    公开(公告)日:1990-08-07

    申请号:JP1624789

    申请日:1989-01-27

    Abstract: PURPOSE:To obtain the title polyimide which is excellent in mechanical, thermal and electrical properties, etc., and free from lowering in moldability when kept at high temperatures for a long time by reacting bis(3-aminophenyl) sulfone with a tetracarboxylic acid dianhydride under specified conditions. CONSTITUTION:The title polyimide having a basic skeleton comprising repeating units of formula II is obtained by thermally or chemically imidating a polyamic acid obtained by reacting a tetracarboxylic acid dianhydride of formula I [wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, a cyclic cycloaliphatic group, a monocyclic aromatic group and a condensed polycyclic aromatic group) with 0.9-1.0mol, per mol or the dianhydride, of bis(3-aminophenyl) sulfone in the presence of 0.001-1.0mol, per mol of the dianhydride, of an aromatic monoamine of the formula Z-NH2 [wherein Z is a monocyclic aromatic group or a (non)condensed polycyclic aromatic group] (e.g. aniline).

    PRODUCTION OF POLYIMIDE HAVING GOOD THERMAL STABILITY

    公开(公告)号:JPH02178329A

    公开(公告)日:1990-07-11

    申请号:JP33465788

    申请日:1988-12-28

    Abstract: PURPOSE:To provide the subject polymer having good thermal stability and excellent moldability as well as the essential excellent characteristics by condensing a specific aromatic diamine comprising a diaminobenzophenone with a tetracarboxylic acid dianhydride under a specified condition. CONSTITUTION:An aromatic diamine comprising 3,3'-diaminobenzophenone of formula I is condensed with a tetracarboxylic acid dianhydride (e.g. ethylenetetracarboxylic acid dianhydride) of formula II (R is a tetravalent group selected from >=2C aliphatic groups, monocyclic aromatic groups, etc.) in a ratio of 0.9-1mol of the compound of formula I per mol of the compound of formula II in the presence of an aromatic monoamine (e.g. aniline) of formula: Z-NH2 (Z is a monovalent group selected from monocyclic aromatic groups, condensed polycyclic aromatic groups, etc.) in an amount of 0.001-1mol per mol of the compound of formula II to provide the objective polymer having units of formula III as the basic skeleton thereof.

    PRODUCTION OF POLYIMIDE OF GOOD MOLDABILITY

    公开(公告)号:JPH02160830A

    公开(公告)日:1990-06-20

    申请号:JP31508788

    申请日:1988-12-15

    Abstract: PURPOSE:To obtain the title polyimide of improved moldability by imidating a polyamic acid obtained by reacting a specified diamine wit ha tetracarboxylic acid dianhydride in the presence of a dicarboxylic acid anhydride. CONSTITUTION:1mol of a diamine of formula I is reacted with 0.9-1.0mol of a tetracarboxylic acid anhydride of formula II (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group and a noncondensed polycyclic aromatic group bonded directly or through bridging members) at 0-250 deg.C for 4-24hr in the presence of a dicarboxylic acid anhydride of formula III (wherein Z is a bivalent group comprising a 1-10C aliphatic group and/or a cycloaliphatic group) to obtain a polyamic acid having repeating units of formula IV as basic skeletons. This polyamic acid is imidated through dehydration by heating to 100-400 deg.C or by reaction with an imidating agent to obtain a polyimide having repeating units of formula V as basic skeletons.

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