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公开(公告)号：JPH10279665A
公开(公告)日：1998-10-20
申请号：JP8299997
申请日：1997-04-01
Applicant: TORAY INDUSTRIES
Inventor： NIWA KATSUHIRO , TANAKA MASAYUKI , TOKUNAGA ATSUTO
Abstract: PROBLEM TO BE SOLVED: To obtain a composition excellent in reliability such as soldering crack resistance and peeling resistance and moldability such as molding flow, curability, mold release and inhibition of void formation by mixing an epoxy resin having an epoxy group, an aromatic ring and a C-C double bond with a curing agent and an inorganic filler and mixing the obtained mixture with a silane coupling agent having a specified structure. SOLUTION: The epoxy resin is represented by the formula (wherein hydrogen atoms bonded to the aromatic ring and to the doubly bonded carbon atoms may be substituted with monovalent organic groups). The phenolic curing agent used is exemplified by a phenol novolac resin. The silane coupling agent used is one having an organic group to which an epoxy group is bonded (e.g. γ- glycidoxypropyltrimethoxysilane) and/or one having an organic group to which an amino groups is bonded and in which all of the amino groups are secondary [e.g. γ-(N-phenylamino)propyltrimethoxysilane] and is used in an amount of 0.2-10 wt.% based on the composition.
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公开(公告)号：JPH1067918A
公开(公告)日：1998-03-10
申请号：JP16154996
申请日：1996-06-21
Applicant: TORAY INDUSTRIES
Inventor： TSUTSUMI YASUAKI , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition capable of improving soldering resistance and blackness by including an epoxy resin, a curing agent, a filler and a carbon black having an average particle diameter bellow a specific value. SOLUTION: This resin composition comprises (A) an epoxy resin, preferably containing a compound of the formula (R1 to R8 are each H, a 1-4C alkyl or a halogen), (B) a hardener, (C) a filler and (D) a carbon black having
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公开(公告)号：JPH101531A
公开(公告)日：1998-01-06
申请号：JP15646696
申请日：1996-06-18
Applicant: TORAY INDUSTRIES
Inventor： TSUTSUMI YASUAKI , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which is excellent in adhesive strength, resistance to soldering heat, etc., and suitable for sealing a semiconductor device by compounding an epoxy resin, a hardener, a filler, and a carbon black having a specified pH. SOLUTION: This compsn. contains an epoxy resin (e.g. a bisphenol A epoxy resin), a hardener e.g. a phenol novolak resin), a filler (e.g. calcium carbonate), and a carbon black having a pH of 7 or lower. The carbon black can be produced from acetylene, rosin, natural gas, coal, petroleum, vegetable oils, animal oils, etc., by, e.g. the furnace, thermal, or acetylene method and pref. has a pH of 6.5 or lower. The pH of carbon black is measured by adding 10g of carbon black to 200ml of water, stirring the mixture for 1min., and measuring the resultant suspension with a glass electrode pH meter.
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公开(公告)号：JPH09241483A
公开(公告)日：1997-09-16
申请号：JP5653196
申请日：1996-03-13
Applicant: TORAY INDUSTRIES
Inventor： SHIMIZU TAKESHI , TOKUNAGA ATSUTO , TANAKA MASAYUKI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having improved fire retardancy and capable of giving an excellent molded product and a semiconductor having high heat resistance of solder and high reliability by containing an inorganic filler including a metal hydroxide. SOLUTION: This epoxy resin composition contains (A) an epoxy resin, (B) a hardener and (C) an inorganic filler, and the component C contains >=0.1wt.% of a metal hydroxide. Preferably, in the component C, the metal hydroxide is magnesium hydroxide in an amount of 0.1-25wt.% based on the component C, the component C is contained in the object composition in an amount of 85-97wt.% based on the composition and the component C contains 75-99.9wt.% of silica, and the component A contains an epoxy compound having a biphenyl skeleton as an essential component.
