公开(公告)号：US20110114372A1

公开(公告)日：2011-05-19

申请号：US12904334

申请日：2010-10-14

Applicant: Hisashi KATO ,  Ryo AOKI

Inventor： Hisashi KATO ,  Ryo AOKI

IPC: H05K1/03

CPC classification number: H05K1/115 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4602 ,  H05K2201/0112 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0315

Abstract: A printed wiring board has an insulation layer having upper and lower surfaces, an upper-surface circuit formed on the upper surface of the insulation layer, a resin insulation layer formed on the upper surface of the insulation layer and the upper-surface circuit and having a via-conductor opening through the resin insulation layer, a conductive circuit formed on the resin insulation layer, and a via conductor formed in the opening. The resin insulation layer has first and second surfaces. The second surface of the resin insulation layer faces the upper surface of the insulation layer. The conductive circuit is formed on the first surface of the resin insulation layer. The via conductor is connecting the conductive circuit and the upper-surface circuit. The opening has an inner wall which has a diameter decreasing from the second surface of the resin insulation layer toward the first surface of the resin insulation layer.

Abstract translation: 印刷电路板具有具有上表面和下表面的绝缘层，形成在绝缘层的上表面上的上表面电路，形成在绝缘层的上表面上的树脂绝缘层和上表面电路，并且具有 通过树脂绝缘层的通路导体开口，形成在树脂绝缘层上的导电电路和形成在开口中的通孔导体。 树脂绝缘层具有第一表面和第二表面。 树脂绝缘层的第二表面面向绝缘层的上表面。 导电电路形成在树脂绝缘层的第一表面上。 通孔导体连接导电电路和上表面电路。 该开口具有从树脂绝缘层的第二表面向树脂绝缘层的第一表面减小直径的内壁。

公开(公告)号：US20110003914A1

公开(公告)日：2011-01-06

申请号：US12676943

申请日：2009-01-30

Applicant: Reona Yokota ,  Koichi Shibayama ,  Kazuyoshi Shiomi ,  Hiroshi Kouyanagi

Inventor： Reona Yokota ,  Koichi Shibayama ,  Kazuyoshi Shiomi ,  Hiroshi Kouyanagi

IPC: C08K5/07 ,  C08K5/101

CPC classification number: H05K1/0373 ,  C08K3/36 ,  C08K5/132 ,  C08K5/315 ,  C08L63/00 ,  H05K3/0032 ,  H05K3/4676 ,  H05K2201/0112 ,  H05K2201/0209

Abstract: A resin composition is provided which allows improvement of the ultraviolet laser processability of the resin and can be not only used as an electronic material for an insulating film of a build-up board and the like but also used to form a circuit board whose electrical insulating property does not deteriorate. A multilayer resin film employing the resin composition is provided. A resin composition is provided which contains a thermosetting resin (A), a curing agent (B), a silica (C), an ultraviolet absorber (D), and a solvent (E) and in which: the content of the ultraviolet absorber (D) is from 0.5 to 50 parts by weight per the total amount of the thermosetting resin (A), the curing agent (B), and the ultraviolet absorber (D); and the blending amount of the solvent (E) is from 20 to 500 parts by weight per 100 parts by weight of the total amount of the thermosetting resin (A) and the curing agent (B). A multilayer resin film is provided in which the resin composition is laminated on a base material so as to be in a sheet shape and in which: the sheet-shaped resin composition on the base material is dried; and the content of the solvent is from 0.01 to 5 parts by weight with respect to the entire resin composition.

Abstract translation: 提供了树脂组合物，其可以提高树脂的紫外线激光加工性，并且不仅可以用作积层板等的绝缘膜的电子材料，而且还可以用于形成电绝缘的电路板 财产不会恶化。 提供了使用该树脂组合物的多层树脂膜。 提供了含有热固性树脂（A），固化剂（B），二氧化硅（C），紫外线吸收剂（D）和溶剂（E））的树脂组合物，其中：紫外线吸收剂 （D）相对于热固性树脂（A），固化剂（B）和紫外线吸收剂（D）的总量为0.5〜50重量份。 溶剂（E）的配合量相对于100重量份热固性树脂（A）和固化剂（B）的总量为20〜500重量份。 提供一种多层树脂膜，其中树脂组合物层压在基材上以成为片状，并且其中基材上的片状树脂组合物被干燥; 相对于整个树脂组合物，溶剂的含量为0.01〜5重量份。

公开(公告)号：US07655348B2

公开(公告)日：2010-02-02

申请号：US11055971

申请日：2005-02-14

Applicant: Tetsuo Nanno ,  Tsunenori Yoshida

Inventor： Tetsuo Nanno ,  Tsunenori Yoshida

IPC: H01M10/48 ,  H01M2/00 ,  H01M2/02

CPC classification number: H01M10/0436 ,  H01M2/30 ,  H01M10/4257 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/0112 ,  H05K2201/10636 ,  H05K2201/10909 ,  H05K2203/168 ,  Y02P70/611 ,  Y02P70/613

Abstract: In order to enhance versatility, a chip-type battery having a means for readily identifying a first terminal and a second terminal is provided. The chip-type battery includes: a body having a substantially rectangular parallelepiped shape and contains a plurality of power generating elements in a stack, each element including a sintered material; a first terminal having a first polarity; and a second terminal having a second polarity. The first terminal is provided at a first side face of the body. The second terminal is provided at a second side face of the body located on other than the first side face. The first terminal and the second terminal include different metal materials.

Abstract translation: 为了提高多功能性，提供了具有用于容易地识别第一端子和第二端子的装置的芯片型电池。 芯片型电池包括：具有大致长方体形状并且在堆叠中包含多个发电元件的主体，每个元件包括烧结材料; 具有第一极性的第一端子; 以及具有第二极性的第二端子。 第一端子设置在主体的第一侧面。 第二端子设置在位于除了第一侧面之外的主体的第二侧面。 第一端子和第二端子包括不同的金属材料。

公开(公告)号：US20100009173A1

公开(公告)日：2010-01-14

申请号：US12169212

申请日：2008-07-08

Applicant: YUEH-LING LEE ,  Shane Fang

Inventor： YUEH-LING LEE ,  Shane Fang

IPC: B32B27/08 ,  H05K3/00 ,  B05D3/10 ,  C08J7/18

CPC classification number: B32B27/08 ,  B32B5/147 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/302 ,  B32B27/308 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/206 ,  B32B2307/714 ,  B32B2457/00 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/184 ,  H05K3/185 ,  H05K2201/0112 ,  H05K2201/0236 ,  H05K2203/107 ,  Y10T29/49156 ,  Y10T428/26 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31942

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

Abstract translation: 本发明涉及通过激光（或类似能量束）消融的非平版印刷图案，其中消融系统最终导致电路特征相对没有碎片诱导的过度电镀缺陷（与消融过程有关的碎片） 并且完全添加电镀引起的过度镀覆缺陷。 本发明的组合物包括具有绝缘基板和覆盖层的电路板前体。 绝缘基板由介电材料制成，也可由金属氧化物可活化填料制成。 覆盖层可以是牺牲的或非牺牲的，并且用于修复由消融过程产生的不想要的碎屑。

公开(公告)号：US20080230512A1

公开(公告)日：2008-09-25

申请号：US12110466

申请日：2008-04-28

Applicant: Kunio Arai ,  Haruo Akahoshi

Inventor： Kunio Arai ,  Haruo Akahoshi

IPC: H01B13/00

CPC classification number: H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

Abstract: The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board.There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

Abstract translation: 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US20080158472A1

公开(公告)日：2008-07-03

申请号：US11949201

申请日：2007-12-03

Applicant: Jaemo Chung ,  Jinhee Sung ,  Sunghwan Kim

Inventor： Jaemo Chung ,  Jinhee Sung ,  Sunghwan Kim

IPC: G02F1/1333

CPC classification number: H05K1/028 ,  G02F1/13452 ,  G02F2201/50 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/281 ,  H05K2201/0112 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/10106 ,  H05K2201/10136

Abstract: A flexible circuit board of a liquid crystal display includes a first insulating film having an ink layer, one or more conductive patterns formed on the first insulating film, a second insulating film formed on the first insulating film and covering the one or more conductive patterns, at least one light source which is electrically coupled to the one or more conductive patterns, and a light absorbing layer formed on the outer circumference of the light source to absorb light from the light source.

Abstract translation: 液晶显示器的柔性电路板包括具有油墨层的第一绝缘膜，形成在第一绝缘膜上的一个或多个导电图案，形成在第一绝缘膜上并覆盖一个或多个导电图案的第二绝缘膜， 电耦合到所述一个或多个导电图案的至少一个光源和形成在所述光源的外周上以吸收来自所述光源的光的光吸收层。

公开(公告)号：US20080054227A1

公开(公告)日：2008-03-06

申请号：US11734988

申请日：2007-04-13

Applicant: Demetrius McCormick ,  James Nowicki ,  Chih-Min Cheng ,  Wanda O'Hara