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公开(公告)号：JPH0971635A
公开(公告)日：1997-03-18
申请号：JP23086595
申请日：1995-09-08
Applicant: TORAY INDUSTRIES
Inventor： TANAKA MASAYUKI , TESHIBA TOSHIHIRO , MAEDA YOSHIICHI
Abstract: PROBLEM TO BE SOLVED: To obtain a resin-sealed semiconductor device which is produced by sealing the film carrier and the IC chips with an epoxy resin composition, causes no warpage of the package because of its good resin-filling properties and is excellent in soldering heat resistance and reliability. SOLUTION: This semiconductor device comprises the film carrier having device holes bored, leads set on the carrier, the IC chips connected to the leads and a cured epoxy resin composition sealing the IC chips. This resin composition contains (A) an epoxy resin comprising a resin of the skeleton of the formula (R to R are each H, a halogen, a 1-4C alkyl) as an essential component, (B) a curing agent and (C) a filler in an amount of 65-82wt.% of the total composition (for example, spherical bused silica with an average particle size of 5-30μm or
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Patent Agency Ranking
公开(公告)号：JPH08325356A
公开(公告)日：1996-12-10
申请号：JP7363996
申请日：1996-03-28
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PURPOSE: To obtain an epoxy resin for semiconductor sealing use, excellent in soldering heat resistance, reliability to moisture resistance, and fluidity, comprising an epoxy resin, a specific curing agent and a filler. CONSTITUTION: This composition comprises (A) preferably 1 to 10wt.% of an epoxy resin such as a biphenyl type epoxy resin of formula I (R to R are, each, H, a halogen or 1-4C alkyl group), (B) preferably 1 to 7wt.% of a curing agent having a skeleton of formula II ((n) is 0 to 10; M is a monovalent naphtol; N is a divalent naphtol), e.g. a compound of formula III, and (C) preferably 87 to 95wt.% of a filler containing 50wt.% or more of amorphous silica consisting of 99 to 50wt.% of spherical noncrystalline silica having an average particle diameter of 5μm but not exceeding 30μm and 1 to 50wt.%, of spherical noncrystalline silica having an average particle diameter of 3μm or less. The acid index of this composition is 42% or more.
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公开(公告)号：JPH08245753A
公开(公告)日：1996-09-24
申请号：JP339396
申请日：1996-01-11
Applicant: TORAY INDUSTRIES
Inventor： TSURUMI YUMIKO , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PURPOSE: To obtain the subject composition, excellent in not only heat resistance but also flame retardance and high reliability and useful for semiconductor devices by blending a curing agent having a specific structure and increasing the amount of a filter and reducing the amount converted of a Br compound or an Sb compound. CONSTITUTION: This resin composition consists essentially of (A) an epoxy resin, (B) a curing agent containing a compound simultaneously having structures of formulas I to III (R is H or a 1-4C alkyl) and (C) a filler in an amount of 87-95wt.% based on the whole composition. The respective amounts of a Br compound and an Sb compound are to R are each H, a halogen or a 1-4C alkyl) as an essential component and the component (C) preferably contains >=50wt.% amorphous silica comprising 99-50wt.% spherical amorphous silica having 5-30μm average grain diameter and l-50wt.% spherical amorphous silica having
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公开(公告)号：JPH07242799A
公开(公告)日：1995-09-19
申请号：JP22306294
申请日：1994-09-19
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA TAIJI , KAYABA KEIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain an epoxy resin compsn. for semiconductor sealing which has excellent reliability (soldering-heat resistance, moisture resistance, etc.) and moldability (high-temp. hardness, burr-preventing properties, etc.) in a good balance by compounding a biphenyl epoxy resin as the base resin with an aminosilane coupling agent together with a curative, a filler, etc. CONSTITUTION:The title compsn. contains 5-25wt.% epoxy resin having a backbone of the formula (wherein R to R are each H, 1-4C alkyl, or halogen) as the essential component, 2-15wt.% curative (e.g. a phenol novolac resin), 75-90wt.% filler comprising 40-90wt.% crushed fused silica having an average particle size of 12mum or lower and 10-60wt.% spherical fused silica having an average particle size of 40mum or lower, and an aminosilane compd. as a coupling agent in an amt. of 0.3-1.5wt.% of the filler. The compsn. may further contain a cure catalyst.
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公开(公告)号：JPH07188393A
公开(公告)日：1995-07-25
申请号：JP33544993
申请日：1993-12-28
Applicant: TORAY INDUSTRIES
Inventor： KAJI YOSHIO , SAWAMURA TAIJI , TANAKA MASAYUKI
Abstract: PURPOSE:To obtain an epoxy resin composition having excellent soldering heat-resistance and flexural strength by adding a specific hardener to an epoxy resin mixed with a large amount of a filler. CONSTITUTION:This epoxy resin composition contains (A) an epoxy resin, (B) a hardener containing a phenolic compound having the skeleton of formula (R is H, an alkyl, phenyl, benzyl or cyclohexyl) as an essential component and (C) 80-95wt.% of a filler. The composition can prevent the generation of interlaminar peeling between a large-sized chip and the resin and suppress the generation of crack.
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公开(公告)号：JPH0733429B2
公开(公告)日：1995-04-12
申请号：JP7088791
申请日：1991-04-03
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , KAYABA KEIJI , TANAKA MASAYUKI
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