Inventor： Demetrius McCormick ,  James Nowicki ,  Chih-Min Cheng ,  Wanda O'Hara

IPC: H01B1/02 ,  H01B1/06

CPC classification number: H05K3/321 ,  B82Y30/00 ,  H01B1/20 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29424 ,  H01L2224/29447 ,  H01L2224/29488 ,  H01L2224/83868 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/323 ,  H05K2201/0112 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

Abstract translation: 一种快速固化组合物，其包含聚合物树脂，导电填料和一种或多种近红外吸收添加剂和任选的除氧剂或腐蚀抑制剂或二者，以及其它添加剂如反应性或非反应性稀释剂，惰性填料和粘合促进剂。 组合物可以是导电的，电阻的或各向异性的导电的。 在另一个实施方案中，本发明是通过将组合物暴露于近红外能量源来改善组合物的固化速度的方法。

公开(公告)号：US20070257274A1

公开(公告)日：2007-11-08

申请号：US11563275

申请日：2006-11-27

Applicant: Robert Martter ,  Craig Sundberg ,  Richard Giardina ,  Brian Fetscher ,  G. Deutschlander

Inventor： Robert Martter ,  Craig Sundberg ,  Richard Giardina ,  Brian Fetscher ,  G. Deutschlander

IPC: H01L33/00

CPC classification number: H05K1/0203 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H05K1/053 ,  H05K1/092 ,  H05K1/167 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/0112 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.

Abstract translation: 一种具有发光二极管（LED）的照明装置。 该装置包括具有表面的金属基板。 电介质涂层重叠在金属基板的表面上。 发光二极管（LED）被支撑在电介质涂层上。 金属基板用作在操作期间由LED发射的热量的散热器。

公开(公告)号：US07037597B2

公开(公告)日：2006-05-02

申请号：US10841080

申请日：2004-05-07

Applicant: Masato Takami

Inventor： Masato Takami

IPC: H05K3/00 ,  B32B15/20 ,  B32B15/18

CPC classification number: C23C30/00 ,  H05K3/0038 ,  H05K3/384 ,  H05K2201/0112 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/12917

Abstract: It is an object of the present invention to provide a surface-treated copper foil wherein a surface layer which is situated on a side being not bonded to a resin in a copper foil for a printed-wiring board and on which a copper direct drilling process by carbon dioxide laser is easily applied is prepared with a small amount of a covering material in accordance with a simple manner.In the copper foil used for a direct drilling process by laser of the present invention, 50 to 1000 mg/m2 of a covering layer consisting of iron and tin, or a covering layer made of an alloy prepared from iron, tin, and at least one member selected from the group consisting of nickel, cobalt, zinc, chromium, and phosphorous is provided on at least one side of the copper foil.

Abstract translation: 本发明的目的是提供一种表面处理铜箔，其中位于不与印刷电路板的铜箔中的树脂结合的一侧的表面层，并且在其上进行铜直接钻孔工艺 通过二氧化碳激光容易地涂敷，按照简单的方式用少量的覆盖材料制备。 在用于通过本发明的激光的直接钻孔工艺的铜箔中，由铁和锡组成的覆盖层或由制备的合金制成的覆盖层50至1000mg / m 2 从铜，锡和至少一种选自镍，钴，锌，铬和磷的成分提供在铜箔的至少一面上。

公开(公告)号：US20040148766A1

公开(公告)日：2004-08-05

申请号：US10758371

申请日：2004-01-15

Inventor： Jinichi Noguchi ,  Shukichi Takii ,  Satoshi Ootsuki ,  Hiroyuki Makino ,  Susumu Sakuragi ,  Masaru Tanaka ,  Toshio Komiyatani ,  Iji Onozuka

IPC: H05K003/00 ,  H05K003/36

CPC classification number: H05K3/4655 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: The present invention provides the miniaturization and weight reduction of the multi-layer circuit board and improvement in the processability thereof. The multi-layer circuit board comprises a substrate 10, on at least one surface of a substrate 10, a first electrical conductive circuit (metal plating film 30) disposed on the substrate 10, an resin layer 20 disposed on the first electrical conductive circuit and a second electrical conductive circuit (metal plating film 30) disposed on the resin layer. The resin layer 20 is composed of a resin compound including benzocyclobutene resin, particulate inorganic filler and ultraviolet absorbent.

Abstract translation: 本发明提供了多层电路板的小型化和重量减轻以及其加工性能的提高。 多层电路板包括基板10，基板10的至少一个表面，设置在基板10上的第一导电电路（金属镀膜30），设置在第一导电电路上的树脂层20和 设置在树脂层上的第二导电电路（金属镀膜30）。 树脂层20由包括苯并环丁烯树脂，颗粒无机填料和紫外线吸收剂的树脂化合物构成。